SAW FILTER
HDFB08ARSS-B5
1. Application
●
Low-loss RF filter for mobile telephone GSM900 systems, receive path(RX).
●
Usable passband 35MHz
●
Impedance 50 ohm input and output
●
Unbalanced to unbalanced operation
●
RoHS compatible
2. DIMENSION
(PKG SIZE 1.1 x 0.9mm)
3. Maximum Rating
Items
Operation temperature rang
Storage temperature rang
ESD voltage
Sensitive discharge device
DC Voltage VDC
Max Input Power
Moisture Sensitivity Level
Conditions
-30℃ ~ +85℃
-40℃ ~ +85℃
ESD(MM) : 50VDC
ESD(HBM) : 175VDC
3V (25+/-2 deg.C)
15dBm 2000h
MSL 2
4. Test Circuit
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 3 of 8
SAW FILTER
HDFB08ARSS-B5
5. ELECTRICAL SPECIFICATION
Table1. Electrical Specification
Temperature range for specification: T = -20~+80℃
Terminating source impedance:
Zs = 50Ω
Terminating load impedance:
Zl = 50Ω
Input power:
15dBm 2000h
Item
Condition
Specification
(MHz)
Min
Typ
Max
Insertion loss
927.4~957.6
-
1.5
2.0
925~960
-
1.8
2.5
Amplitude Ripple
925~960
-
0.8
1.8
VSWR
Input
925~960
-
1.7
2.1
Output
-
1.7
2.1
Absolute attenuation 45
40
60
-
835~870
38
40
-
880~915
35
45
-
902.5~910
37
40
-
1805~1875
39
52
-
1850~1920
38
50
-
2400~2500
35
40
-
2685~2790
31
35
-
2775~2880
31
35
-
3700~3840
30
35
-
4625~4800
28
33
-
5550~5760
28
33
-
5725~5875
28
33
-
Unit
dB
dB
dB
-
-
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
6. Typical frequency response
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 4 of 8
SAW FILTER
HDFB08ARSS-B5
7. ENVIRONMENTAL CHARACTERISTICS
7.1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 5.
7.2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 5.
7.3 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 5.
7.4 Resistance to solder heat
1、immerge the solder bath at 260℃ for 10 sec.
2、the iron at 370℃ for 3 sec
7.5 Solderability
Submerge the device terminals into the solder bath at 245℃
±5℃
for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in 5.
7.6 Reflow soldering
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 5 of 8
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