3.0*1.5*0.9mm SMD CHIP LED
E6C1206RGBC3UDA
Features:
●Long operating life
●Low Power Consumption
●Wide Viewing Angle
●Low voltage DC operated
●RoHS Compliant
Application:
●Backlight
●Decoration lighting
●motormeter
●Indicator
Part Number
E6C1206RGBC3UDA
Dice Material
AlGaInP
-InGaN-InGaN
Emitted Color
Red-Green-Blue
Lens Color
Water Clear or Diffused
Electro-Optical Characteristics
(Ta=25℃, @20mA)
Parameter
Luminous Intensity
Color
■
■
■
■
■
■
■
■
■
■
■
■
-
-
Symbol
IV
Min.
70
400
70
-
-
-
1.90
2.90
2.90
617
517
460
-
-
Typ.
-
-
-
20
35
25
2.00
3.00
3.00
620
520
465
120
-
Max.
150
800
150
-
-
-
2.40
3.40
3.40
626
530
472
-
10
Unit
mcd
Radiation Bandwidth
△λ
nm
Forward Voltage
VF
v
Dominant Wavelength
Viewing Angle
Reverse Current
λd
2θ1/2
IR
nm
deg
uA
Absolute Maximum Ratings
(Ta=25℃)
Parameter
Peak Forward Current(1/10 Duty Cycle, 0.1ms Pulse Width)
Forward Current
Reverse Voltage
Electrostatic Discharge
Operating Temperature Range
Storage Temperature Range
Reflow Soldering
www.ekingluxs.com
1
Symbol
IPF
IF
VR
ESD
Topr
Tstg
Tsld
Max.
Unit
100
mA
30
mA
5
v
2000
v
o
-40to+90
C
o
-40to+90
C
260℃for 10secs
sales@ekingluxs.com
3.0*1.5*0.9mm SMD CHIP LED
E6C1206RGBC3UDA
Optical & Electrical Characteristics
100
75
50
25
0
Spectrum Distribution
Relative Luminous lntensity(%)
400
450
500
550
Wavelength (nm)
600
650
700
Forward Current vs.Forward Voltage
Forward Current vs.Ambient Temperature
50
Forward Current (mA)
Forward Current (mA)
50
40
30
20
10
0 0
20
40
60
80
100
40
30
20
10
0
1.6
2.0
2.4
2.8
3.2
3.6
Forward Voltage (V )-volts
Relative Luminous lntensity vs.Forward Currenr
Ambient Temperature
2.5
Relative Luminous lntensity
20° 10° 0°
30°
2.0
1.5
1.0
0.5
0
0
10
20
30
40
50
40°
50°
60°
70°
80°
90°
0.6 0.4 0.2
1.0
0.9
0.8
0.7
0
0.1 0.3 0.5
Forward Currenr(mA)
Radiation Diagram
www.ekingluxs.com
2
sales@ekingluxs.com
3.0*1.5*0.9mm SMD CHIP LED
E6C1206RGBC3UDA
Reliability Test Items And Conditions
Test Items
Thermal Shock
Temperature And Humidity
Cyclic
High Temperature Storage
Low Temperature Storage
High Temperature High
Humidity Storage
High Temperature Life Test
Life Test
Resistance to Sodering
Heat
Reference
MIL-STD-202G
JEITA ED-4701 200
203
JEITA ED -4071 200
201
JEITA ED -4071 200
202
JEITA ED -4071 100
103
JESD22-A108D
JESD22-A108D
GB/T 4937,Ⅱ，
2.2&2.3
Test Conditions
Time
-40℃（30min）
100
-100℃
（30min）
Cycles
-10℃~65℃；
10cycles
0%~90%RH
Ta=100℃
Ta=-40℃
Ta=60℃；
RH=90%
Ta=80℃
Ta=25℃
IF=20mA
Tsol*=(240±5)
℃10secs
1000H
1000H
1000H
1000H
1000H
2 times
Quantity
22
22
22
22
22
22
22
22
Criterion
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
Criteria For Judging Damage
Test Items
Forward Voltage
Recerse Current
Luminous Intensity
Resistance to
Soldering Heat
Symbol
V
F
I
R
IV
-
Test Conditions
I
F
=I
FT
V
R
=5V
I
F
=I
FT
-
Criteria For Judging Damage
Initial Data±10%
I
R
≤10uA
Average I
V
degradation≤30%；Single LED I
V
degradation≤50%
Meterial without internal cracks,no meterial
between stripped,no deaded light
www.ekingluxs.com
3
sales@ekingluxs.com
3.0*1.5*0.9mm SMD CHIP LED
E6C1206RGBC3UDA
Product size (Unit:mm)
1
3
2
4
2
4
1
3
NOTES：
1.
All dimensions are in millimeters (inches)
2.
Tolerances are
0.2mm
(0.008inch) unless otherwise noted
Recommended Soldering Pad Design (Unit:mm)
Taping and package Spec
●T Specification:3,000pcs Per Reel
ape
www.ekingluxs.com
4
sales@ekingluxs.com
3.0*1.5*0.9mm SMD CHIP LED
E6C1206RGBC3UDA
Packaging
LabelStyle
www.ekingluxs.com
5
sales@ekingluxs.com
stm32/stm8
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
