产品承认书
SPECIFICATION FOR APPROVAL
CUSTOMER：
CUSTOMER P/N：
CND P/N. :
DESCRIPTION：
REF NO:
REV/NO:
DATE:
ATTACHMENT：
■ SPECIFICATION
■ SAMPLE
Q’TY OF SAMPLES
√
FULL APPROVED
CONDITIONAL
APPROVED
REJECTED
PCS
REMARK
A/0
2016-6-8
G2401D
1000 BASE-T MAGNETICS MODULES
CUSTOMER'S
SIGNATURE
深圳磁联达电子有限公司
Shenzhen CND-TEK Industrial Co.,Ltd
公司地址: 深圳市南山区西½镇阳光工业区5栋3楼
TEL: 86-755-29016433
FAX: 0755-27652977
Email: cd001@cd-tek.com
Http: //www.cd-tek.com
1. FEATURES:
1.1 Designed for long haul Gigabit Ethernet 1000 Base-T, full duplex applications.
1.2 Supports four pairs of category 5 UTP cable.
1.3 Cable interface for isolation and low common mode emissions
1.4 Compliant with IEEE 802.3ab standard for 1000 Base-T
1.5 Designed to support 1:1 Turns Ratio Transceivers.
1.6 Operating Temperature range: 0℃ TO +70℃
1.7 Storage temperature range: -25℃ TO +125℃
2. DIMENSIONS & MARKING
DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER:
PART NO.
：G2401D
深圳磁联达电子有限公司
Shenzhen CND-TEK Industrial Co.,Ltd
REV.: A/0
PAGE: 2 OF 4
3. SCHEMATICS:
4.ELECTRICAL SPECIFICATIONS @25℃
4.1 OCL : 350 μH Min. @ 100 KHz, 100mV with 8mA DC Bias
4.2 Leakage Inductance: 0.5 μH Max. @ 100KHz, 0.2V
4.3 Cw/w: 100 pF Max. @ 100KHz, 0.2V
4.4 DCR: 1.20Ω Max.
4.5 Turns Ratio(±5%): 1CT:1(TX), 1CT:1(RX)
4.6 Polarity: 2-23, 5-20, 8-17, 11-14 In-Phase
4.7 Insertion Loss: -1.1 dB Max. (TX & RX)@ 1-100 MHz
4.8 Return Loss: -18 dB Min @ 0.5-30MHz
-15 dB Min @ 40 MHz
-13 dB Min @ 60 MHz
-11 dB Min @ 80 MHz
-10 dB Min.@ 100 MHz
4.9 Cross Talk: -45 dB Min.@ 30 MHz
-40 dB Min.@ 60 MHz
-35 dB Min.@ 100 MHz
4.10 Common Mode Rejection : -43 dB Min.@ 1-30 MHz
-37 dB Min.@ 60 MHz
-33 dB Min.@ 80-100 MHz
4.11 Isolation HI-POT: 1500Vrms 1mA 3Second
DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER:
PART NO.
：G2401D
REV.: A/0
深圳磁联达电子有限公司
Shenzhen CND-TEK Industrial Co.,Ltd
PAGE: 3 OF 4
5. Recommended Lead Free Wave Soldering Curve :
Item
1
2
3
4
5
Soldertechnique
simulation
Solder iron
Vapor phase reflow
Wave:TopsideBoar
d-mount product
Wave:BottomsideB
oard-mount
product
Vapor phase reflow
Temperature
(℃)
350±10
(solder irno temp)
215±5
(vapor temp)
260±5
(solder temp)
260±5
(solder temp)
215±5
(vapor temp)
Time(s)
4~5
10±1
20±1
10±1
215±5
(vapor temp)
Temperature ramp/immersion
and emersion rate
25mm/s±6mm/s
Preheat 1℃/s~4℃/s to within
100℃ of solder temp
25mm/s±6mm/s
6. Reliability Test Criteria：
6.1 Terminal strength: Pull test withstand 9.8N 60+/-0.5S no looseness or movement.
6.2 Solderbility: Dipped in 245℃+/-5℃ molten solder for 3+/-0.5 seconds,95% min shall be smooth any and bright.
6.3 Resistance to soldering heat : Dip in 260℃+/- 5℃ molten solder for 5+/- 0.5 seconds. Shall not be any
abnormality.
6.4 Vibration: 1.5mm amplitude total excursion 10-55-10 Hz traversed in 1minute, x.y.z, axis for 2 hours. Shall not be any abnormality.
6.5 Random drop (Packing condition): Height 60cm, 3 times on the wood floorboard ,shall not be any
abnormality.
6.6 Dry heat: 100+/-2℃ 96 hours.
6.7 Cold: -20+/-2℃ 96 hours.
6.8 Damp Heat: 60+/-2℃, 93+/-3% RH 96 hours.
6.9 Change of temperature: exposed 5 cycle; each consisting of 30 minutes at -20+/-2℃,2-3minutes at 20+/-
2℃,30 minutes at 85+/-2℃, 2-3 minutes at 20+/-2℃.
DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER:
PART NO.
：G2401D
REV.: A/0
深圳磁联达电子有限公司
Shenzhen CND-TEK Industrial Co.,Ltd
PAGE: 4 OF 4
测试/测量
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
