产品承认书
SPECIFICATION FOR APPROVAL
CUSTOMER：
CUSTOMER P/N：
CND-TEK P/N. :
DESCRIPTION：
REF NO:
REV/NO:
DATE:
ATTACHMENT：
■ SPECIFICATION
■ SAMPLE
Q’TY OF SAMPLES
√
FULL APPROVED
CONDITIONAL
APPROVED
REJECTED
PCS
REMARK
A/0
2016-5-14
B1617S
10/100 BASE-T MAGNETICS MODULES
CUSTOMER'S
SIGNATURE
深圳磁联达电子有限公司
Shenzhen CND-TEK Industrial Co.,Ltd
公司地址: 深圳市南山区西½镇阳光工业区5栋3楼
TEL: 86-755-29016433
FAX: 0755-27652977
Email: cd001@cd-tek.com
Http: //www.cd-tek.com
1. FEATURES:
1.1 Compatible with various 10/100 Base-TX transceiver requiring 1:1 transmit and 1:1 receive turns ratio.
1.2 Compliant with IEEE 802.3 standard including baseline wander compensation specification of 350μH
OCL when Biased at 8mA
1.3 Low profile Surface Mount Packaging designed for Hi-Temp Reflow Process
1.4 Single channel interface for 10/100Mbps Ethernet applications with CMC ’ s tuned to Enhance EMC
system performance
1.5 Operating Temperature range: 0℃ TO +70℃
1.6 Storage temperature range: -25℃ TO +125℃
2. DIMENSIONS & MARKING
DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER:
PART NO.
：B1617S
深圳磁联达电子有限公司
Shenzhen CND-TEK Industrial Co.,Ltd
REV.: A/0
PAGE: 2 OF 4
3. SCHEMATICS:
4.ELECTRICAL SPECIFICATIONS @25℃
4.1 OCL : 350 μH Min. @ 100 KHz, 100mV with 8mA DC Bias
4.2 Leakage Inductance: 0.5 μH Max. @ 100KHz, 0.2V
4.3 Cw/w: 28 pF Max. @ 100KHz, 0.2V
4.4 DCR: 0.90Ω Max.
4.5 Turns Ratio(±5%): 1CT:1CT(TX), 1CT:1CT(RX)
4.6 Polarity: 1-16, 6-11 In-Phase
4.7 Insertion Loss: -1.0 dB Max. @ 1-100MHz
4.8 Return Loss: -20 dB Min. @ 30MHz
-14 dB Min. @ 60 MHz
-12 dB Min.@ 80 MHz
4.9 Cross Talk: -42 dB Min.@ 30 MHz
-37 dB Min.@ 50 MHz
-32 dB Min.@ 100 MHz
4.10 Common Mode Rejection : -45 dB Min.@ 30 MHz
-40 dB Min.@ 60 MHz
-35 dB Min.@ 80 MHz
4.11 Isolation HI-POT: 1500Vrms 1mA 1Second
DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER:
PART NO.
：B1617S
REV.: A/0
深圳磁联达电子有限公司
Shenzhen CND-TEK Industrial Co.,Ltd
PAGE: 3 OF 4
5. Recommended Lead Free IR Reflow Soldering Curve：
Item
1
2
3
Soldertechnique
simulation
Solder iron
Vapor phase reflow
IR/convection
reflow
Temperature
(℃)
350±10
(solder irno temp)
215±5
(vapor temp)
255±5
(component temp)
Time(s)
4~5
60±5
30±5
Temperature ramp/immersion
and emersion rate
1℃/s~4℃/s time above 183℃
90s~120s
Note：The curve includes recommended value only, please adjust your equipment to make sure the solder
process.Details please refers to the standard J-STD-020.
6. Reliability Test Criteria：
6.1 Terminal strength: Pull test withstand 9.8N 60+/-0.5S no looseness or movement.
6.2 Solderbility: Dipped in 245℃+/-5℃ molten solder for 3+/-0.5 seconds,95% min shall be smooth any and bright.
6.3 Resistance to soldering heat : Convection reflow condition setting: peak temperature at 260℃+0/-5℃
above 217℃ for 90-180 seconds, ramp-up rate 2-3℃/s. Ramp-down rate 6℃/s Max. No mechanical
problem found. No electrical failure found per our specification.
6.4 Vibration: 1.5mm amplitude total excursion 10-55-10 Hz traversed in 1minute, x.y.z, axis for 2 hours. Shall not be any abnormality.
6.5 Random drop (Packing condition): Height 60cm, 3 times on the wood floorboard ,shall not be any
abnormality.
6.6 Dry heat: 100+/-2℃ 96 hours.
6.7 Cold: -20+/-2℃ 96 hours.
6.8 Damp Heat: 60+/-2℃, 93+/-3% RH 96 hours.
6.9 Change of temperature: exposed 5 cycle; each consisting of 30 minutes at -20+/-2℃,2-3minutes at 20+/-
2℃,30 minutes at 85+/-2℃, 2-3 minutes at 20+/-2℃.
DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER:
PART NO.
：B1617S
REV.: A/0
深圳磁联达电子有限公司
Shenzhen CND-TEK Industrial Co.,Ltd
PAGE: 4 OF 4
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