CPM211 Datasheet
July. 2013 V1.1
Omni-directional MEMS Microphone with Top
Port and Analog Output
Features
Stable sensitivity over power supply range of: 1.5V-3.6V
Single-ended analog output
High SNR of 60dBA
Sensitivity:
−42dBV
High PSRR of 65 dB
Flat Frequency Response from 100 Hz to 15 kHz
Low current consumption of <200uA
3.76mmX2.95mmX1.1mm surface-mount package
Compatible with Sn/Pb and Pb-free solder processes
Applications
Mobile phones
Teleconferencing systems
Digital video cameras
Bluetooth headsets
Tablets
Other electronic devices with audio input
Description
The CPM211 is a high quality, low cost, low power analog output top-ported omni-directional
MEMS microphone. CPM211 consists of a MEMS microphone element and an output amplifier
(preamplifier). The CPM211 sensitivity specification makes it an excellent choice for both near
field and far field applications. The CPM211 has a high SNR and flat wideband frequency
response, resulting in natural sound with high intelligibility. Low current consumption enables
long battery life for portable applications. Due to the built-in filter, the CPM211 shows high
immunity to EMI.
The CPM211 is available in a thin 3.76mmX2.95mmX1.1mm surface mount package. It is reflow
solder compatible with no sensitivity degradation. The CPM211 is halide free.
Bottom View
4
OUT
3
GND
Top View
ML11
XXX
1
VDD
2
GND
Fig 1
Pin Configuration of CPM211
Copyright© 2013 by Chiphomer Technology Limited
Page 1 of 7
CPM211 Datasheet
July. 2013 V1.1
Block Diagram
Fig 2
Function Block Diagram
Pin Definition
No.
1
4
2,3
Symbol
VDD
OUT
GND
Description
Power supply
Analog output signal
Ground
Note:
Top metal cover is connected to GND.
Typical Application
The CPM211 output can be connected to a codec microphone input or to a high input impedance
gain stage. A DC-blocking capacitor is required at the output of the microphone.
Fig 3
CPM211 Typical Application 1
Fig 4
CPM211 Typical Application 2
Ordering Information
Order Number
CPM211
1：”LLL” stands for lot number
RoHS
Yes
Marking
CL11
LLL
1
Packing type
5,000 pcs per Reel
Copyright© 2013 by Chiphomer Technology Limited
Page 2 of 7
CPM211 Datasheet
July. 2013 V1.1
Absolute Maximum Ratings (1)
Parameter
VDD to Ground Voltage
Sound pressure level
Mechanical Shock
Vibration
Unit
-0.5V to 4 V
160dB
10kg
Per MIL-STD-883 Method 2007, Test
Condition B
Operating Temperature Range
-40°C ~ +70°C
Note 1:
Stresses beyond those listed under "absolute maximum ratings" may cause permanent
damage to the device. These are stress ratings only and functional operation of the device at
these or any other conditions above those indicated in the operation sections of this specification
is not implied.
Electro-Static Discharge Sensitivity
This integrated circuit can be damaged by ESD. It is recommended that all integrated
circuits be handled with proper precautions. Failure to observe proper handling and
installation procedures can cause damage. ESD damage can range from subtle
performance degradation to complete device failure.
Specifications
Test Condition: T
A
=+25
℃
, V
DD
=+1.8V (unless otherwise specified)
Parameter
Performance
Directivity
Sensitivity
Signal-to-Noise-Ratio
Equivalent Input Noise
Total Harmonic Distortion
Power Supply Rejection Ratio
Maximum Acoustic Input
SNR
EIN
THD
PSRR
105dB SPL
217Hz, 100mV V
P-P
Square wave on V
DD
65
120
1KHz, 94dB SPL
-45
Omni
-42
60
36
3
-39
dBV
dB
dBA SPL
%
dB
dB SPL
V
uA
Symbol
Conditions
MIN
TYP
MAX
Units
Power supply
Supply Voltage
Supply Current
V
DD
I
DD
1.5
3.6
200
Output characteristics
Output Impedance
Output DC Offset
Output Current Limit
Z
OUT
200
0.75
90
Ω
V
uA
Typical Performance Characteristics
Copyright© 2013 by Chiphomer Technology Limited
Page 3 of 7
CPM211 Datasheet
July. 2013 V1.1
Typical Performance Characteristics
10
8
6
4
2
0
-2
-4
-6
-8
-10
100
0
-10
-20
-30
-40
-50
-60
-70
-80
100
1k
10k
1k
10k
Frequency (Hz)
Fig 5
Frequency Response Normalized to
1 kHz.
Fig 6
Frequency (Hz)
Typical Power Supply Rejection
Ratio vs. Frequency
Reliability Specifications
The microphone sensitivity after stress must deviate by no more than ±3dB from the initial value.
Stress test
Low temperature operation life
High temperature operation life
Total Harmonic Distortion (THD)
Temperature Cycle
High Temperature Storage
Low Temperature Storage
Electrostatic Discharge (ESD)
Description
-40°C, 500 hours, powered
+125°C, 500 hours powered
+65°C/85% relative humidity, 500 hours, powered
−40°C/+125°C,
one cycle per hour, 100 cycles.
+150°C, 500 hours.
-40°C, 500 hours.
3 discharges at +/−8kV direct contact to the lid when unit
is grounded (IEC 61000-4-2) and 3 discharges at +/−2kV
direct contact to the I/O pins (MIL 883E, Method 3015.7).
Application Information
Connect to analog device
As an analog MEMS microphone, the CPM211output can be connected to a dedicated codec
microphone input (see Fig 3) or to a high input impedance gain stage (see Fig 4). A 0.1uF
ceramic capacitor placed close to the VDD pin of CPM211 is recommended to adequately
decouple the microphone from noise on the power supply. A DC-blocking capacitor is required at
the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at
f
C
½
1
(2
RC
)
(1)
where R is the input impedance of the codec, C is the DC-blocking capacitor.
Copyright© 2013 by Chiphomer Technology Limited
Page 4 of 7
CPM211 Datasheet
July. 2013 V1.1
A minimum value of 2.2uF is recommended in Fig 3 because the input impedance of the most
codec can be as low as 2kΩ at its highest PGA gain setting, which results in a high-pass filter
corner frequency at about 37Hz. Fig 4 shows the CPM211 connect to the op amp configured as
a non-inverting preamplifier.
PCB land pattern layout
The recommended PCB land pattern for the CPM211 should have a 1:1 ratio to the solder pads
on the microphone package. Care should be taken to avoid applying solder paste to the sound
hole in PCB. The dimensions of suggested solder paste pattern refer to the land pattern.
Fig 7
Recommended PCB Land Pattern Layout (Units: mm)
Pick and place equipment
The MEMS microphone can be handled using standard pick-and-place and chip shooting
equipment. Care should be taken to avoid damage to the MEMS microphone structure as
follows:
Use a standard pickup tool to handle the microphone. Because the microphone hole is
on the top of the package, the pickup tool can make contact with none-ported part of the
lid surface.
Use care during pick-and-place to ensure that no high shock events above 10 kg are
experienced because such events may cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that makes contact with the top side
of the microphone.
Do not use excessive force to place the microphone on the PCB
Reflow soldering profile
For best results, the soldering profile should be in accordance with the recommendations of the
manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit conditions specified in Fig 8.
Fig 8
Recommended Soldering Reflow Profile
Copyright© 2013 by Chiphomer Technology Limited
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