Datasheet> 器件分类 > 存储> FLASH存储器> BY25D40ASTIG(T)

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BY25D40ASTIG(T): 产品描述存储器类型：Non-Volatile 存储器构架(格式)：FLASH 时钟频率：108MHz 技术：NOR Flash 存储器接口类型：SPI 存储器容量：4M; 产品类别存储 FLASH存储器; 文件大小855KB，共44页; 制造商博雅(BOYAMICRO); 官网地址http://www.boyamicro.com/; 珠海博雅科技有限公司于2014年12月落户珠海高新技术开发区，由资深存储器研发团队创建而成。致力于高端闪型存储器芯片研发设计和产业化，公司立足珠海，放眼世界，立志于“中国梦”的崛起，奋发创新。

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BY25D40ASTIG(T)概述

存储器类型：Non-Volatile 存储器构架(格式)：FLASH 时钟频率：108MHz 技术：NOR Flash 存储器接口类型：SPI 存储器容量：4M

BY25D40ASTIG(T)规格参数

参数名称	属性值
存储器类型	Non-Volatile
存储器构架(格式)	FLASH
时钟频率	108MHz
技术	NOR Flash
写周期时间（页）	0.7ms
存储器接口类型	SPI
存储器容量	4M
工作电压	2.7V ~ 3.6V
工作温度	-40℃~+85℃

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Boya Microelectronics

Memory Series

BY25D40/20

4/2M BIT SPI NOR FLASH

Features

● Serial Peripheral Interface (SPI)

- Standard SPI: SCLK, /CS, SI, SO, /WP

- Dual SPI: SCLK, /CS, IO0, IO1, /WP

● Read

- Normal Read (Serial): 55MHz clock rate

- Fast Read (Serial): 108MHz clock rate

- Dual Read: 108MHz clock rate

● Program

- Serial-input Page Program up to 256bytes

● Erase

- Block erase (64/32 KB)

- Sector erase (4 KB)

- Chip erase

● Program/Erase Speed

- Page Program time: 0.7ms typical

- Sector Erase time: 100ms typical

- Block Erase time: 0.3/0.5s typical

- Chip Erase time: 3/2s typical

● Flexible Architecture

- Sector of 4K-byte

- Block of 32/64K-byte

● Low Power Consumption

- 20mA maximum active current

- 5uA maximum power down current

● Software/Hardware Write Protection

- Enable/Disable protection with WP Pin

- Write protect all/portion of memory via software

- Top or Bottom, Sector or Block selection

● Single Supply Voltage

- Full voltage range: 2.7~3.6V

● Temperature Range

- Commercial (0℃ to +70℃)

- Industrial (-40℃ to +85℃)

● Cycling Endurance/Data Retention

- Typical 100k Program-Erase cycles on any sector

- Typical 20-year data retention at +55℃

SOP8 150-mil

SOP8 208-mil

USON8 3*2 mm

May

2017

Rev 1.6

Contents

BY25D40/20

Contents

Description ................................................................................. 4

Signal Description ...................................................................... 6

Block/Sector Addresses ............................................................. 7

SPI Operation ............................................................................ 9

4.1

4.2

5.1

Standard SPI Instructions .............................................................................. 9

Dual SPI Instructions .................................................................................... 9

5. Operation Features .................................................................. 10

Supply Voltage ............................................................................................ 10

5.1.1 Operating Supply Voltage

............................................................... 10

5.1.2 Power-up Conditions

....................................................................... 10

5.1.3 Device Reset

.................................................................................... 10

5.1.4 Power-down

...................................................................................... 10

5.2

Active Power and Standby Power Modes ................................................... 10

5.3

Status Register..............................................................................................11

5.3.1 Write Protect Features

.................................................................... 12

5.4

Status Register Memory Protection ............................................................ 12

6. Device Identification ................................................................. 14

7. Instructions Description ............................................................ 15

7.1

Configuration and Status Instructions ......................................................... 17

7.1.1 Write Enable (06H)

.......................................................................... 17

7.1.2 Write Disable (04H)

......................................................................... 17

7.1.3 Read Status Register (05H)

........................................................... 18

7.1.4 Write Status Register (01H)

........................................................... 18

7.2

Read Instructions......................................................................................... 19

7.2.1 Read Data (03H)

.............................................................................. 19

7.2.2 Fast Read (0BH)

.............................................................................. 20

7.2.3 Dual Output Fast Read (3BH)

........................................................ 21

7.3

ID and Security Instructions ....................................................................... 22

7.3.1 Read Manufacture ID/ Device ID (90H)

....................................... 22

7.3.2 JEDEC ID (9FH)

............................................................................... 23

7.3.3 Read Unique ID Number (4Bh)

..................................................... 24

7.3.4 Deep Power-Down (B9H)

............................................................... 25

7.3.5 Release from Deep Power-Down/Read Device ID (ABH)

......... 26

7.4

Program and Erase Instructions .................................................................. 27

7.4.1 Page Program (02H)

....................................................................... 27

7.4.2 Sector Erase (20H)

.......................................................................... 28

7.4.3 32KB Block Erase (52H)

................................................................. 29

7.4.4 64KB Block Erase (D8H)

................................................................ 30

7.4.5 Chip Erase (60/C7H)

....................................................................... 31

8. Electrical Characteristics .......................................................... 32

8.1

8.2

8.3

8.4

May

2017

Absolute Maximum Ratings ....................................................................... 32

Operating Ranges ........................................................................................ 32

Data Retention and Endurance .................................................................... 32

Latch Up Characteristics ............................................................................. 33

Rev 1.6

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