Boya Microelectronics
Memory Series
BY25D16
16M BIT SPI NOR FLASH
Features
● Serial Peripheral Interface (SPI)
- Standard SPI: SCLK, /CS, SI, SO, /WP
- Dual SPI: SCLK, /CS, IO0, IO1, /WP
● Read
- Normal Read (Serial): 55MHz clock rate
- Fast Read (Serial): 108MHz clock rate
- Dual Read: 108MHz clock rate
● Program
- Serial-input Page Program up to 256bytes
● Erase
- Block erase (64/32 KB)
- Sector erase (4 KB)
- Chip erase
● Program/Erase Speed
- Page Program time: 0.7ms typical
- Sector Erase time: 100ms typical
- Block Erase time: 0.3/0.5s typical
- Chip Erase time: 15s typical
● Flexible Architecture
- Sector of 4K-byte
- Block of 32/64K-byte
● Low Power Consumption
- 20mA maximum active current
- 5uA maximum power down current
● Software/Hardware Write Protection
- Enable/Disable protection with WP Pin
- Write protect all/portion of memory via software
- Top or Bottom, Sector or Block selection
● Single Supply Voltage
- Full voltage range: 2.7~3.6V
● Temperature Range
- Commercial (0℃ to +70℃)
- Industrial (-40℃ to +85℃)
● Cycling Endurance/Data Retention
- Typical 100k Program-Erase cycles on any sector
- Typical 20-year data retention at +55℃
SOP8 150-mil
SOP8 208-mil
USON8 3*3 mm
June
2017
Rev 1.8
1
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44
Contents
BY25D16
Contents
1.
2.
3.
4.
Description ................................................................................. 4
Signal Description ...................................................................... 6
Block/Sector Addresses ............................................................. 7
SPI Operation ............................................................................ 8
4.1
4.2
5.1
Standard SPI Instructions .............................................................................. 8
Dual SPI Instructions .................................................................................... 8
5. Operation Features .................................................................... 9
Supply Voltage .............................................................................................. 9
5.1.1 Operating Supply Voltage
................................................................. 9
5.1.2 Power-up Conditions
......................................................................... 9
5.1.3 Device Reset
...................................................................................... 9
5.1.4 Power-down
........................................................................................ 9
5.2
Active Power and Standby Power Modes ..................................................... 9
5.3
Status Register............................................................................................. 10
5.3.1 Write Protect Features
.....................................................................11
5.4
Status Register Memory Protection .............................................................11
6. Device Identification ................................................................. 12
7. Instructions Description ............................................................ 13
7.1
Configuration and Status Instructions ......................................................... 15
7.1.1 Write Enable (06H)
.......................................................................... 15
7.1.2 Write Disable (04H)
......................................................................... 15
7.1.3 Read Status Register (05H)
........................................................... 16
7.1.4 Write Status Register (01H)
........................................................... 16
7.2
Read Instructions......................................................................................... 17
7.2.1 Read Data (03H)
.............................................................................. 17
7.2.2 Fast Read (0BH)
.............................................................................. 18
7.2.3 Dual Output Fast Read (3BH)
........................................................ 19
7.3
ID and Security Instructions ....................................................................... 20
7.3.1 Read Manufacture ID/ Device ID (90H)
....................................... 20
7.3.2 JEDEC ID (9FH)
............................................................................... 21
7.3.3 Read Unique ID Number (4Bh)
..................................................... 22
7.3.4 Deep Power-Down (B9H)
............................................................... 23
7.3.5 Release from Deep Power-Down/Read Device ID (ABH)
......... 24
7.4
Program and Erase Instructions .................................................................. 25
7.4.1 Page Program (02H)
....................................................................... 25
7.4.2 Sector Erase (20H)
.......................................................................... 26
7.4.3 32KB Block Erase (52H)
................................................................. 27
7.4.4 64KB Block Erase (D8H)
................................................................ 28
7.4.5 Chip Erase (60/C7H)
....................................................................... 29
8. Electrical Characteristics .......................................................... 30
8.1
8.2
Absolute Maximum Ratings ....................................................................... 30
Operating Ranges ........................................................................................ 30
June
2017
Rev 1.8
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44
Contents
8.3
8.4
8.5
8.6
8.7
8.8
9.1
9.2
9.3
9.4
9.5
9.6
9.7
BY25D16
Data Retention and Endurance .................................................................... 30
Latch Up Characteristics ............................................................................. 31
Power-up Timing......................................................................................... 31
DC Electrical Characteristics ...................................................................... 32
AC Measurement Conditions ...................................................................... 33
AC Electrical Characteristics ...................................................................... 33
Package 8-Pin SOP 150-mil ........................................................................ 36
Package 8-Pin SOP 208-mil ........................................................................ 37
Package 8-Pin TSSOP 173-mil ................................................................... 38
Package USON8 (3*3mm).......................................................................... 39
Package 8-Pin DIP8L .................................................................................. 40
Package DFN3*3(0303*0.50-0.50mm) ...................................................... 41
Package DFN2*3(0203*0.50-0.50mm) ...................................................... 42
9. Package Information ................................................................ 36
10. Order Information ..................................................................... 43
11. Document Change History ....................................................... 44
June
2017
Rev 1.8
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44
Description
BY25D16
1.
Description
The BY25D16 is 16M-bit Serial Peripheral Interface (SPI) Flash memory, and supports the Dual
SPI: Serial Clock, Chip Select, Serial Data I/O0 (SI), I/O1 (SO). The Dual Output data is
transferred with speed of 108Mbits/s. The device uses a single low voltage power supply, ranging
from 2.7 Volt to 3.6 Volt.
Additionally, the device supports JEDEC standard manufacturer and device ID.
In order to meet environmental requirements, Boya Microelectronics offers an 8-pin SOP 150-mil,
173-mil or 208mil, an 8-pad USON 3x3-mm, DFN3*3, and other special order packages, please
contacts Boya Microelectronics for ordering information.
Figure 1.
Logic diagram
VCC
SCLK
SI
/CS
/WP
NC
SO
BY25DXX
VSS
Figure 2.
Pin Configuration SOP8 150/208 mil
Top View
/CS
SO
/WP
VSS
1
2
8
7
SOP8 150/208mil
6
5
VCC
NC
SCLK
SI
3
4
June
2017
Rev 1.8
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44
FPGA/CPLD
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