AO3401A
MOSFET
SOT-23
-
P-Channel Enhancement-Mode MOSFET
ROHS
Features
Advanced trench process technology
High Density Cell Design For
Ultra Low On-Resistance
MAXIMUM RANTINGS
Characteristic
Drain-Source V oltage
Gate- Source V oltage
Drain Current (continuous)
Drain Current (pulsed)
Total Device Dissipation
T
A
=
25℃
Junction
Storage Temperature
Symbol
BV
DSS
V
GS
I
D
I
DM
P
D
T
J
T
stg
Max
-30
+12
-4.2
-18
1400
150
-55to+150
Unit
V
V
A
A
mW
℃
℃
Electrical Characteristics
Characteristic
Drain-Source Breakdown V oltage
(I
D
= -250uA,V
GS
=0V)
Gate Threshold V oltage
(I
D
= -250uA,V
GS
= V
DS
)
Diode Forward V oltageDrop
(I
S
= -1 A,V
GS
=0V)
Zero Gate V oltageDrain Current
(V
GS
=0V, V
DS
= -24V)
(V
GS
=0V, V
DS
= -24V , T
A
=
55℃)
Gate Body Leakage (V
GS
=+12V, V
DS
=0V)
Static Drain-Source On-State Resistance
(I
D
= -4.1A,V
GS
= -10V )
Static Drain-Source On-State Resistance
(I
D
= -2A,V
GS
= -4.5V)
Static Drain-Source On-State Resistance
(I
D
= -1A,V
GS
= -2.5V)
Input Capacitance
(V
GS
=0V, V
DS
= -15V,f=1MHz)
Output Capacitance
(V
GS
=0V, V
DS
= -15V,f=1MHz)
Turn-ON Time
(V
DS
= -15V, V
GS
= -10 V, R
GEN
=6
Ω
)
Turn-OFF Time
(V
DS
= -15V,V
GS
= -10 V, R
GEN
=6
Ω
)
Rev 8: Nov 2014
Symbol
BV
DSS
V
GS(th)
V
SD
I
DSS
I
GSS
R
DS(ON)
R
DS(ON)
R
DS(ON)
C
ISS
C
OSS
t
(on)
t
(off)
Min
-30
-0.6
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
—
42
53
80
954
115
6
38
Max
—
-2
-1
-1
-5
+100
50
60
85
—
—
—
—
Unit
V
V
V
u
A
n
A
mΩ
mΩ
mΩ
pF
pF
ns
ns
Page 1 of 3
www.born-tw.com
AO3401A
MOSFET
P-Channel Enhancement-Mode MOSFET
ROHS
Fig 1: Output Characteristics
Figure 2: Transfer Characteristics
Figure 3: On-Resistance vs. Drain Current and Gate Voltage
Figure 4: On-Resistance vs. Gate-Source Voltage
Figure 5: Gate-Charge Characteristics
Figure 6: Safe
Operating Area
Rev 8: Nov 2014
www.born-tw.com
Page 2 of 3