Ap
pplicati
ions No SY
ote: Y7701
High Effi
H
ficiency 500kHz, 25V PW Contr
5
WM
roller
For WLED backligh application
ht
Gener Descr
ral
ription
SY7701 is a current mo boost con
ode
ntroller targeted for
d
ication. The d
device has a wide
WLED backlight appli
input vol
ltage range o 3V to 25
of
5V. The external
compensa
ation provides flexible adju
ustment of co
ontrol
loop for different appl
lications. The internal low side
driver is capable of s
sourcing 1.5A and sinking 3A
A
g
current.
Fe
eatures
•
•
•
•
Input voltage r
I
range 3V to 25
5V
500kHz fixed switching freq
quency
dimming frequ
uency
100Hz~1kHz d
10%~100% dimming duty cy @200Hz dimming
ycle
frequency
f
•
External comp
E
pensation
•
Integrated low side driver: 1.5A sourcing and 3A
I
w
a
sinking
•
OVP, OTP fun
O
nctions
•
RoHS Compliant and Haloge Free
R
en
•
Compact pack
C
kage: DFN3x3-
-10,SOP10
Order
ring Info
ormation
n
SY7701
□
(
□□
)
□
Temperature Co
T
ode
Package Code
P
Optional Spec C
O
Code
Ordering Number
g
SY7701DBC
SY77
701FHC
Package type
DFN3x3-10
SOP10
Note
----
Ap
pplicatio
ons
•
Monitor LCD Panel Backlig
M
ght
•
TV LCD Pane Backlight
T
el
•
LED Lighting
L
Typic Applications
cal
SY7701
Figure 1. Schematic Diagram
SY7701 Rev. 0.2A
1
Silergy Corp. Con
y
nfidential- Pr
repared for I
Internal Use Only
e
1
SY7
7701
Pinou (top vie
ut
ew)
(DF
FN3x3-10)
(SOP10)
Top Mark: GOxy for SY7701DBC (Device
code:GO,
x=y
p
yz
year code, y=w
week code, z= lo number cod
ot
de)
AEYx for SY7701FHC (Device
code:AEY,
x=year code, y=
xyz
e
x
=week code, z= lot number code)
=
c
Pin Nam
me
Pin Number
n
Pin Desc
cription
IN
10
Input pin. D
Decouple this pin to GND pin with at least 1uF ceramic capacitor
p
n
5V Internal LDO output from VIN. Con
l
f
nnect a 4.7 uF c
capacitor from this pin
m
VCC
C
9
to GND
GATE
E
8
Driver pin. Connect to the gate of power MOSFET
e
Current sen pin. Connec an external c
nse
ct
current sensing resistor R
S
fr
g
rom this
pin to GND The voltage on this pin is u
D.
used to provide mosfet curren
e
nt
CS
7
feedback in the control loop and cycle b cycle peak c
n
by
current limit. Peak
P
current limi is triggered when the sense voltage plus the slope
it
w
ed
s
compensation exceed 340
0mV
100m
mV
Feedback pin. The LED current equals t
c
to:
I
LED=
FB
6
R
ISE
ET
GND
D
COMP
OVP
P
SS
EN/PW
WM
5(Exp
posed Paddle)
4
3
2
1
Ground pin
n
External compensation pin. Connect RC network from this pin to GN to
C
m
ND
e
oop
compensate the control lo
Over Voltag Protection input pin.The O
ge
i
OVP set point equals to :
V
OVP=
1
R
OV2
2
(
R
OV!
+R
OV2
)
Soft start pi Connect a capacitor from this pin to GN to program the soft
in.
c
ND
start time
Enable and PWM dimmin input pin. Pu it high to tu on the chip Do not
ng
ull
urn
p.
float this pin
Absolu Maxim
ute
mum Ratin
(Note 1)
ngs
IN,EN ----
------------------
------------------
------------------
------------------
------------------
------------------
------------------
---------V
GATE----
------------------
------------------
------------------
------------------
------------------
------------------
-------------- VC
CC+0.3V
All other p ------------
pins
------------------
------------------
------------------
------------------
------------------
------------------
--------- V
Power Dis
ssipation, P
D
@ T
A
= 25°C, DFN3x3-10,SOP10 ----------
------------------
------------------
-------------- 2.6W/TBD
Package T
Thermal Resist
tance (Note 2)
θ
JA ------------------------
-------------------------
--------------------------------------------------
-------------------------
-------------------------
-----------------
38°C
C/W/TBD
θ
JC -
-------------------------
-------------------------
--------------------------------------------------
-------------------------
-------------------------
---------------
130°C
C/W/TBD
Junction T
Temperature R
Range -----------
------------------
------------------
------------------
------------------
------------------ 125°C
---
Lead Tem
mperature (Sold
dering, 10 sec.) ----------------
------------------
------------------
------------------
------------------ 260°C
---
Storage T
Temperature Ra ------------
ange
------------------
------------------
------------------
------------------
---------- 65°C to 150°C
Recom
mmended O
Operating Conditio
(Note 3)
g
ons
IN --------
------------------
------------------
------------------
------------------
------------------
------------------
----------------- V to 25V
Junction T
Temperature R
Range -----------
------------------
------------------
------------------
------------------
---------- 40°C to 125°C
Ambient T
Temperature R
Range ----------
------------------
------------------
------------------
------------------
----------- 40°C to 85°C
C
SY7701 Rev. 0.2A
1
Silergy Corp. Con
y
nfidential- Pr
repared for I
Internal Use Only
e
2
SY7701
Electrical Characteristics
(V
IN
= 12V, T
A
= 25°C, unless otherwise specified)
Parameter
Input Voltage Range
Quiescent Current
Shutdown Current
OVP Threshold
FB Input Current
Feedback Reference Voltage
Internal Slope Compensation
Gate Driver Output Peak Current
EN Rising Threshold
EN Falling Threshold
Input UVLO threshold
UVLO hysteresis
Oscillator Frequency
Min On Time
Min Off Time
Internal LDO Output
Thermal Shutdown
Thermal Hysteresis
Symbol
V
IN
I
Q
I
SHDN
V
OVP
I
FB
V
REF
V
SLOPE
I
SOURCE
I
SINK
V
ENH
V
ENL
V
UVLO
V
HYS
F
OSC
V
VCC
T
SD
T
HYST
Conditions
V
OVP
=1.1V
EN=0
Min
3
Typ
170
0.1
1
100
40
1.5
3
Max
25
0.98
-50
98
1.02
50
102
1.5
0.4
2.9
0.3
500
200
200
5
150
20
V
IN
=5.5V
4.9
5.1
Unit
V
uA
uA
V
nA
mV
mV/uS
A
A
V
V
V
V
kHz
ns
ns
V
℃
℃
Note 1:
Stresses beyond the “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Note 2:
θ
J
A
is measured in the natural convection at T
A
= 25°C on a low effective single layer thermal conductivity
test board of JEDEC 51-3 thermal measurement standard.Test condition: Device mounted on 2” x 2” FR-4 substrate
PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.
Note 3:
The device is not guaranteed to function outside its operating conditions.
SY7701 Rev. 0.2A
Silergy Corp. Confidential- Prepared for Internal Use Only
3
嵌入式系统
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