0.35mm Pitch 0.8mm Height Hybrid Power/Signal Connectors for Board-to-Board and FPC-to-Board
BM24 Series
（Supports USB3.0 signal）
Conventional
type
(P= 0.35 mm,
20 contacts)
Aug.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
BM24 with 10
contact positions
(Plus two power
contacts)
Fig.1
■Features
1. Rated current : 5A
The compact BM24 Series features a space-saving
design with the power contacts rated at 5A, and
the signal contact rated at 0.25A. (Fig.1)
Area for vacuum pick up
2. High contact reliability
A 2-point contact structure for both power and
signal contacts provides high contact reliability.
(Fig.3)
Fig.2
3. Enhanced mating process
A guide rib ensures self-alignment during mating,
with an alignment range of 0.3mm. In addition, a
tactile click is generated upon mating completion,
preventing incomplete mating and enhancing mating
operability.
Cross-sectional view of mated contacts
Two-point
contact
Signal contact
4. Supports USB3.0/3.1 transmission
The signal contact supports USB3.0/3.1 signals.
Power contact
Two-point
contact
Fig.3
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
2016.3②
1
BM24 Series●0.35mm Pitch 0.8mm Height Hybrid Power/Signal Connectors for Board-to-Board and FPC-to-Board
■Product
Specifications
Ratings
Rated
Power contact : 5A
Operating
Storage
-40 to 85°C (Note 2)
-10 to 60ç (Note 3)
current Signal contact : 0.25A(Note 1) temperature range
temperature range
Storage
Operating
Rated
40 to 70% (Note 3)
20 to 80%
30V AC/DC
humidity range
humidity range
voltage
Specifications
100Mø min.
Conditions
Measured at 100V DC
150V AC for one minute
Measured at 20mV AC, 1kHz, and 1mA
Frequency : 10 to 55 Hz ; half amplitude : 0.75mm,
in 3 axis directions for 2 hours
96 hours at a temperature of 40 ±2ç and
a humidity range from 90 to 95%
(-55ç for 30 minutes
➝
5 to 35°C for 10 minutes
➝
85°C for 30 minutes
➝
5 to 35°C for 10 minutes)
in 5 cycles
10 mating cycles
Reflow : with recommended temperature profile ; Hand
soldering at soldering iron temperature of 350ç for
3 seconds max.
Items
1. Insulation resistance
2. Withstanding voltage No flashover or dielectric breakdown
3. Contact resistance
4. Vibration
Signal contact : 100mø max.
Power contact : 15mø max.
No electrical discontinuity for more than 1µs.
Contact resistance : Signal contact : 100mø max.
Power contact : 15mø max.
Insulation resistance : 50Mø min.
Contact resistance : Signal contact : 100mø max.
Power contact : 15mø max.
Insulation resistance : 100Mø min.
Contact resistance : Signal contact : 100mø max.
Power contact : 15mø max.
No dissolution or melting of the resin that will
affect the performance.
Aug.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
5. Humidity
6. Temperature cycle
7. Durability
8. Solder heat
resistance
Note 1 : The total current capacity for connectors with 40 or more signal contacts is 10A for all contacts.
Note 2 : Includes temperature rise caused by current flow.
Note 3 : Storage refers to long-term-storage of unused items before they are mounted on the PCB.
Operating temperature / humidity range applies to the state of temporary storage such as non-powered after mounting on the
PCB, and during transportation, etc.
■Materials
/ Finish
Product
Receptacle
Header
Part
Insulator
Signal contact
Power contact
Materials
LCP
Phosphor bronze
Copper alloy
Finish
Black
Gold plated
Gold plated
UL Regulation
UL94V-0
-- ---
--- --
-- ---
--- --
■Product
Number Structure
Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.
●Receptacle
/ Header
BM 24 −
*
DS / 2 − 0.35 V (51)
❶
❷
❸
❹
❺
❻
❼
½
❶
Series Name : BM
❷
Series No. : 24
❸
Number of Signal Contacts : 10, 20, 24, 30, 40
❹
Connector type
DS : Receptacle
DP : Header
❺
Number of Power Contacts : 2
❻
Contact Pitch : 0.35mm
❼
Termination type
V : Straight SMT
½
Gold plated specification and packaging status
(51) : Gold plate thickness 0.05µm
Embossed tape packaging (10,000 pcs/reel)
2
BM24 Series●0.35mm Pitch 0.8mm Height Hybrid Power/Signal Connectors for Board-to-Board and FPC-to-Board
■Receptacle
Recommended PCB layout
‒
Recommended metal mask dimensions (mask thickness : 100 µm)
+
Aug.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
（
）
Unit : mm
Part No.
BM24-10DS/2-0.35V(51)
BM24-20DS/2-0.35V(51)
BM24-24DS/2-0.35V(51)
BM24-30DS/2-0.35V(51)
BM24-40DS/2-0.35V(51)
HRS No.
677-2002-1 51
677-2004-7 51
677-2006-2 51
677-2008-8 51
677-2010-0 51
No. of Contacts
10
20
24
30
40
A
5.25
7
7.7
8.75
10.5
B
1.4
3.15
3.85
4.9
6.65
C
5.55
7.3
8
9.05
10.8
Note 1 : Please place orders in full reel quantities.
Note 2 : This connector has no polarity.
■Header
D
E
F
P= 0.35
2.02
1.92
0.43
0.12
Recommended PCB layout
G±0.02
H±0.02
0
1.06
‒0.05
Recommended metal mask dimensions (mask thickness : 100 µm)
2.34±0.01
F±0.02
P=0.35±0.01
1.48±0.01
1.66±0.01
2.44±0.01
G±0.01
H±0.01
F±0.02
P=0.35±0.02
1.46
‒0.05
2.44
+0.05
0
0
0.66
0.18±0.02
0.18±0.01
Unit : mm
HRS No.
677-2001-9 51
677-2003-4 51
677-2005-0 51
677-2007-5 51
677-2009-0 51
No. of Contacts
10
20
24
30
40
D
4.32
6.07
6.77
7.82
9.57
E
3
4.75
5.45
6.5
8.25
F
1.4
3.15
3.85
4.9
6.65
G
3.73
5.48
6.18
7.23
8.98
H
2.27
4.02
4.72
5.77
7.52
Part No.
BM24-10DP/2-0.35V(51)
BM24-20DP/2-0.35V(51)
BM24-24DP/2-0.35V(51)
BM24-30DP/2-0.35V(51)
BM24-40DP/2-0.35V(51)
Note 1 : Please place orders in full reel quantities.
Note 2 : This connector has no polarity.
3
BM24 Series●0.35mm Pitch 0.8mm Height Hybrid Power/Signal Connectors for Board-to-Board and FPC-to-Board
Embossed Tape Dimensions (complies with JIS C 0806)
●Receptacle
1.75±0.1
Ø1.5
+0
0
●Reel
dimensions
Product label
K-K
2±0.5
.1
Ø1
3±
0.2
0˚
12
4±0.1 2±0.1 4±0.1
K
0.8
1±
Ø2
L±0.1
Ø1.5 feed hole
diameter
M±0.3
12
0˚
Ø380±2
Ø1.5 feed hole
diameter
Aug.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
K
J
J-J
J
Un-reeling direction
0.25±0.1
1.02±0.15
N±0.5
P±1
Unit : mm
Part No.
BM24-10DS/2-0.35V(51)
BM24-20DS/2-0.35V(51)
BM24-24DS/2-0.35V(51)
BM24-30DS/2-0.35V(51)
BM24-40DS/2-0.35V(51)
No. of Contacts
10
20
24
30
40
11.5
24
25.5
29.5
7.5
16
17.5
21.5
L
M
N
P
●Header
1.75±0.1
Ø1.5
+0
0
.1
●Reel
dimensions
.2
4±0.1 2±0.1 4±0.1
Product label
R-R
2±0.5
R
S±0.1
T±0.3
12
0˚
Ø1
3±
0
Ø380±2
R
Q
Q-Q
Q
Un-reeling direction
0.25±0.1
0.87±0.15
U±0.5
V±1
Unit : mm
Part No.
BM24-10DP/2-0.35V(51)
BM24-20DP/2-0.35V(51)
BM24-24DP/2-0.35V(51)
BM24-30DP/2-0.35V(51)
BM24-40DP/2-0.35V(51)
No. of Contacts
10
20
24
30
40
11.5
24
25.5
29.5
7.5
16
17.5
21.5
S
T
U
V
Ø80±1
Ø80±1
Ø2
1±
0.8
0˚
12
4
BM24 Series●0.35mm Pitch 0.8mm Height Hybrid Power/Signal Connectors for Board-to-Board and FPC-to-Board
Precautions
1.Recommended solder
temperature profile
MAX 250ç
250
220
Temperature ç）
（
200
180
150
90 to 120 sec
Within 60 seconds
100
50
Aug.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Room
temperature
0
50
100
150
200
250
300
[Conditions]
1. Peak temperature
2. Heat section
3. Preheat section
4. Number of reflow cycles
Heating time (sec)
: Maximum of 250ç
: 220ç min., within 60 seconds
: 150 to 180ç, 90 to 120 seconds
: Maximum of 2 cycles
Note 1 : The temperature refers to the surface temperature of the PCB in the
area of the connector lead.
Note 2 : When you use nitrogen reflow, please mount the product with the
oxygen concentration at a minimum of 1,000 ppm.
Please contact us if the concentration is below 1,000 ppm.
2. Recommended manual
soldering conditions
3. Recommended stencil
thickness and open area
ratio to PCB pattern area
4. Board warpage
5. Cleaning conditions
Soldering iron temperature: 340 ± 10°C ;
Soldering time: within 3 seconds
Thickness: 0.1mm
Aperture ratio : 80% on the DS side ; 70% on the DP side
A maximum of 0.02mm at the center of the connector relative to each end of
the connector.
Cleaning is not recommended. If you clean this product, please evaluate its
performance before using it.
(Cleaning may impair the mating/unmating properties and lower resistance to
environmental factors)
●
Care should be taken when mating/unmating the connector when it is not
mounted on the PCB. This could cause damage or deformation of the contacts.
●Avoid
supporting the PCB only with the connectors.
Support it by other means such as bolts, screws, posts, etc.
●
Care should be taken that excessive prying mating/unmating could cause
damage.
●
In the case of hand soldering, please do not apply any flux, which could
cause flux wicking.
●
This product may have slight color differences due to production lot
variability, but this does not the performance.
●Please
refer to the next page for precautions regarding mating/unmating.
●
Because the product can disengage if dropped (or other impact), and by
FPC routing, it is advised to secure the mated connectors to the board with
housings and cushioning materials.
●
Caution! Do not use the connector in non-recommended conditions (i.e.,
rated current, rated voltage, PCB design and operating environment, etc.).
Such usage could lead to material outgassing, ignition, or short-circuit, etc.
Refer to the specifications and the guidelines for board pattern dimensions,
board cautions, and connector treatment.
Pleasae contact Hirose if using the connector under conditions other than
those described in the specifications and the guidelines is being considered.
6. Precautions
5
Microchip MCU
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