CMCC0603C Series
Multilayer Chip Ceramic Inductor
Pb
◆
Features
1 Monolithic Structure for high reliability
2 High self-resonant frequency
3 Excellent solderability and high heat resistance
4 RoHS Compliant.
1 RF Circuit of in telecommunication and other
Equipments
◆
Dimensions
Unit: mm
Size(EIA)
L
0.60±0.05
W
0.30±0.05
T
0.30±0.05
E
0.20±0.10
Rev.01
Page 1 of 7
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；
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） （
(1)
(2)
(3)
(4)
Series Type
Chip Size mm :Length X Width
Material Code
Inductance 1N0=1nH 10N=10nH
R10=100nH
(5) Inductance Tolerance B=±0.1; C=±0.2; S=±0.3;
G=±2%; H=±3%; J=±5%
(6) Company Code
(7) Packaging:P–Embossed paper tape, 7" reel
E- Embossed plastic tape, 7" reel
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◆
Application
、
、
、
、
、
PRODUCT IDENTIFICATION
C
(3)
1N0 S
(4) (5)
S
P
(6) (7)
CMCC 0603
(1)
(2)
www.cybermaxtech.com
CMCC0603C Series
◆
Specifications
Min.
Part Number
Inductance Quality
(nH)
Factor
(Q)
L, Q
Test
Freq.
L/Q(MHz)
Typical Q @ Freq. (GHz)
Min. Self-
resonant
Max.
Rated
Current
mA
Max. DC
Resistance
Q
(MHz)
CMCC0603 Series
CMCC0603C27N
CMCC0603C33N
CMCC0603C39N
CMCC0603C47N
CMCC0603C56N
CMCC0603C68N
CMCC0603C82N
CMCC0603CR10
CMCC0603CR12
◆
General Technical Data
Operating Temperature Range
Storage Condition
Soldering Method
Less than 40
Reflow or Wave Soldering
Rev.01
Page 4 of 7
℃
℃
℃
◇：
Note
: Please specify the inductance tolerance. For L≤6.2nH, choose B=±0.1nH, C=±0.2nH or S=±0.3nH;For L>6.2nH,
choose G=±2%,H=±3%or J=5%.
◇
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◇
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◇
◇
◇
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CMCC0603C22N
SP
SP
SP
SP
SP
SP
SP
SP
SP
SP
22
27
33
39
47
56
68
82
100
120
13
13
11
11
11
11
11
10
10
9
500
500
300
300
300
300
300
300
300
300
15
15
14
14
14
13
13
12
12
12
19
19
15
15
15
13
11
10
10
8
22
15
8
6
-
-
-
-
-
-
23
13
5
-
-
-
-
-
-
-
20
8
-
-
-
-
-
-
-
-
1900
1800
1800
1600
1500
1400
1200
1100
1000
1000
-55
~ +125
and 70% RH
www.cybermaxtech.com
） （ ）（
） （ ）（
） （ ）（
） （ ）（
1.20
1.60
2.20
2.30
2.60
2.80
3.20
3.80
4.00
5.00
130
120
110
100
100
80
80
70
60
50
0.5
0.8
1.8
2.0
2.4
Frequency
FPGA/CPLD
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