山东晶导微电子股½有限公司
Jingdao Microelectronics co.LTD
Silicon Planar Zener Diodes
MM1W3V3 THRU MM1W330
PINNING
FEATURES
• Total power dissipation: Max. 1 W.
• Wide zener reverse voltage range 3.3V to 330V.
• Small plastic package suitable for surface mounted design.
PIN
1
2
DESCRIPTION
Cathode
Anode
2
MECHANICAL DATA
▪
Case: SOD-123
1
Simplified outline SOD-123 and symbol
• Terminals: Solderable per MIL-STD-750, Method 2026
▪
Approx. Weight:16mg/0.00056oz
Absolute Maximum Ratings And Characteristics
（
Ta = 25
°C）
Parameter
Power Dissipation at T
L
=75
°C
Forward Voltage at I
F
= 200 mA
Typical thermal resistance juncting to ambient
Operating and Storage Temperature Range
(1)
Symbol
P
D
V
F
R
θJA
T
j
, T
stg
Value
1
1.2
300
-55 ~ +150
Unit
W
V
°C/W
°C
(1) Thermal resistance from junction to ambient at P.C.B. mounted with 2. 0" X 2.0" (5 X 5 cm) copper areas pads.
1.2
1.0
Transient Thermal Impedance（
°C
/W）
Fig.1 Maximum Continuous Power Derating
Fig.2 Typical Transient Thermal Impedance
1000
Power Dissipation (
W
)
0.8
0.6
0.4
0.2
0.0
25
50
75
100
125
150
175
100
10
0.01
0.1
1
10
100
T
c
,Case Temperature (
°C)
t, Pulse Duration（sec）
2016.10
SOD123-W-MM1W3V3~MM1W330-1W
Page 1 of 3
山东晶导微电子股½有限公司
Jingdao Microelectronics co.LTD
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
MM1W3V3 THRU MM1W330
SOD-123
E
b
A
D
∠ALL
ROUND
A
1
L
1
E
1
C
SOD-123 mechanical data
UNIT
max
mm
min
max
mil
min
35
3.5
59
98
142
10
20
0.9
51
0.09
8.7
1.5
71
2.5
110
3.6
154
0.25
18
0.5
A
1.3
C
0.22
D
1.8
E
2.8
E
1
3.9
L
1
0.45
b
0.7
A
1
0.2
∠
9°
28
8
The recommended mounting pad size
1.2
(47)
2.0
(79)
1.2
(47)
1.2
(47)
Unit： mm
(mil)
2016.10
www.sdjingdao.com
Page 1 of 3
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