山东晶导微电子股½有限公司
Jingdao Microelectronics co.LTD
Silicon Planar Zener Diodes
MM1Z2V0B THRU MM1Z75B
PINNING
FEATURES
• Total power dissipation: Max. 500mW.
• Wide zener reverse voltage range 2.0V to 75V.
• Small plastic package suitable for surface mounted design.
• Tolerance approximately±2%
PIN
1
2
DESCRIPTION
Cathode
Anode
2
MECHANICAL DATA
▪Case:
SOD-123
▪Terminals:
Solderable per MIL-STD-750, Method 2026
▪
Approx. Weight:16mg/0.00056oz
1
Simplified outline SOD-123 and symbol
Absolute Maximum Ratings And Characteristics
（
Ta = 25
°C）
Parameter
Power Dissipation
Forward Voltage at I
F
= 10 mA
Typical thermal resistance juncting to ambient
Operating and Storage Temperature Range
(1)
Symbol
P
tot
V
F
R
θJA
T
j
, T
stg
Value
500
0.9
340
-55 ~ +150
Unit
mW
V
°C/W
°C
(1) Thermal resistance from junction to ambient at P.C.B. mounted with 2 .0" X 2.0" (5 X 5 cm) copper areas pads.
Transient Thermal Impedance（
°C
/W）
Fig.1 Maximum Continuous Power Derating
0.6
0.5
Fig.2 Typical Transient Thermal Impedance
2000
1000
Power Dissipation (
W
)
0.4
0.3
0.2
0.1
0.0
25
50
75
100
125
150
175
100
10
0.01
0.1
1
10
100
T
c
,Case Temperature (
°C)
t, Pulse Duration（sec）
2017.12
SOD123-W-MM1Z2V0B~MM1Z75B-500mW
Page 1 of 3
山东晶导微电子股½有限公司
Jingdao Microelectronics co.LTD
Characteristics at Ta = 25°C
Zener Voltage Range
（1）
MM1Z2V0B THRU MM1Z75B
Dynamic
Impedance
Reverse Current
I
R
Max（μA）
120
120
120
120
50
20
10
5
5
2
2
1
1
0.5
0.5
0.5
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
2
2
2
1
1
0.2
0.2
0.2
at V
R
（V）
0.5
0.7
1
1
1
1
1
1
1
1
1.5
2.5
3
3.5
4
5
6
7
8
9
10
11
12
13
15
17
19
21
23
25
27
30
33
36
39
43
47
52
57
Type
Marking
Min（V）
V
ZT
（at
I
ZT
）
Nom（V）
2
2.2
2.4
2.7
3
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
Max（V）
2.04
2.24
2.45
2.75
3.06
3.37
3.67
3.98
4.39
4.79
5.20
5.71
6.32
6.94
7.65
8.36
9.28
10.2
11.22
12.24
13.26
15.3
16.32
18.36
20.4
22.44
24.48
27.54
30.6
33.66
36.72
39.78
43.86
47.94
52.02
57.12
63.24
69.36
76.5
I
ZT
(mA)
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
Z
ZT
（at
I
ZT
）
Max
(Ω)
100
100
100
110
120
130
130
130
130
130
130
80
50
30
30
30
30
30
30
35
35
40
40
45
50
55
60
70
80
80
90
100
130
150
180
180
200
250
300
MM1Z2V0B
MM1Z2V2B
MM1Z2V4B
MM1Z2V7B
MM1Z3V0B
MM1Z3V3B
MM1Z3V6B
MM1Z3V9B
MM1Z4V3B
MM1Z4V7B
MM1Z5V1B
MM1Z5V6B
MM1Z6V2B
MM1Z6V8B
MM1Z7V5B
MM1Z8V2B
MM1Z9V1B
MM1Z10B
MM1Z11B
MM1Z12B
MM1Z13B
MM1Z15B
MM1Z16B
MM1Z18B
MM1Z20B
MM1Z22B
MM1Z24B
MM1Z27B
MM1Z30B
MM1Z33B
MM1Z36B
MM1Z39B
MM1Z43B
MM1Z47B
MM1Z51B
MM1Z56B
MM1Z62B
MM1Z68B
MM1Z75B
4A
4B
4C
4D
4E
4F
4H
4J
4K
4M
4N
4P
4R
4X
4Y
4Z
5A
5B
5C
5D
5E
5F
5H
5J
5K
5M
5N
5P
5R
5X
5Y
5Z
6A
6B
6C
6D
6E
6F
6H
1.96
2.16
2.35
2.65
2.94
3.23
3.53
3.82
4.21
4.61
5
5.49
6.08
6.66
7.35
8.04
8.92
9.8
10.78
11.76
12.74
14.7
15.68
17.64
19.6
21.56
23.52
26.46
29.4
32.34
35.28
38.22
42.14
46.06
49.98
54.88
60.76
66.64
73.5
（1）
V
ZT
is tested with pulses (20 ms)
2017.12
www.sdjingdao.com
Page 2 of 3
山东晶导微电子股½有限公司
Jingdao Microelectronics co.LTD
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
MM1Z2V0B THRU MM1Z75B
SOD-123
E
b
A
D
∠ALL
ROUND
A
1
L
1
E
1
C
SOD-123 mechanical data
UNIT
max
mm
min
max
mil
min
35
3.5
59
98
142
10
20
0.9
51
0.09
8.7
1.5
71
2.5
110
3.6
154
0.25
18
0.5
A
1.3
C
0.22
D
1.8
E
2.8
E
1
3.9
L
1
0.45
b
0.7
A
1
0.2
∠
9°
28
8
The recommended mounting pad size
1.2
(47)
2.0
(79)
1.2
(47)
1.2
(47)
Unit： mm
(mil)
2017.12
www.sdjingdao.com
Page 3 of 3
MEMS传感器
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