山东晶导微电子有限公司
Jingdao Microelectronics
FEATURES
▪
For surface mounted applications
▪
Glass Passivated Chip Junction
▪
Fast reverse recovery time
▪
Ideal for automated placement
▪
Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
▪Case:
SOD-323
▪Terminals:
Solderable per MIL-STD-750, Method 2026
BAV19WS / BAV20WS / BAV21WS
PINNING
PIN
1
2
DESCRIPTION
Cathode
Anode
2
1
Top View
Simplified outline SOD-323 and symbol
Absolute Maximum Ratings at 25
°C
Symbols
V
RRM
V
RMS
I
F
I
FRM
at 1s
at 1ms
at 1 us
Parameter
Maximum Repetitive Peak Reverse Voltage
BAV19WS
120
100
BAV20WS
200
150
250
625
1
3
9
500
-55 ~ +150
BAV21WS
250
200
Units
V
V
Maximum RMS voltage
Continuous
Forward Current
Repetitive Peak Forward Current
mA
mA
A
mW
°C
Non-reptitive Peak Forward Surge Current
I
FSM
Total Power Dissipation
P
tot
T
j
, T
stg
Operating and Storage Temperature Range
Characteristics at
T
a
= 25
°C
Parameter
Reverse Breakdown Voltage at I
R
=100
μA
at 100 m A
at 200 m A
T
a
= 25
°C
T
a
=150
°C
Symbols
V
(BR)R
BAV19WS
120
BAV20WS
200
1.00
1.25
0.1
100
5
50
BAV21WS
250
Units
V
Maximum Forward Voltage
V
F
V
Maximum DC Reverse Current
at Rated DC Blocking Voltage
Typical Junction Capacitance
at V
R
=4V, f=1MHz
I
R
μA
pF
ns
C
j
t
rr
Maximum Reverse Recovery Time
2016.01
SOD323-K-BAV19WS/BAV20WS/BAV21WS
Page 1 of 3
山东晶导微电子有限公司
Jingdao Microelectronics
BAV19WS / BAV20WS / BAV21WS
Fig.1 Forward Current Derating Curve
Instaneous Reverse Current（
μ
A）
600
500
400
300
200
100
0.0
25
50
75
100
125
150
175
100
Fig.2 Typical Reverse Characteristics
Total Power Dissipation (mW)
T
J
=150
°C
10
1
0.1
T
J
=25
°C
0.01
00
20
40
60
80
100
120
Ambient Temperature (°C)
percent of Rated Peak Reverse Voltage (%)
Fig.3 Typical Instaneous Forward
Characteristics
Instaneous Forward Current (A)
Junction Capacitance ( pF)
1.0
100
Fig.4 Typical Junction Capacitance
T
J
=25
°C
0.1
10
0.01
0.0
T
J
=25
°C
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1
0.1
1.0
10
100
Instaneous Forward Voltage (V)
Reverse Voltage (V)
2016.01
www.sdjingdao.com
Page 2 of 3
山东晶导微电子有限公司
Jingdao Microelectronics
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
BAV19WS / BAV20WS / BAV21WS
SOD-323
E
E
b
A
D
∠ALL
ROUND
A
1
L
1
E
1
C
SOD-323 mechanical data
UNIT
max
mm
min
max
mil
min
32
3.1
47
63
100
9.8
7.9
0.8
43
0.08
5.9
1.2
55
1.4
70
2.55
108
0.25
16
0.2
A
1.1
C
0.15
D
1.4
E
1.8
E
1
2.75
b
0.4
L
1
0.45
A
1
0.2
∠
9°
16
8
The recommended mounting pad size
Marking
Type number
Marking code
A8
T2
T3
1.2
(47)
1.4
(55)
1.2
(47)
BAV19WS
BAV20WS
BAV21WS
1.2
(47)
Unit： mm
(mil)
2016.01
JD511132B5
Page 3 of 3
详细参数
全文预览
模拟电子
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
