Version: 1.2
Document code：SL0805 Low R
date
：2015-09-02
Page: 1 of 4
Surface-Mount Device
SL0805
ROHS
Feature
Resettable over current and over temperature protection
Small size of 0805
Small footprint
●
●
●
Low resistance
Fast time-to-trip
ROHS
complaint
Application
Part Numbering
Product Dimensions in Millimeter
Part Number
SL0805075
SL0805110
SL0805125
SL0805150
SL0805175
SL0805200
SL0805260
SL0805300
SL0805350
SL0805380
A
Min
Max
Min
B
Max
Min
C
Max
D
Min
E
Min
1.90
1.90
--
1.90
1.90
--
1.90
1.90
--
1.90
1.90
--
1.90
1.90
--
2.50
2.50
2.50
2.50
2.50
2.50
2.50
2.50
2.50
2.50
1.20
1.20
--
1.20
1.20
--
1.20
1.20
--
1.20
1.20
--
1.20
1.20
--
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
0.4
0.5
--
0.5
0.5
--
0.6
0.6
0.6
0.6
0.6
0.6
1.0
1.2
1.2
1.2
1.3
1.3
1.5
1.5
1.5
1.5
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
Polymer PTC Thermistor
Specifications are subject to change without notice
www.sealand-pptc.com
Version: 1.2
Document code：SL0805 Low R
date
：2015-09-02
Page: 2 of 4
Surface-Mount Device
Electrical Characteristics
I(A)
Part Number
SL0805075
SL0805110
SL0805125
SL0805150
SL0805175
SL0805200
SL0805260
SL0805300
SL0805350
SL0805380
25℃
Hold
0.75
1.10
1.25
1.50
1.75
2.00
2.60
3.00
3.50
3.80
Trip
1.5
2.2
2.5
3.0
3.5
4.0
5.2
6.0
7.0
7.6
V
max
--
(V)
6.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
I
max
--
(A)
50
50
50
50
50
50
50
50
50
50
Pd
typ
--
(W)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
SL0805
ROHS
T
trip
25℃
Current(A)
Time(S)
R
min
(Ω)
0.025
0.020
0.015
0.010
0.008
0.008
0.007
0.007
0.006
0.006
R
max
25℃
(Ω)
0.048
0.044
0.040
0.036
0.032
0.028
0.024
0.020
0.018
0.015
R
1max
(Ω)
0.080
0.075
0.070
0.065
0.060
0.055
0.050
0.045
0.040
0.035
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
0.3
0.5
1.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
I
H
=Hold current: maximum current at which the device will not trip at 25℃ or 60℃ still air reflow soldering of 260℃ for 20
sec.
I
T
=Trip current: minimum current at which the device will always trip at 25℃
still air reflow soldering of 260℃ for 20 sec.
V
max
=Maximum
continuous voltage device can withstand without damage at rated current
I
max
=Maximum fault current device can withstand without damage at rated voltage.
T
trip
=Maximum time to trip(s) at assigned current reflow soldering of 260℃ for 20 sec.
Pd
typ
=Typical power dissipation: typical amount of power dissipated by the device when in state air environment.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
max
= Maximum resistance of device in initial (un-soldered) state.
R
1max
=Maximum resistance of device at 25
℃
measured one hour after reflow soldering of 260℃ for 20 sec.
Value specified is determined by using the PWB with 0.030 *1.5oz coppertraces.
＂
Caution: Operation beyond the specified rating may result in damage and possible arcing andflame.
Environmental Specifications
Test
Recommended storage conditions
Passive aging:
Moisture Resistance
Thermal Shock
Vibration
Solvent Resistance
Moisture Level Sensitivity
Test Conditions
40°C max, 70% R.H. max
85°C, 1000 hours
85% RH,85℃,1000hrs
MIL-STD-202 Method 107G
+85ºC /-40ºC 20 times
MIL-STD-883C, Method 2007.1,
Condition A
MIL-STD-202, Method 215
J-STD-020C
Resistance Change/
Criteria
± 5%
≤ R
1max
≤ R
1max
≤ R
1max
± 5%
Appearance No change
Level 2a
Polymer PTC Thermistor
Specifications are subject to change without notice
www.sealand-pptc.com
Version: 1.2
Document code：SL0805 Low R
date
：2015-09-02
Page: 3 of 4
Surface-Mount Device
SL0805
Thermal Derating
[ Hold Current (A) at Ambient Temperature (℃)]
Part Number
SL0805075
SL0805110
SL0805125
SL0805150
SL0805175
SL0805200
SL0805260
SL0805300
SL0805350
SL0805380
Maximum Ambient Operating Temperature (℃)
-40
1.1
1.7
1.9
2.3
2.6
3.0
3.9
4.5
5.3
5.7
-20
1.0
1.4
1.6
2.0
2.3
2.6
3.4
3.9
4.6
4.9
0
0.8
1.2
1.4
1.7
1.9
2.2
2.9
3.3
3.9
4.2
25
0.75
1.10
1.25
1.50
1.75
2.00
2.60
3.00
3.50
3.80
40
0.7
1.0
1.1
1.4
1.6
1.8
2.3
2.7
3.2
3.4
50
0.6
0.8
0.9
1.1
1.2
1.4
1.8
2.1
2.5
2.7
60
0.5
0.7
0.8
1.0
1.1
1.3
1.7
2.0
2.3
2.5
ROHS
70
0.4
0.6
0.7
0.9
1.0
1.2
1.6
1.8
2.1
2.3
Solder Reflow Recommendation
Recommended reflow methods:IR,hot air oven ,nitrogen oven
Polymer PTC Thermistor
Specifications are subject to change without notice
www.sealand-pptc.com
Version: 1.2
Document code：SL0805 Low R
date
：2015-09-02
Page: 4 of 4
Surface-Mount Device
Devices can be cleaned using standard industry methods and solvents.
NOTE:
SL0805
ROHS
If reflow temperatures exceed the recommended profile,devices may not meet the performance requirements.
Caution:
Operation beyond the rated voltage or current may result in rupture electrical arcing or flame
Packaging Quantity and Marking
Device
SL0805075
SL0805110
SL0805125
SL0805150
SL0805175
SL0805200
SL0805260
SL0805300
SL0805350
SL0805380
Standard Quantity
(pcs)
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and
flame. The devices are intended for protection against occasional over-current or over temperature fault conditions and
should not be used when repeated fault conditions or prolonged trip events are anticipated. Device performance can be
impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical
procedures for electronic components.
Contact information
SEA & LAND ELECTRONI CORP.
13F., No.120-10, Sec. 3, Zhongshan Rd., Zhonghe
Dist., New Taipei City 235, Taiwan
Tel:886-2-82212567 Fax:886-2-22257268
Polymer PTC Thermistor
Rev. letter
Design
Check
Date
Audit
Approve
Specifications are subject to change without notice
www.sealand-pptc.com
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
