Huey Yang Distric,Huey Zhou City,Guang Dong516221,CHINA
Tel: 86-752-3562001
Fax:86-752-3558696
E-mail:service@atpptc.com
Submitted by:
Approved by:
DATE:
Chung Cheng
YC Lin
11-Apr-13
SEA & LAND ELECTRONIC CORP.
第1
页
Features
■
Surface Mount Devices
■
Lead free device
■
Size 3.2*2.5mm/0.12*0.10 inch
■
Surface Mount packaging
Applications
Almost anywhere there is a low voltage
power supply, up to 30V and a load to be
protected, including:
■
Computer mother board, Modem.
■
Telecommunication equipments.
for automated assembly
SMD1210-025
Performance Specification
I
hold
I
trip
P
d
Model
Marking
@25°C
@25°C
Typ.
(Vdc)
(A)
(A)
(A)
(W)
30
100
0.25
0.50
0.6
SMD1210-025
αC
Ihold
= Hold Current. Maximum current device will not trip in 25°C still air.
Itrip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax
= Maximum operating voltage device can withstand without damage at rated current (Imax).
Imax
= Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R1
max
= Maximum device resistance is measured one hour post reflow.
CAUTION :
Operation beyond the specified ratings may result in damage and possible arcing and flame.
V
max
I
max
Alpha-Top (Sea&Land Alliance)
Maximum
Time To Trip
Current
Time
(A)
(Sec)
8
0.02
Resistance
Ri
min
(Ω)
0.400
R1
max
(Ω)
4.500
Environmental Specifications
Test
Conditions
Passive aging
+85°C, 1000 hrs.
Humidity aging
+85°C, 85% R.H. , 168 hours
Thermal shock
+85°C to -40°C, 20 times
Resistance to solvent
MIL-STD-202,Method 215
Vibration
MIL-STD-202,Method 201
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
AGENCY APPROVALS :
Regulation/Standard:
UL pending
2002/95/EC
EN14582
I
hold
Versus Temperature
Model
SMD1210-025
-40°C
0.34
-20°C
0.31
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
0°C
25°C
40°C
50°C
60°C
0.28
0.25
0.21
0.19
0.17
70°C
0.15
85°C
0.12
第2
页
SMD1210-025
Construction And Dimension (Unit:mm)
Model
SMD1210-025
A
Min.
3.00
Max.
3.43
Min.
2.35
B
Max.
2.80
Min.
0.30
C
Max.
0.80
Alpha-Top (Sea&Land Alliance)
D
Min.
0.30
E
Min.
0.10
Dimensions & Marking
A
Recommended Pad Layout (mm)
1.0士0.1
1.0
士0.1
B
α
= Trademark
C = Part identification
D
E
C
2.0士0.1
Termination Pad Characteristics
Terminal pad materials：
Terminal pad solderability：
Tin-plated Nickel-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Rework
Use standard industry practices, the removal device must be replaced with a fresh one.
Thermal Derating Curve
Derating Curves for SMD1210 Series
Percentage of Derated Current
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
Typical Time-To-Trip At 25°C
Average Time Current Curves
0.75
100
Time In Second
10
1
0.1
0.05A
0.20A
0.35A
0.50A
1.10A
0.01
0.1
Temperature (°C)
1
Current In Amperes
10
1.50A
0.10A
· Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
· PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are
anticipated.
· Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
· Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
· Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
· Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices. PPTC SMD can be cleaned by standard
methods.
· Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profile could negatively impact solderability
performance of our devices.
第3
页
2.5
士
0.1
C
SMD1210-025
Recommended Solder Reflow Conditions
300
250
200
190
160
100
0
60-120 sec.
30~60sec.
120 sec.
Alpha-Top (Sea&Land Alliance)
Soldering
Cooling
‧Recommended
reflow methods：IR, vapor phase oven, hot air oven.
‧Devices
are not designed to be wave soldered to the bottom side
of the board.
‧Recommended
maximum paste thickness is 0.25 mm (0.010 inch).
‧Devices
can be cleaned using standard method and solvents.
Note：If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
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