d. Maximum under steady state conditions is 90 °C/W (n-channel) and 90 °C/W (p-channel).
1
VBA5102M
www.VBsemi.com
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate Threshold Voltage
Gate-Body Leakage
V
DS
V
DS
/T
J
V
GS(th)
/T
J
V
GS(th)
I
GSS
V
GS
= 0 V, I
D
= 250 μA
V
GS
= 0 V, I
D
= -250 μA
I
D
= 250 μA
I
D
= -250 μA
I
D
= 250 μA
I
D
= -250 μA
V
DS
= V
GS
, I
D
= 250 μA
V
DS
= V
GS
, I
D
= -250 μA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 100 V, V
GS
= 0 V
Zero Gate Voltage Drain Current
I
DSS
V
DS
= -100 V, V
GS
= 0 V
V
DS
= 100 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
= -100 V, V
GS
= 0 V, T
J
= 55 °C
On-State Drain Current
b
I
D(on)
V
DS
= 5 V, V
GS
= 10 V
V
DS
= -5 V, V
GS
= -10 V
V
GS
= 10 V, I
D
= 2 A
Drain-Source On-State Resistance
b
R
DS(on)
V
GS
= -10 V, I
D
= -2 A
V
GS
= 4.5 V, I
D
= 1.5 A
V
GS
= -4.5 V, I
D
= -1 A
Forward Transconductance
b
Dynamic
a
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
iss
N-Channel
V
DS
= 50 V, V
GS
= 0 V, f = 1 MHz
C
oss
P-Channel
V
DS
= -50 V, V
GS
= 0 V, f = 1 MHz
C
rss
V
DS
= 50 V, V
GS
= 10 V, I
D
=
2.5
A
Total Gate Charge
Q
g
V
DS
= -50 V, V
GS
= -10 V, I
D
= -2.3 A
N-Channel
V
DS
= 50 V, V
GS
= 4.5 V, I
D
=
2.5
A
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Q
gs
Q
gd
R
g
P-Channel
V
DS
= -50 V, V
GS
= -4.5 V, I
D
= -2 A
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
f = 1 MHz
N-Ch
P-Ch
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.6
3
600
510
130
65
20
40
12
24
5
12
2.5
3.8
3.5
5
3.3
13
-
-
-
-
-
-
-
-
-
-
-
-
-
-
6.6
26
nC
pF
g
fs
V
DS
= 15 V, I
D
= 2 A
V
DS
= -15 V, I
D
= -2 A
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
100
-100
-
-
-
-
1.5
-1.0
-
-
-
-
-
-
10
-10
-
-
-
-
-
-
-
-
70
-103
-5.7
4.5
-
-
-
-
-
-
-
-
-
-
0.240
0.
490
0.260
0.
530
8
9.3
-
-
-
-
-
-
3.0
-2.5
100
-100
1
-1
10
-10
-
-
-
-
-
-
-
-
S
A
μA
V
nA
mV/°C
V
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
2
VBA5102M
www.VBsemi.com
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Dynamic
a
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
a
SYMBOL
TEST CONDITIONS
N-Ch
N-Channel
V
DD
= 50 V, R
L
= 13.8
Ω
I
D
≅
2.6
A, V
GEN
= 10 V, R
g
= 1
Ω
P-Channel
V
DD
= -50 V, R
L
= 12.5
Ω
I
D
≅
-2 A, V
GEN
= -10 V, R
g
= 1
Ω
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
N-Channel
V
DD
= 50 V, R
L
= 13.8
Ω
I
D
≅
2.6
A, V
GEN
= 4.5 V, R
g
= 1
Ω
P-Channel
V
DD
= -50 V, R
L
= 12.5
Ω
I
D
≅
-2 A, V
GEN
= -4.5 V, R
g
= 1
Ω
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
I
S
=
2.6
A
I
S
= -2 A
N-Ch
P-Ch
N-Ch
P-Ch
N-Channel
I
F
=
2.6
A, dI/dt = 100 A/μs, T
J
= 25 °C
P-Channel
I
F
= -2 A, dI/dt = -100 A/μs, T
J
= 25 °
C
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
MIN.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
5
7
11
11
12
65
6
20
32
55
73
80
14
42
12
25
-
-
-
-
0.83
-0.8
30
42
27
93
19
36
11
6
MAX.
10
15
-
20
25
130
15
40
65
110
150
160
30
85
25
50
3
-2.5
30
-20
1.2
-1.2
60
85
55
190
-
-
-
-
UNIT
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
ns
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
T
F
= 25 °C
A
V
ns
nC
ns
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width
300 μs, duty cycle
2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
FPGA/CPLD
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