d. Maximum under Steady State conditions is 85 °C/W.
t
≤
10 s
Steady State
Symbol
R
thJA
R
thJF
Typical
39
25
Maximum
55
29
Unit
°C/W
1
VBA1311
www.VBsemi.com
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 9 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 9 A
0.8
15
6
8
7
T
C
= 25 °C
10
50
1.2
30
12
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 1.4
Ω
I
D
≅
9 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 15 V, R
L
= 1.4
Ω
I
D
≅
9 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
0.36
V
DS
= 15 V, V
GS
= 10 V, I
D
= 10 A
V
DS
= 15 V, V
GS
= 5 V, I
D
= 10 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
800
165
73
15
6.8
2.5
2.3
1.8
16
12
16
10
8
10
16
8
3.6
23
16
22
18
16
20
22
15
ns
Ω
23
10.2
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 10 A
V
GS
= 4.5 V, I
D
=
9
A
V
DS
= 15 V, I
D
= 10 A
20
0.008
0.011
50
S
1.0
30
26
-6
3.0
± 100
1
10
V
mV/°C
V
nA
µA
A
Ω
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2
VBA1311
www.VBsemi.com
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
50
V
GS
= 10 thru 4 V
40
I
D
- Drain Current (A)
I
D
- Drain Current (A)
4
T
C
= - 55 °C
3
5
30
20
V
GS
= 3 V
10
2
T
C
= 25 °C
1
T
C
= 125 °C
0
0
2
4
6
8
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
V
DS
- Drain-to-Source Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Output Characteristics
0.012
V
GS
= 4.5 V
R
DS(on)
- On-Resistance (Ω)
0.010
900
0.008
V
GS
= 10 V
0.006
C - Capacitance (pF)
1200
Transfer Characteristics
C
iss
600
300
0.004
C
rss
0
6
C
oss
0.002
0
10
20
30
40
50
0
12
18
24
30
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 11 A
V
GS
- Gate-to-Source Voltage (V)
8
R
DS(on)
- On-Resistance
1.5
1.8
I
D
= 11 A
Capacitance
6
V
DS
= 24 V
4
(Normalized)
V
DS
= 15 V
V
GS
= 10 V
1.2
V
GS
= 4.5 V
0.9
2
0
0
4
8
12
16
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
3
VBA1311
www.VBsemi.com
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.030
T
J
= 150 °C
1
T
J
= 25 °C
R
DS(on)
- On-Resistance (Ω)
10
I
S
- Source Current (A)
0.025
0.020
T
J
= 125 °C
0.015
0.1
0.010
T
J
= 25 °C
0.005
0.01
0.001
0.0
0.000
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
10
V
SD
- Source-to-Drain Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
2.2
50
On-Resistance vs. Gate-to-Source Voltage
2.0
40
1.8
Power (W)
V
GS(th)
(V)
I
D
= 250 µA
1.6
30
20
1.4
10
1.2
1.0
- 50
- 25
0
25
50
75
100
125
150
0
10
- 3
10
- 2
10
- 1
1
10
100
600
T
J
- Temperature (°C)
Time (s)
Threshold Voltage
100
Limited by R
DS(on)
*
Single Pulse Power, Junction-to-Ambient
100 µA
10
I
D
- Drain Current (A)
1 ms
1
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
BVDSS Limited
0.01
0.1
1
10
100
1s
10 s
DC
V
DS
- Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
4
VBA1311
www.VBsemi.com
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
18
15
I
D
- Drain Current (A)
12
9
6
3
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
6
2.0
5
1.5
4
Power (W)
Power (W)
0
25
50
75
100
125
150
3
1.0
2
0.5
1
0
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
A
- Ambient Temperature (°C)
Power Derating, Junction-to-Foot
Power Derating, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
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