d. Maximum under Steady State conditions is 110 °C/W.
1
VBZA9936
www.VBsemi.com
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 5 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 2 A, V
GS
= 0 V
0.8
11
4
7
4
T
C
= 25 °C
2.25
24
1.2
20
8
A
V
ns
nC
ns
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 15 V, R
L
= 3
Ω
I
D
≅
5 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 15 V, R
L
= 3
Ω
I
D
≅
5 A, V
GEN
= 4.5 V, R
g
= 1
Ω
f = 1 MHz
0.8
V
DS
= 15 V, V
GS
= 10 V, I
D
= 5 A
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 5 A
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 30 V, V
GS
= 0 V
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 10 V
V
GS
=
10 V, I
D
= 5 A
V
GS
=
4.5 V, I
D
= 4 A
V
DS
= 10 V, I
D
= 5 A
10
0.022
0.026
16
586
117
55
15
3.7
1.4
1.05
4.3
12
55
11
8
4
9
10
6
8.6
24
100
22
16
8
18
20
12
ns
Ω
5.6
nC
pF
1.0
30
32
- 5.0
2.5
± 100
1
10
µA
A
Ω
S
mV/°C
V
nA
V
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2
VBZA9936
www.VBsemi.com
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
30
V
GS
= 10 V thru 5 V
24
I
D
- Drain Current (A)
V
GS
= 4 V
I
D
- Drain Current (A)
8
10
18
6
12
4
T
C
= 25 °C
2
T
C
= 125 °C
T
C
= - 55 °C
6
V
GS
= 3 V
0
0.0
0
0.5
1.0
1.5
2.0
2.5
0
1
2
3
4
5
V
DS
- Drain-to-Source Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Output Characteristics
0.080
550
Transfer Characteristics
C
iss
R
DS(on)
- On-Resistance (Ω)
0.064
C - Capacitance (pF)
440
0.048
330
0.032
V
GS
= 4.5 V
220
C
oss
110
C
rss
0.016
V
GS
= 10 V
0.000
0
6
12
18
24
30
0
0
6
12
18
24
30
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
10
I
D
= 5 A
V
GS
- Gate-to-Source Voltage (V)
8
V
DS
= 10 V
6
V
DS
= 15 V
4
V
DS
= 20 V
2
R
DS(on)
- On-Resistance
1.5
1.7
I
D
= 5 A
Capacitance
V
GS
= 10 V
(Normalized)
1.3
V
GS
= 4.5 V
1.1
0.9
0
0.0
1.7
3.4
5.1
6.8
8.5
0.7
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
3
VBZA9936
www.VBsemi.com
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.15
I
D
= 5 A
I
S
- Source Current (A)
T
J
= 150 °C
1
T
J
= 25 °C
0.1
R
DS(on)
- On-Resistance (Ω)
10
0.12
0.09
0.06
T
J
= 125 °C
0.03
T
J
= 25 °C
0.01
0.001
0.0
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0
1
2
3
4
5
6
7
8
9
10
V
SD
- Source-to-Drain Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
0.5
50
On-Resistance vs. Gate-to-Source Voltage
0.2
V
GS(th)
Variance (V)
40
- 0.1
I
D
= 5 mA
- 0.4
I
D
= 250 µA
- 0.7
Power (W)
30
20
10
- 1.0
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited by R
DS(on)
*
10
I
D
- Drain Current (A)
Single Pulse Power
1 ms
1
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
0.01
0.1
1
1s
10 s
DC
BVDSS Limited
10
100
V
DS
- Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
4
VBZA9936
www.VBsemi.com
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
7.5
6.0
I
D
- Drain Current (A)
4.5
3.0
1.5
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
3.5
1.5
2.8
1.2
Power (W)
1.4
Power (W)
0
25
50
75
100
125
150
2.1
0.9
0.6
0.7
0.3
0.0
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
A
- Ambient Temperature (°C)
Power, Junction-to-Foot
Power, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dis-
sipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
我在用platform builder5.0定制 OS Image时总出现下面的2个错误：
BUILD: oal_power_s3c2440a.lib(off.obj) : error LNK2019: unresolved external symbol OALCPUPowerOff referenced in fun ......
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