Sunlord
Categories: general confidential
Specifications for Wire Wound Molded SMD Power Inductors
Page 1 of 14
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Revised]
SPEC No.:MWSA05170000
Wire Wound Molded SMD Power Inductors
MWSA Series
【
This SPEC is total 14 pages including specifications and appendix.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China
518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Date:
Restricted
Rejected
Checked By
Re-checked By
Comments:
Sunlord
Categories: general confidential
Specifications for Wire Wound Molded SMD Power Inductors
Page 2 of 14
【Version
change history】
Rev.
01
Effective Date
/
Changed Contents
New release
Change Reasons
/
Approved By
Hai Guo
Sunlord
1.
Scope
Categories: general confidential
Specifications for Wire Wound Molded SMD Power Inductors
Page 3 of 14
This specification applies to MWSA series of wire wound molded SMD power Inductors
2.
Product Description and Identification (Part Number)
1)
2)
Description
Wire Wound Molded SMD Type Power Inductor, MWSAXXXX, XX
μH±
X% @XXX KHz/XXXV, XXXmΩ, XXXm A.
Product Identification (Part Number)
MWSA
①
①
XXXX
②
Type
Wire wound molded SMD power
Inductors
X
③
-XXX
④
□
⑤
T
⑥
③
X
Configuration
X Type
MWSA
②
External Dimensions (mm)
0412~1206
④
Example
1R0
100
101
Nominal Inductance
Nominal Value
1.0μH
10μH
100μH
⑤
M
⑥
T
Inductance Tolerance
±20%
Packing
Tape Carrier Package
3.
Electrical Characteristics
Please refer to
Appendix A.
1)
2)
Operating temperature range (Including self-heating): -55
℃
~+125℃.
Storage temperature and humidity range (product with tapping ): -10
℃
~+40
℃
, RH 70% Max.
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1
and
Table 4-1.
4.
Shape and Dimensions
1)
D
E
Fig. 4-1
Series
MWSA0410
MWSA0412
MWSA0415
MWSA0402
MWSA0515
MWSA0518
MWSA0503
MWSA0618
MWSA0624
MWSA0603
MWSA1004C
MWSA1004
MWSA1204
MWSA1205
MWSA1206
A
4.2±0.3
4.2±0.3
4.2±0.3
4.2±0.3
5.2±0.3
5.2±0.3
5.2±0.3
6.6±0.3
6.6±0.3
6.6±0.3
10.5±0.5
10.5±0.5
12.8±0.5
12.8±0.5
12.8±0.5
B
4.4±0.35
4.4±0.35
4.4±0.35
4.4±0.35
5.4±0.3
5.4±0.3
5.4±0.3
7.1±0.4
7.1±0.4
7.1±0.4
11.5±1.0
11.5±1.0
13.5±1.0
13.5±1.0
13.5±1.0
C max.
1.0
1.2
1.5
2.0
1.5
1.8
3.0
1.8
2.4
3.0
4.0
4.0
4.0
5.0
6.5
D
0.8±0.3
0.8±0.3
0.8±0.3
0.8±0.3
1.20±0.3
1.20±0.3
1.20±0.3
1.60±0.3
1.60±0.3
1.60±0.3
2.5±0.3
2.5±0.3
2.0±0.3
2.0±0.3
2.0±0.3
E
2.0±0.3
2.0±0.3
2.0±0.3
2.0±0.3
2.2±0.3
2.2±0.3
2.2±0.3
3.0±0.3
3.0±0.3
3.0±0.3
3.0±0.3
3.0±0.3
5.0±0.3
See Remarks
3.85±0.3
I typ.
1.5.
1.5.
1.5
1.5.
1.9
1.9
1.9.
2.2.
2.2
2.2.
3.5
3.5
4.5
4.5
4.5
J typ.
2.2
2.2
2.2
2.2
2.2
2.2
2.2
3.7
3.7
3.7
6.0
6.0
6.0
6.0
6.0
Unit: mm
H typ.
2.5
2.5
2.5
2.5
2.5
2.5
2.5
3.5
3.5
3.5
4.0
4.0
5.0
5.0
5.0
Sunlord
Remarks：
Categories: general confidential
Specifications for Wire Wound Molded SMD Power Inductors
Page 4 of 14
Dimensions
Code
R36/R50/R68
1R0/1R5/2R2
E
3.85±0.5
3R3/100/150
220/330/470
5.0±0.5
Structure and Components: See
Table 4-2
Table 4-2]
Symbol
a
b
c
d
5.
Components
MARKING
CORE
WIRE
Terminal
Ink(black)
Alloy Sponge Powder
Polyurethane copper wire
Copper plated with Sn
Material
Test and Measurement Procedures
5.1 Test Conditions
5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
a.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86 KPa to 106 KPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86KPa to 106 KPa
Inspection Equipment: 10 X magnifier
5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
5.2 Visual Examination
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a.
b.
a.
b.
a.
b.
c.
Refer to
Appendix A.
Test equipment (Analyzer): HIOKI3540 or equivalent.
Refer to
Appendix A.
Test equipment: Wayne kerr3260+3265B or equivalent.
Refer to
Appendix A.
Test equipment: Wayne kerr3260+3265B, Agilent E3633A, R2M-2H3 or equivalent.
Definition of Rated Current (Ir): With the condition of the DC current pass, the inductance decrease by 30% of
standard value, compare to the temperature rise by 40
℃
, the smaller is Rated Current.(reference environment
temperature:20
℃
)
5.4 Reliability Test
Item
5.4.1
Terminal Strength
Requirements
No removal or split of the termination or
other defects shall occur.
①
②
③
Test Methods and Remarks
Apply pull force to axis direction.
Applied force: 5 N.
Keep time: 10±1s
the
5.3.2 Inductance (L)
5.3.3 Rated Current
5.4.2
Vibration
①
②
No visible mechanical damage.
Inductance change: within ±5%.
①
The test samples shall be soldered to the board. Then it
shall be submitted to below test conditions.
Fre. Range
Total
Amplitude
Sweeping
Method
Time
For 2 hours on each X,Y,Z axis.
10~55Hz
1.5mm(May not exceed acceleration
196 m/s )
10Hz to 55Hz to 10Hz for 1 min.
2
②
Recovery: At least 2 hours of recovery under the
standard condition after the test, followed by the
measurement within 24 hours.
Sunlord
5.4.3
Categories: general confidential
Specifications for Wire Wound Molded SMD Power Inductors
①
②
Between -55
℃
and +125℃
With a reference value of +20℃
Page 5 of 14
Inductance change: within ±10%.
Temperature
Characteristic
5.4.4
Solderability
90% or more of mounting terminal side shall
①
be covered with fresh solder.
②
③
Solder Temperature: 240±5℃
Keep time: 3±0.5s
Immersion depth: from the main bode to 1.5mm
Solder Temperature: 255±5
℃
.
Keep time:5±1s
Time: 2 times
Immersion depth: from the main bode to 1.5mm
Recovery: At least 2 hours of recovery under the
standard condition after the test, followed by the
measurement within 24 hours.
5.4.5
Resistance to
Soldering Heat
①
②
No visible mechanical damage.
Inductance change: within ±10%.
①
②
③
④
⑤
5.4.6
Thermal Shock
①
②
No visible mechanical damage.
Inductance change: within ±10%.
①
The test samples shall be placed at specified
temperature for specified time by step 1 to step 2 as
shown in below table in sequence.
Step
1
2
Temperature(℃)
-55
+125
Duration(min)
30 3
30±3
②
③
④
Transforming interval: Max.20 sec
Test cycle: 10cycles.
Recovery: At least 2 hours of recovery under the
standard condition after the test, followed by the
measurement within 24 hours.
5.4.7
Temperature
①
No visible mechanical damage.
Inductance change: within ±10%.
①
The test samples shall be submitted to below test
conditions.
Temperature
Time
-55±3℃
500±24hour
Resistance to Low
②
②
Recovery: At least 2 hours of recovery under the
standard condition after the test, followed by the
measurement within 24 hours.
5.4.8
Loading Under
Damp Heat
①
②
No visible mechanical damage.
Inductance change: within ±10%.
①
The test samples shall be submitted to below test
conditions.
Temperature
Humidity
Applied current
Time
60±2℃
90~95%RH
Rated cu rent
500±24hour
②
Recovery: At least 2 hours of recovery under the
standard condition after the test, followed by the
measurement within 24 hours.
5.4.9
Resistance to
High Temperature
①
②
No visible mechanical damage.
Inductance change: within ±10%.
①
The test samples shall be submitted to below test
conditions.
Temperature
Time
125±3℃
500±24hour
②
Recovery: At least 2 hours of recovery under the
standard condition after the test, followed by the
measurement within 24 hours.
5.4.10
Loading at
High Temperature
(Life Test)
①
②
No visible mechanical damage.
Inductance change: within ±10%.
①
The test samples shall be submitted to below test
conditions.
Temperature
Applied current
Time
85±3℃
Rated current
500±24hour
②
Recovery: At least 2 hours of recovery under the
standard condition after the test, followed by the
measurement within 24 hours.
6.
Packaging, Storage and Transportation
6.1 Tape Carrier Packaging:
Packaging code: T
NXP MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
