Sunlord
Wire Wound Chip Ceramic Inductor
Page 1 of 16
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Revised]
SPEC No.: SDWL06150000
Wire Wound Chip Ceramic Inductor
SDWL1608C
STFM
This SPEC is total 16 pages including specifications and appendix.
RoHS Compliant Parts
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address:Sunlord Industrial Park,Dafuyuan Industrial Zone,Guanlan,Shenzhen,China 518110
Tel: 0086-755-82400574
Fax:0086-755-82269029
E-Mail:sunlord@sunlordinc.com
For Customer approval Only
Qualification Status:
Full
Approved By
Verified By
Date:
Restricted
Re-checked By
Rejected
Checked By
Comments:
Sunlord
Wire Wound Chip Ceramic Inductor
Version change history
Page 2 of 16
Rev.
01
Effective Date
/
Changed Contents
New release
Change reasons
/
Approved By
Jingxin Huang
Sunlord
Wire Wound Chip Ceramic Inductor
Precautions
Page 3 of 16
1. Magnetic materials shall be far away from parts to avoid impacts on their electrical characteristics.
2. Parts could be damaged by external mechanical pressure or stacked heavy objects, as well as strong shaking & dropping.
3. Please do not store parts in bulk to prevent coils and parts being damaged.
4. Oversized external force to parts on PCB may lead to parts being damaged or slipped off.
5. Please do not use parts on edge or top of PCB board in your design to avoid parts being damaged during PCB is moved.
6. Please use flux contained with resin since the highly acidic (Chlorine content more than 0.2 wt%) or water-soluble one could damage
the insulation film of wires, then causing short circuit of parts.
7. Please do not use the brush to clean product or its surroundings. If you use the brush to clean product or its surroundings on
PCB,copper wire may be broke, causing the product open .
Sunlord
Caution
Wire Wound Chip Ceramic Inductor
Page 4 of 16
All products listed in this specification are developed, designed and intended for use in general electronics equipment. The
products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or
quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society,
person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in
any of the applications below. Please contact us for more details if you intend to use our products in the following applications.
1. Aircraft equipment
2. Aerospace equipment
3. Undersea equipment
4. nuclear control equipment
5. military equipment
6. Power plant equipment
7. Medical equipment
8. Transportation equipment (automobiles, trains, ships,etc.)
9. Traffic signal equipment
10. Disaster prevention / crime prevention equipment
11. Data-processing equipment
12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
Sunlord
1.
Scope
This specification applies to the SDWL1608C
2.
Wire Wound Chip Ceramic Inductor
STFM
of Wire Wound Chip Ceramic Inductor.
Page 5 of 16
Product Description and Identification (Part Number)
1)
2)
Description
Wire Wound Chip Ceramic Inductor, 1608, XXX nH± X% @XXXMHz, XXXΩ, XXX mA
Product Identification (Part Number)
SDWL
1608
C
S
T
F
M
Type
SDWL
Wire Wound Chip Inductor
External Dimensions [L X W] (mm)
1608
1.6 X 0.8
Material Code
C
Ceramic
Nominal Inductance (nH)
Example
1N0
Nominal Value
1.0
10
100
Inductance Tolerance
C
D
G
J
±0.2nH
±0.5nH
±2%
±5%
10N
R10
Product Classification Code
S
Sn Plating
Five-faces Coating
Packing
B
T
Bulk Package
Tape & Reel
HSF Products
Hazardous Substance Free Products
Internal Code
M01
M11
3.
Electrical Characteristics
Please refer to Item 5.
1)
2)
4.
Operating and storage temperature range (individual chip without packing): -40
Storage temperature range (packaging conditions): -10
~+40
to +125
and RH 70% (Max.)
Normal
High Q & Low DCR
Shape and Dimensions
1)
Dimensions: See the following.
.
Unite
A
1.6±0.2
B
0.9±0.2
C
0.8±0.2
D
REF.
0.38
E
0.8±0.15
F
0.3±0.1
H
REF.
1.02
I
REF.
0.64
mm
J
REF.
0.64
2)
Electrode
Coplanarity:0.1mm Max.
FPGA/CPLD
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