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Categories: general confidential
Specifications for Multi-layer Chip Power Inductor
Page 1 of 11
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
Rev.
01
Multi-layer Chip Power Inductor
MCL1608N Series
New Released,
Effective Date
/
Revised]
Changed Contents
New release
SPEC No.: MCL01190000
Change Reasons
/
Approved By
Hai Guo
【
This SPEC is total 11 pages.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafu Industrial Zone, Baoan, Shenzhen, China
518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Date:
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Re-checked By
Comments:
Sunlord
Caution
Categories: general confidential
Specifications for Multi-layer Chip Power Inductor
Page 2 of 11
All products listed in this specification are developed, designed and intended for use in general electronics equipment. The
products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or
quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person,
or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the
applications below. Please contact us for more details if you intend to use our products in the following applications.
1. Aircraft equipment
2. Aerospace equipment
3. Undersea equipment
4. nuclear control equipment
5. military equipment
6. Power plant equipment
7. Medical equipment
8. Transportation equipment (automobiles, trains, ships,etc.
9. Traffic signal equipment
10. Disaster prevention / crime prevention equipment
11. Data-processing equipment
12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
Sunlord
1.
Scope
Categories: general confidential
Specifications for Multi-layer Chip Power Inductor
Page 3 of 11
This specification applies to MCL1608N Series of multi-layer chip power inductors.
2.
Product Description and Identification (Part Number)
1)
2)
Description
MCL1608N Series of multi-layer chip power inductors
Product Identification (Part Number)
MCL
①
①Type
MCL
Monolithic Type Power Inductor
1608
②
N
③
R16
④
J
⑤
T
⑥
②External
Dimensions (L x W) (mm)
1608
1.6×0.8
④Nominal
Inductance
③
Application
Type
N
Near Field Communication
Example
R16
R56
Nominal Value
0.16μH
0.56μH
⑤Inductance
Tolerance
J
K
M
3.
Electrical Characteristics
Please refer to
Appendix A
(Page 9).
1)
2)
Operating and storage temperature range (individual chip without packing): -40
℃
~ +85
℃
Storage temperature range (packaging conditions): -10
℃
~+40
℃
and RH 70% (Max.)
±5%
±10%
±20%
⑥Packing
T
Tape Carrier Package
4.
Shape and Dimensions
1)
2)
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1, Fig.4-2
and
Table 4-1.
Structure: See
Fig. 4-3
and
Fig. 4-4.
Chip inductor
C
Solder-resist
Land pattern
B
A
B
Fig. 4-2
Unit: mm [inch]
a
0.3±0.2
[0.012±0.008]
A
0.60~0.80
B
0.60~0.80
C
0.60~0.80
Fig. 4-1
[Table
4-1]
Type
1608
[0603]
L
1.60±0.15
[0.063±0.006]
W
0.8±0.15
[0.031±0.006]
T
0.8±0.15
[0.031±0.006]
Structure of
Electro-plating
T
④-2
Ferrite
T
①
Ferrite for MCL Series
②
Internal electrode (Ag)
a
L
a
Sn
Ni
Ag
Fig. 4-4
③
Pull out electrode( Ag)
④-1
Terminal electrode: Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
W
④-1
①
②
③
Fig. 4-3
④
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3)
Categories: general confidential
Specifications for Multi-layer Chip Power Inductor
[Table 4-2]
Page 4 of 11
Material Information: See
Table 4-2.
Code
①
②
③
④-1
④-2
Part Name
Ferrite Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ferrite Powder
Silver Paste
Silver Paste
Termination Silver Composition
Plating Chemicals
5.
Test and Measurement Procedures
5.1 Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
a.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86kPa to 106kPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86kPa to 106kPa
Inspection Equipment: 20× magnifier
If any doubt on the results, measurements/tests should be made within the following limits:
5.2 Visual Examination
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a.
b.
a.
b.
c.
d.
a.
b.
c.
Refer to
Appendix A.
Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-HP4291B+HP16192A or equivalent.
Test signal: -20dBm or 50mV.
Test frequency refers to
Appendix A.
Refer to
Appendix A.
Test equipment (see
Fig. 5.3.3-1):
Electric Power, Electric current meter, Thermometer.
Measurement method (see
Fig. 5.3.3-1):
1. Set test current to be 0mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
4. Definition of Temperature Rise Current（Irms）: Irms is direct electric current as chip surface temperature rose just25℃
against chip initial surface temperature (Ta) (see
Fig. 5.3.3-2)
5.3.2 Inductance (L)
5.3.3 Temperature Rise Current（Irms）
Electric Power
Electric
Thermometer
Temperature (℃)
+25
Ta
I (mA)
Irms
Current Meter
Chip
R
0
Fig. 5.3.3-1
Fig. 5.3.3-2
5.3.4 Saturation Current（Isat）
a.
b.
c.
Refer to
Appendix A.
Test equipment: HP6632B system DC power supply, HP4291B+HP16192A+HP16200A or equivalent.
Measurement method:
1.
2.
Measurement conditions of initial inductance L: Measuring Frequency: 25MHz.
Test Current: 1mA.
Definition of Saturation Current
（Isat）
Isat is the value of DC current as inductance L (nH) decreased just 10% against
:
initial value (see
Fig. 5.3.4-1).
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Categories: general confidential
Specifications for Multi-layer Chip Power Inductor
Page 5 of 11
+L
0
90% L
0
0
Isat
Fig. 5.3.4-1
5.3.5Self-Resonant Frequency (SRF)
a.
b.
c.
Refer to
Appendix A.
I (mA)
Test equipment: High Accuracy RF Impedance /Material Analyzer-HP4291B+HP16192A or equivalent.
Test signal: -20dBm or 50 mV.
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