Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 1 of 10
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Revised]
SPEC No.: GZ10190034
天河星
Multi-layer Chip Ferrite Bead
GZ3216D500TF
【
This SPEC is total 10 pages including specifications and appendix.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Restricted
Date:
Rejected
Checked By
Re-checked By
Comments:
Sunlord
【Version
change history】
Rev.
01
Effective Date
Mar.04,2019
Specifications for Multi-layer Chip Ferrite Bead
Page 2 of 10
Changed Contents
New release
Change Reasons
/
Approved By
Hai Guo
Sunlord
Caution
Specifications for Multi-layer Chip Ferrite Bead
Page 3 of 10
All products listed in this specification are developed, designed and intended for use in general electronics equipment. The
products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or
quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society,
person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in
any of the applications below. Please contact us for more details if you intend to use our products in the following applications.
1. Aircraft equipment
2. Aerospace equipment
3. Undersea equipment
4. nuclear control equipment
5. military equipment
6. Power plant equipment
7. Medical equipment
8. Transportation equipment (automobiles, trains, ships,etc.)
9. Traffic signal equipment
10. Disaster prevention / crime prevention equipment
11. Data-processing equipment
12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
Sunlord
1.
Specifications for Multi-layer Chip Ferrite Bead
Page 4 of 10
Scope
This specification applies to GZ3216D500TF of multi-layer ferrite chip bead.
Product Description and Identification (Part Number)
1)
Description:
GZ3216D500TF of multi-layer ferrite chip bead.
2)
Product Identification (Part Number)
GZ
3216
D
500
T
F
①
②
③
④
⑤
⑥
①
GZ
Type
For General Use
②
External Dimensions
3216 [1206]
(L X W)[mm]
3.2 X 1.6
2.
③
Material Code
D
④
Example
500
Nominal Impedance
Nominal Value
50Ω
⑤
T
Packing
Tape Carrier Package
⑥
HSF Products
Hazardous Substance Free Products
3.
Electrical Characteristics
Part Number
GZ3216D500TF
Impedance (Ω)
50±25%
Z Test Freq.
(MHz)
100
DCR
(Ω) Max.
0.10
Ir
(mA) Max.
1000
Impedance Frequency Characteristics
GZ3216D500TF
160
120
Impedance(Ω)
Z
80
R
40
X
0
1
10
100
1000
3000
Frequency(MHz)
1)
2)
Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃.
Storage temperature range (packaging conditions):-10℃~+40℃ and RH 70% (Max.)
Sunlord
4.
Specifications for Multi-layer Chip Ferrite Bead
Page 5 of 10
Shape and Dimensions
1)
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1, Fig.4-2
and
Table 4-1.
2)
Structure: See
Fig. 4-3
and
Fig. 4-4.
Chip Bead
C
Solder-resist
Land pattern
B
A
B
Fig. 4-2
Unit: mm [inch]
a
0.5±0.3
[0.020±0.012]
A
1.80~2.50
B
1.00~1.50
C
1.20~2.00
Fig. 4-1
[Table
4-1]
Type
3216
[1206]
L
3.2±0.2
[0.126±0.008]
W
1.6±0.2
[0.063±0.008]
T
0.85±0.2
[0.033±0.008]
Structure of
Electro-plating
T
Sn
④-2
Ferrite
①
Ferrite for Bead Series
②
Internal electrode (Ag)
③
Pull out electrode( Ag)
④-1
Terminal electrode: Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
L
a
a
T
W
Ni
Ag
Fig. 4-4
①
②
③
Fig. 4-3
④
④-1
3)
Material Information: See
Table 4-2.
[Table 4-2]
Code
①
②
③
④-1
④-2
Part Name
Ferrite Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ferrite Powder
Silver Paste
Silver Paste
Termination Silver
Composition
Plating Chemicals
5.
Test and Measurement Procedures
5.1 Test Conditions
5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65±20%
c. Air Pressure: 86kPa to 106kPa
5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 20±2℃
b. Relative Humidity: 65±5%
c. Air Pressure: 86kPa to 106kPa
5.2 Visual Examination
a. Inspection Equipment: 20× magnifier
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a. Refer to
Item 3.
b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
5.3.2 Impedance (Z)
a. Refer to
Item 3.
b. Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A or equivalent.
Test fixture: HP16197A for 0603, HP16192A for 1005/1608/2012/3216.
Test signal: -20dBm or 50mV
c. Test frequency refers to
Item 3.
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