Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 1 of 16
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
Rev.
01
Multi-layer Chip Ferrite Bead
GZ Series
New Released,
Effective Date
Revised]
Changed Contents
New release
SPEC No.: GZ110000
Change Reasons
/
Approved By
Hai Guo
【
This SPEC is total 16 pages including specifications and appendix.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Date:
Restricted
Rejected
Checked By
Re-checked By
Comments:
Sunlord
1.
Scope
Specifications for Multi-layer Chip Ferrite Bead
Page 2 of 16
This specification applies to GZ Series of multi-layer ferrite chip bead.
2.
Product Description and Identification (Part Number)
1)
2)
Description:
GZ Series of multi-layer ferrite chip bead.
Product Identification (Part Number)
GZ
①
①
GZ
③
※※※※
②
Type
For General Use
Material Code
D, U, E
〇
③
XXX
④
◎
⑤
F
⑥
②
External Dimensions
0603 [0201]
1005 [0402]
1608 [0603]
2012 [0805]
3216 [1206]
(L X W)[mm]
0.6 X 0.3
1.0 X 0.5
1.6 X 0.8
2.0 X 1.25
3.2 X 1.6
⑤
T
Packing
Tape Carrier Package
④
Nominal
Example
300
121
Impedance
Nominal Value
30Ω
120Ω
⑥
HSF Products
Hazardous Substance Free Products
3.
Electrical Characteristics
Please refer to
Appendix A
(Page 7~16).
1)
2)
4.
Operating and storage temperature range (individual chip without packing): -55
℃
~ +125℃.
Storage temperature range (packaging conditions):-10
℃
~+40
℃
and RH 70% (Max.)
Shape and Dimensions
1)
2)
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1, Fig.4-2
and
Table 4-1.
Structure: See
Fig. 4-3
and
Fig. 4-4.
Chip Bead
C
Solder-resist
Land pattern
B
A
B
Fig. 4-2
Unit: mm [inch]
a
0.15±0.05
[.006±.002]
0.25±0.1
[0.010±0.004]
0.3±0.2
[0.012±0.008]
0.5±0.3
[0.020±0.012]
0.5±0.3
[0.020±0.012]
A
0.2~0.3
0.45~0.55
0.60~0.80
0.80~1.20
1.80~2.50
B
0.2~0.3
0.40~0.50
0.60~0.80
0.80~1.20
1.00~1.50
C
0.3~0.35
0.45~0.55
0.60~0.80
0.90~1.60
1.20~2.00
Fig. 4-1
[Table
4-1]
Type
0603
[0201]
1005
[0402]
1608
[0603]
2012
[0805]
3216
[1206]
L
0.6±0.05
[.024±0.002]
1.0±0.15
[0.039±0.006]
1.6±0.15
[0.063±0.006]
2.0 (+0.3, -0.1)
[0.079(+0.012,-0.004)]
3.2±0.2
[0.126±0.008]
W
0.3±0.05
[.012±.002]
0.5±0.15
[0.020±0.006]
0.8±0.15
[0.031±0.006]
1.25±0.2
[0.049±0.008]
1.6±0.2
[0.063±0.008]
T
0.3±0.05
[.012±.002]
0.5±0.15
[0.020±0.006]
0.8±0.15
[0.031±0.006]
0.85±0.2
[0.033±0.008]
0.85±0.2
[0.033±0.008]
Structure of
Electro-plating
T
Sn
④-2
Ferrite
①
Ferrite for Bead Series
②
Internal electrode (Ag)
③
Pull out electrode( Ag)
④-1
Terminal electrode: Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
a
L
a
T
W
Ni
Ag
Fig. 4-4
①
②
③
Fig. 4-3
④
④-1
Sunlord
3)
Specifications for Multi-layer Chip Ferrite Bead
Page 3 of 16
Material Information: See
Table 4-2.
[Table 4-2]
Code
①
②
③
④-1
④-2
Part Name
Ferrite Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ferrite Powder
Silver Paste
Silver Paste
Termination Silver
Composition
Plating Chemicals
5.
Test and Measurement Procedures
5.1 Test Conditions
5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
a.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86kPa to 106kPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86kPa to 106kPa
Inspection Equipment: 20× magnifier
5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
5.2 Visual Examination
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a.
b.
a.
b.
Refer to
Appendix A.
Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A or equivalent.
Test fixture: HP16197A for 0603, HP16192A for 1005/1608/2012/3216.
Test signal: -20dBm or 50mV
c.
a.
b.
c.
Test frequency refers to
Appendix A.
Refer to
Appendix A.
Test equipment (see
Fig.5.3.3-1):
Electric Power, Electric current meter, Thermometer.
Measurement method (see
Fig. 5.3.3-1):
1. Set test current to be 0 mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d.
Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 20℃
against chip initial surface temperature (Ta) (see
Fig. 5.3.3-2)
Thermometer
Electric Power
Electric
Current
R
Meter
Chip
0
Rated current
Fig. 5.3.3-1
Fig. 5.3.3-2
3
5.3.2 Impedance (Z)
5.3.3 Rated Current
Temperature (℃)
+20
Ta
Ir (mA)
Derated Current [A]
e. When operating temperatures exceeding +85℃, derating of
current is necessary for chip ferrite beads for which rated
current is 1000mA over. Please apply the derating curve
shown in chart according to the operating temperature.
2.2
2
1.5
1
0
0
50
85
100
125
150
Operating Temperature[℃]
Sunlord
5.4 Reliability Test
Items
5.4.1
Terminal
Strength
Specifications for Multi-layer Chip Ferrite Bead
Page 4 of 16
Requirements
No removal or split of the termination or other
defects shall occur.
Chip
F
③
Mounting Pad
Glass Epoxy Board
Fig.5.4.1-1
④
②
①
Test Methods and Remarks
Solder the bead to the testing jig (glass epoxy board shown in
Fig. 5.4.1-1)
using eutectic solder. Then apply a force in the
direction of the arrow.
2N force for 0603 series, 5N force for 1005 and 1608 series
10N force for 2012 and 3216 series.
Keep time: 10±1s.
Speed: 1.0mm/s.
Solder the bead to the test jig (glass epoxy board shown in
Fig.
5.4.2-1)
Using a eutectic solder. Then apply a force in the
direction shown
Fig. 5.4.2-2.
②
③
④
Flexure: 2mm.
Pressurizing Speed: 0.5mm/sec.
Keep time: 30 sec.
5.4.2
Resistance
Flexure
to
No visible mechanical damage.
Unit: mm [inch]
Type
0603[0201]
1005[0402]
1608[0603]
2012[0805]
3216[1206]
a
0.25
0.4
1.0
1.2
2.2
b
b
0.8
1.5
3.0
4.0
5.0
Φ4.5
c
0.3
0.5
1.2
1.65
2.0
①
20
R230
10
c
a
100
Fig. 5.4.2-1
5.4.3
Vibration
①
②
No visible mechanical damage.
Impedance change: within ±20%
Cu pad
Solder mask
40
Flexure
45[1.772]
45[1.772]
Fig. 5.4.2-2
①
②
Solder the bead to the testing jig (glass epoxy board
shown in
Fig. 5.4.3-1)
using eutectic solder.
The bead shall be subjected to a simple harmonic motion
having total amplitude of 1.5 mm, the frequency being varied
uniformly between the approximate limits of 10 and 55 Hz.
③
The frequency range from 10 to 55 Hz and return to 10 Hz shall
be traversed in approximately 1 minute. This motion shall be
applied for a period of 2 hours in each 3mutually perpendicular
Glass Epoxy Board
Fig. 5.4.3-1
5.4.4 Dropping
①
②
5.4.5
Temperature
5.4.6
Solderability
No visible mechanical damage.
Impedance change: within ±20%.
directions (total of 6 hours).
Drop chip bead 10 times on a concrete floor from a height of 100 cm.
Impedance change should be within ±20% of
initial value measuring at 20
℃
.
①
②
No visible mechanical damage.
Wetting shall exceed 75% coverage for
0603 series; exceed 95% for others
Temperature range: -55
℃
~ 125℃.
Reference temperature: +20℃.
①
②
③
④
Solder temperture:240±2℃
Duration: 3 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
Solder temperature :260±3℃
Duration: 5 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
5.4.7
Resistance to
Soldering Heat
①
②
③
No visible mechanical damage.
Wetting shall exceed 75% coverage for
0603 series; exceed 95% for others
Impedance change: within ±20%.
①
②
③
④
⑤
Sunlord
5.4.8
Thermal Shock
①
②
Specifications for Multi-layer Chip Ferrite Bead
No mechanical damage.
Impedance change: Within ±20%.
②
125℃
Ambient
Temperature
-55℃
30 min.
20sec. (max.)
①
②
③
①
②
No mechanical damage.
Impedance change: within ±20%.
①
②
③
①
②
No mechanical damage.
Impedance change: Within ±20%.
①
②
③
④
Temperature: -55±2
℃
Duration: 1000
+24
Page 5 of 16
①
Temperature, Time: (See
Fig.5.4.8-1)
-55
℃
for 30±3 min→125
℃
for 30±3min.
Transforming interval: Max. 20 sec.
Tested cycle: 100 cycles.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
30 min.
30 min.
③
④
Fig. 5.4.8-1
5.4.9
Resistance to
Low
Temperature
5.4.10
Resistance to
High
Temperature
5.4.11
Damp Heat
(Steady States)
①
②
No mechanical damage.
Impedance change: within ±20%.
hours.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
Temperature: 125±2℃
Duration: 1000
+24
hours.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
Temperature: 60±2℃
Humidity: 90% to 95% RH.
Duration: 1000
+24
hours.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
5.4.12
Loading Under
Damp Heat
①
②
No visible mechanical damage.
Impedance change: within ±20%.
①
②
③
④
⑤
Temperature: 60±2℃
Humidity: 90% to 95% RH.
Duration: 1000
+24
hours.
Applied current: Rated current.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
Temperature: 125±2℃
Duration: 1000
+24
5.4.13
Loading at High
Temperature
(Life Test)
①
②
No visible mechanical damage.
Impedance change: within ±20%.
①
②
③
④
hours.
Applied current: Rated current.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
6.
Packaging, Storage
6.1 Packaging
Tape Carrier Packaging:
Packaging code: T
a.
b.
Tape carrier packaging are specified in attached figure
Fig.6.1-1~3
Tape carrier packaging quantity please see the following table:
Type
T(mm)
Tape
Quantity
0603[0201]
0.3±0.15
Paper Tape
15K
1005[0402]
0.5±0.15
Paper Tape
10K
1608[0603]
0.8±0.15
Paper Tape
4K
2012[0805]
0.85±0.2
Paper Tape
4K
3216[1206]
0.85±0.2
Paper Tape
3K
(1) Taping Drawings (Unit: mm)
Paper Tape
Top Tape
Paper Tape
Sprocket Hole
Bottom Tape
Chip Cavity
Fig. 6.1-1
Remark:
The sprocket holes are to the right as the tape is pulled toward the user.
FPGA/CPLD
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