Sunlord
Specifications for Multi-layer Chip Ferrite Beads
Page 1 of 10
Sunlord
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Rev.
01
Effective Date
Jul.17,2008
Multi-layer Chip Ferrite Beads
PZ2012D121-3R0TF
Revised]
Changed Contents
New release
SPEC No.: PZ001609
Change reasons
/
Approved By
Hai Guo
【
This SPEC is total 10 pages.
】
【
RoHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address:Sunlord Industrial Park,Dafuyuan Industrial Zone,Guanlan,Shenzhen,China 518110
Tel: 0086-755-82400574
Fax:0086-755-82269029
E-Mail:sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Date:
Restricted
Rejected
Checked By
Re-checked By
Comments:
Sunlord
Specifications for Multi-layer Chip Ferrite Beads
Page 2 of 10
Table of Contents
1.
2.
3.
4.
5.
6.
Scope
Reference Documents
Product Descriptions and Identification (Part Number)
Electrical Characteristics
Shape and Dimensions
Test and Measurement Procedures
6.1 Test Conditions
6.2 Visual Examination
6.3 Electrical Test
6.3.1
6.3.2
6.3.3
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
6.4.6
6.4.7
6.4.8
6.4.9
6.4.10
6.4.11
6.4.12
6.4.13
DC Resistance
Impedance
Rated Current
Teminal Strength
Resistance to Flexure
Vibration
Dropping
Temperature Characteristics
Solderability
Resistance to Soldering Heat
Thermal Shock
Resistance to Low Temperature
Resistance to High Temperature
Damp Heat (Steady State)
Loading Under Dampe Heat
Loading at High Temperature(Life Test)
3
3
3
3
4
4~6
4
4
4~5
4
4
5
5~6
5
5
5
5
5
5
6
6
6
6
6
6
6
6~8
6~7
8
8
8
8
8~9
8
8~9
9~10
9
9
9
10
10
10
6.4 Reliability Test
7.
Packaging Storage and Transportation
7.1 Packaging
7.2 Storage
7.3 Transportation
7.4 General Handing Precautions
7.5 Precautions on Use
8.
Packaging Documents and Marking
8.1 Packaging Documents
8.2 Marking
9.
Recommended Soldering Technologies
9.1 RE-flowing Profile
9.2 Iron Soldering Profile
9.3 Solder Volume
9.4 Attention Regarding PCB Bending
9.5 Cleaning
10. Supplier Information
Sunlord
1.
2.
Specifications for Multi-layer Chip Ferrite Beads
Page 3 of 10
3.
Scope
This specification applies to PZ2012D121-3R0TF of multi-layer ferrite chip beads.
Applied Documents
EIA/IS-759
Multi-layer Chip Bead Qualification Specification.
MIL-STD-202 Test Methods for Electronic and Electrical Chip Parts.
IEC-68
Test Methods for Environmental Testing.
Product Description and Identification (Part Number)
1) Description:
Ferrite Bead,2012,120Ohm@100MHz,0.04Ohm RDC,3000mA
2) Product Identification (Part Number)
PZ
2012
D
121 -3R0 T
F
①
②
③
④
⑤
⑥
⑦
①
PZ
Type
For Large current
Material Code
D
Rate Current
3.0A
HSF Products
Hazardous Substance Free Products
②
④
External Dimensions（L X W） [mm]
2012 [0805]
2.0 X 1.25
③
Nominal Impedance
Example
121
Nominal Value
120Ω
⑤
3R0
⑥
B
T
Packing
Bulk Package
Tape Carrier Package
⑦
4.
Electrical Characteristics
Part Number
PZ2012D121
Impedance (Ω)
120±25%
Z Test Freq.(MHz)
100
DCR (Ω) Max.
0.04
Ir (mA) Max.
3000
Impedance Frequency Characteristics
PZ2012D121
240
180
Impedance(
Ω
)
Z
R
120
60
X
0
1
10
100
1000
Frequency(MHz)
1)
2)
Operating and storage temperature range (individual chip without packing):：-40
℃
to +85
℃
Storage temperature range (packaging conditions):-10
℃
~+40
℃
and RH 70% (Max.)
Sunlord
5.
Specifications for Multi-layer Chip Ferrite Beads
Page 4 of 10
Shape and Dimensions
1) Dimensions and recommended PCB pattern for reflow soldering: See
Fig.5-1, Fig.5-2
and
Table 5-1
2) Structure: See
Fig. 5-3
and
Fig. 5-4
Chip Bead
C
B
Fig. 5-1
[Table
5-1]
T
0.85±0.2
[0.033±0.008]
Structure of
Electro-plating
T
Sn
W
④-2
④-1
Ni
Ag
Fig. 5-4
Ferrite
A
B
Fig. 5-2
a
0.5±0.3
[0.020±0.012]
Unit: mm [inch]
A
B
0.80~
1.20
0.80~
1.20
C
0.90~
1.60
Solder-resist
Land pattern
Type
2012
[0805]
L
2.0 (+0.3, -0.1)
[0.079 (+0.012, -0.004)]
T
W
1.25±0.2
[0.049±0.008]
①
Ferrite for Bead Series
②
Internal electrode (Ag)
③
Pull out electrode( Ag)
④-1
Terminal electrode :Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
a
L
a
①
②
③
Fig. 5-3
④
Material Information
Code
①
②
③
④-1
④-2
6.
Part Name
Ferrite Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ferrite Powder
Silver Paste
Silver Paste
Termination Silver
Composition
Plating Chemicals
Test and Measurement Procedures
6.1 Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65±20%
c. Air Pressure: 86 KPa to 106 KPa
If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 20±2℃
b. Relative Humidity: 65±5%
c. Air Pressure: 86KPa to 106 KPa
6.2 Visual Examination
a. Inspection Equipment: 20 X magnifier
6.3 Electrical Test
6.3.1 DC Resistance (DCR)
a. Refer to Item 4.
b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B
6.3.2 Impedance (Z)
a. Refer to Item 4.
b. Test equipment:High Accuracy RF Impedance /Material Analyzer-HP4291B+16192A
c. Test signal: -20dBm or 50mV
d. Test frequency refers to Item 4.
6.3.3 Rated Current
a. Refer to Item 4.
b. Test equipment (see
Fig.6.3.3-1):
Electric Power, Electric current meter, Thermometer.
Sunlord
c.
Specifications for Multi-layer Chip Ferrite Beads
Page 5 of 10
Measurement method (see
Fig. 6.3.3-1):
1. Set test current to be 0 mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d. Definition of Rated Current(IDC): IDC is direct electric current as chip surface temperature rose just 20
℃
against chip initial surface temperature(Ta). (see
Fig. 6.3.3-2):
Electric Power
Electric
Current Meter
Chip
R
Fig. 6.3.3-1
Thermometer
+20
Ta
0
Rated current
Fig. 6.3.3-2
IDC (mA)
6.4 Reliability Test
Items
6.4.1
Terminal
Strength
Requirements
No removal or split of the termination or
other defects shall occur.
Chip
F
Mounting Pad
Glass Epoxy Board
Fig.6.4.1-1
Test Methods and Remarks
①
Solder the bead to the testing jig (glass
epoxy board shown in
Fig.6.4.1-1)
using eutectic solder.
Then apply a force in the direction of the arrow.
②
10N force for 2012 series.
③
Keep time: 10±1s
④
Speed:1.0mm/s.
6.4.2
Resistance to
Flexure
No visible mechanical damage.
Unit: mm [inch]
Type
2012[0805]
a
1.2
b
4.0
b
c
a
100
Fig.6.4.2-1
c
1.65
Φ4.5
①
Solder the bead to the test jig (glass epoxy board
shown in
Fig.6.4.2-1)
Using a eutectic solder. Then apply a
force in the direction shown
Fig. 6.4.2-2.
②
Flexure: 2mm
③
Pressurizing Speed: 0.5mm/sec.
④
Keep time: 30 sec.
20
10
R230
Flexure
45[1.772]
45[1.772]
Fig.6.4.2-2
①
Solder the bead to the testing jig (glass epoxy board
shown in
Fig.6.4.3-1)
using eutectic solder.
②
The bead shall be subjected to a simple harmonic
motion having total amplitude of 1.5mm, the frequency being
varied uniformly between the approximate limits of 10 and 55
Hz.
③
The frequency range from 10 to 55 Hz and return to 10
Hz shall be traversed in approximately 1 minute. This motion
shall be applied for a period of 2 hours in each 3mutually
perpendicular directions (total of 6 hours)
Drop chip bead 10 times on a concrete floor from a height of
100 cm.
Temperature range:-40
℃
to +85℃
Reference temperature: +20℃
①
Solder temperture:240±2℃
②
Duration: 3 sec.
③
Solder: Sn/3.0Ag/0.5Cu
④
Flux: 25% Resin and 75% ethanol in weight.
6.4.3 Vibration
①
No visible mechanical damage.
②
Impedance change: within ±20%
Cu pad
Solder mask
6.4.4
Dropping
6.4.5
Temperature
6.4.6
Solderability
Glass Epoxy Board
Fig. 6.4.3-1
①
No visible mechanical damage.
②
Impedance change: within ±20%
Impedance change should be within ±20%
of initial value measuring at 20℃.
①
No visible mechanical damage.
②
Wetting shall exceed 95% coverage.
40
stm32/stm8
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