Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 1 of 12
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Revised]
SPEC No.: UPZ09150000
Multi-layer Chip Ferrite Bead
UPZ Series
【
This SPEC is total 12 pages including specifications and appendix.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China
518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Date:
Restricted
Rejected
Checked By
Re-checked By
Comments:
Sunlord
【Version
change history】
Rev.
01
Effective Date
/
Specifications for Multi-layer Chip Ferrite Bead
Page 2 of 12
Changed Contents
New release
Change Reasons
/
Approved By
Hai Guo
Sunlord
1.
Scope
Specifications for Multi-layer Chip Ferrite Bead
Page 3 of 12
This specification applies to UPZ Series of multi-layer ferrite chip bead.
2.
Product Description and Identification (Part Number)
1)
2)
Description:
UPZ Series of Multi-layer ferrite chip bead.
Product Identification (Part Number)
UPZ
①
①
UPZ
※※※※
②
Type
For Ultra Large current
〇
③
XXX
④
□□□
⑤
◎
⑥
②
F
⑦
External Dimensions(L X W) [mm]
1005 [0402]
1608 [0603]
③
Material Code
G, D, E, U
⑤
1R5
3R0
Rate Current
1.5A
3.0A
④
2012 [0805]
1.0 X 0.5
1.65 X 0.8
2.0 X 1.25
Nominal
Example
300
121
Impedance
Nominal Value
30Ω
120Ω
⑥
T
Packing
Tape Carrier Package
⑦
HSF Products
Hazardous Substance Free Products
3.
Electrical Characteristics
Please refer to
Appendix A
(Page 8~12).
1)
2)
Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃
Storage temperature range (packaging conditions): -10
℃
~+40
℃
and RH 70% (Max.)
4.
Shape and Dimensions
1)
2)
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1, Fig.4-2
and
Table 4-1.
Structure: See
Fig. 4-3
and
Fig. 4-4.
Chip Bead
C
Solder-resist
Land pattern
B
A
B
Fig. 4-2
Unit: mm [inch]
Fig. 4-1
Type
1005
[0402]
1608
[0603]
2012
[0805]
L
1.0±0.15
[0.039±0.006]
1.65±0.15
[0.065±0.006]
2.0 (+0.3, -0.1)
[0.079(+0.012,-0.004)]
W
0.5±0.15
[0.020±0.006]
0.8±0.15
[0.031±0.006]
1.25±0.2
[0.049±0.008]
[Table
4-1]
T
0.5±0.15
[0.020±0.006]
0.8±0.15
[0.031±0.006]
0.85±0.2
[0.033±0.008]
a
0.25±0.1
[0.010±0.004]
0.3±0.2
[0.012±0.008]
0.5±0.3
[0.020±0.012]
A
0.45~0.55
0.60~0.80
B
0.40~0.50
0.60~0.80
C
0.45~0.55
0.60~0.80
0.80~1.20
0.80~1.20
0.90~1.60
Structure of
Electro-plating
T
Sn
④-2
Ni
Ag
Fig. 4-4
Ferrite
a
L
a
T
①
Ferrite for Bead Series
②
Internal electrode (Ag)
③
Pull out electrode( Ag)
④-1
Terminal electrode: Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
W
④-1
①
②
③
Fig. 4-3
④
Sunlord
3)
Material Information: See
Table 4-2.
Specifications for Multi-layer Chip Ferrite Bead
[Table 4-2]
Code
①
②
③
④-1
④-2
Part Name
Ferrite Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ferrite Powder
Silver Paste
Silver Paste
Termination Silver Composition
Plating Chemicals
Page 4 of 12
5.
Test and Measurement Procedures
5.1 Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
a.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86kPa to 106kPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86kPa to 106kPa
Inspection Equipment: 20× magnifier
If any doubt on the results, measurements/tests should be made within the following limits:
5.2 Visual Examination
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a.
b.
a.
b.
c.
a.
b.
c.
Refer to
Appendix A.
Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A or equivalent.
Test fixture: HP16192A; Test signal: -20dBm or 50mV
Test frequency refers to
Appendix A.
Refer to
Appendix A.
Test equipment (see
Fig. 5.3.3-1):
Electric Power, Electric current meter, Thermometer.
Measurement method (see
Fig. 5.3.3-1):
1. Set test current to be 0 mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d.
Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature raises just 20
℃
. against chip initial
surface temperature(Ta). (see
Fig. 5.3.3-2):
Thermometer
Electric Power
Electric
Current Meter
Chip
R
Temperature (℃)
5.3.3 Rated Current
5.3.2 Impedance (Z)
+20
Ta
0
Rated current
Ir (mA)
Fig. 5.3.3-1
e.
In operating temperatures exceeding +85℃, derating of
current is necessary for chip ferrite beads for which rated
current is 1000mA and over. Please apply the derating curve
shown in chart according to the operating temperature.
Fig. 5.3.3-2
7
6
5
Derated Current[A]
4
3
2.5
1.7
1.5
1.2
0.8
2
1
0
0
50
85
100
125
150
Operating Temperature[
℃
]
Sunlord
5.4 Reliability Test
Items
5.4.1
Terminal
Strength
Chip
Specifications for Multi-layer Chip Ferrite Bead
Page 5 of 12
Requirements
No removal or split of the termination or other
defects shall occur.
②
F
③
④
Mounting Pad
Glass Epoxy Board
Fig.5.4.1-1
①
Test Methods and Remarks
Solder the bead to the testing jig (glass epoxy board shown in
Fig. 5.4.1-1)
using leadfree solder. Then apply a force in the
direction of the arrow.
5N force for 1005 and 1608 series,
10N force for 2012 series.
Keep time: 10±1s.
Speed: 1.0mm/s.
5.4.2
Resistance
Flexure
to
No visible mechanical damage.
Unit: mm [inch]
Type
1005[0402]
1608[0603]
2012[0805]
a
0.4
1.0
1.2
b
b
1.5
3.0
4.0
Φ4.5
c
0.5
1.2
1.65
①
Solder the bead to the test jig (glass epoxy board shown in
Fig.
5.4.2-1)
Using a leadfree solder. Then apply a force in the
direction shown
Fig. 5.4.2-2.
②
③
④
Flexure: 2mm.
Pressurizing Speed: 0.5mm/sec.
Keep time: 30 sec.
20
R230
Flexure
45[1.772]
45[1.772]
Fig. 5.4.2-2
10
c
a
100
Fig. 5.4.2-1
5.4.3
Vibration
①
②
No visible mechanical damage.
Impedance change: within ±20%.
Cu pad
Solder mask
40
①
②
Solder the bead to the testing jig (glass epoxy board
shown in
Fig. 5.4.3-1)
using leadfree solder.
The bead shall be subjected to a simple harmonic motion
having total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55 Hz.
③
The frequency range from 10 to 55 Hz and return to 10 Hz shall
be traversed in approximately 1 minute. This motion shall be
applied for a period of 2 hours in each 3 mutually perpendicular
Glass Epoxy Board
Fig. 5.4.3-1
5.4.4 Dropping
5.4.5
Temperature
5.4.6
Solderability
①
②
No visible mechanical damage.
Impedance change: within ±20%.
directions (total of 6 hours).
Drop chip bead 10 times on a concrete floor from a height of 100 cm.
Temperature range: -55℃ ~ +125℃.
Reference temperature: +20
℃
.
①
②
③
④
Solder temperature: 240±2
℃
.
Duration: 3 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
Solder temperature: 260±3℃
Duration: 5 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
Temperature, Time: (See
Fig. 5.4.8-1)
-55
℃
for 30±3 min→125
℃
for 30±3min
②
③
④
Transforming interval: Max. 20 sec.
Tested cycle: 100 cycles.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
Impedance change should be within ±20% of
initial value measuring at 20
℃
.
①
②
No visible mechanical damage.
Wetting shall exceed 95% coverage.
5.4.7
Resistance to
Soldering Heat
①
②
③
No visible mechanical damage.
Wetting shall exceed 95% coverage.
Impedance change: within ±20%.
①
②
③
④
⑤
5.4.8
Thermal Shock
①
②
No mechanical damage.
Impedance change: Within ±20%
125℃
30 min.
30 min.
①
Ambient
Temperature
-55℃
30 min.
20sec. (max.)
Fig. 5.4.8-1
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