Sunlord
Specifications for Multi-layer Chip Ferrite Inductor
Page 1 of 14
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Revised]
SPEC No.: SDFL10150000
Multi-layer Chip Ferrite Inductor
SDFL Series
【
This SPEC is total 14 pages including specifications and appendix.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China
518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Date:
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Rejected
Checked By
Re-checked By
Comments:
Sunlord
【Version
change history】
Rev.
01
Effective Date
/
Specifications for Multi-layer Chip Ferrite Inductor
Page 2 of 14
Changed Contents
New release
Change Reasons
/
Approved By
Hai Guo
Sunlord
1.
Scope
Specifications for Multi-layer Chip Ferrite Inductor
Page 3 of 14
This specification applies to SDFL Series of multi-layer ferrite chip inductors.
2.
Product Description and Identification (Part Number)
1)
2)
Description
SDFL series of multi-layer chip ferrite inductors.
Product Identification (Part Number)
SDFL
①
①
SDFL
※※※※
②
Type
Chip Ferrite Inductor
〇
③
XXX
④
□
⑤
◎
⑥
F
⑦
②
External Dimensions (L X W) (mm)
1005 [0402]
1608 [0603]
2012 [0805]
③
Material Code
L, B, P, Q, S, T
④
⑤
K
M
Inductance Tolerance
±10%
±20%
Nominal Inductance
Example
47N
R10
1R0
100
⑥
T
Packing
Tape Carrier Package
⑦
HSF Products
Hazardous Substance Free Products
Nominal Value
0.047μH
0.1μH
1.0μH
10μH
3216 [1206]
1.0 X 0.5
1.6 X 0.8
2.0 X 1.25
3.2 X 1.6
3.
Electrical Characteristics
Please refer to
Appendix A
(Page 9~14).
1)
2)
Operating and storage temperature range (individual chip without packing): -40
℃
~ +85℃
Storage temperature range (packaging conditions): -10
℃
~+40
℃
and RH 70% (Max.)
4.
Shape and Dimensions
1)
2)
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1, Fig.4-2
and
Table 4-1.
Structure: See
Fig. 4-3
and
Fig. 4-4.
Chip inductor
C
Solder-resist
Land pattern
B
A
B
Fig. 4-2
Fig. 4-1
[Table
4-1]
Type
1005
[0402]
1608
[0603]
2012
[0805]
3216
[1206]
L
1.0±0.15
[0.039±0.006]
1.60±0.15
[0.063±0.006]
2.0 (+0.3, -0.1)
[0.079 (+0.012,
-0.004)]
3.2±0.2
[0.126±0.008]
W
0.5±0.15
[0.020±0.006]
0.8±0.15
[0.031±0.006]
1.25±0.2
[0.049±0.008]
1.6±0.2
[0.063±0.008]
T
0.5±0.15
[0.020±0.006]
0.8±0.15
[0.031±0.006]
0.85±0.2[0.033±0.008]
1.25±0.2[0.049±0.008]
0.85±0.2[0.033±0.008]
1.1±0.2[0.043±0.008]
a
0.25±0.1
[0.010±0.004]
0.3±0.2
[0.012±0.008]
0.5±0.3
[0.020±0.012]
0.5±0.3
[0.020±0.012]
A
0.45~0.55
0.60~0.80
Unit: mm [inch]
B
0.40~0.50
0.60~0.80
C
0.45~0.55
0.60~0.80
0.80~1.20
0.80~1.20
0.90~1.60
1.80~2.50
1.00~1.50
1.20~2.00
Note: The details of different thickness for different products see
Appendix A.
Sunlord
Specifications for Multi-layer Chip Ferrite Inductor
Page 4 of 14
Structure of
Electro-plating
T
④-2
Ferrite
T
①
Ferrite for SDFL Series
②
Internal electrode (Ag)
a
L
a
Sn
Ni
Ag
Fig. 4-4
③
Pull out electrode( Ag)
④-1
Terminal electrode :Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
W
④-1
①
②
③
Fig. 4-3
3)
Material Information: See
Table 4-2.
④
[Table 4-2]
Code
①
②
③
④-1
④-2
5.
Part Name
Ferrite Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ferrite Powder
Silver Paste
Silver Paste
Termination Silver Composition
Plating Chemicals
Test and Measurement Procedures
5.1 Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
a.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86kPa to 106kPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86kPa to 106kPa
Inspection Equipment: 20× magnifier
If any doubt on the results, measurements/tests should be made within the following limits:
5.2 Visual Examination
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a.
b.
a.
b.
c.
d.
a.
b.
c.
d.
a.
b.
c.
a.
b.
c.
Refer to
Appendix A.
Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-HP4291B+HP16192A or equivalent.
Test signal: -20dBm or 50mV.
Test frequency refers to
Appendix A.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-HP4291B+HP16192A or equivalent.
Test signal: -20dBm or 50mV.
Test frequency refers to
Appendix A.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-HP4291B+HP16192A or equivalent.
Test signal: -20dBm or 50 mV.
Refer to
Appendix A.
Test equipment (see
Fig.5.3.5-1):
Electric Power, Electric current meter, HP4291B+HP16192A or equivalent.
Measurement method (see
Fig. 5.3.5-1):
1. Measurement conditions of initial inductance L:
Measuring Frequency: 1MHz,
Test Current: 0.047μH~4.7μH, 1mA ; 5.6μH~100μH, 0.1mA.
2. Raising the voltage of the DC power supply, measure the inductance at the various current.
The rated current is the current value at which the inductance will be 5% down compared with the initial inductance value.
Note: In the period of raising voltage, voltage cannot be reduced.
5.3.2 Inductance (L)
5.3.3 Q Factor (Q)
5.3.4 Self-Resonant Frequency (SRF)
5.3.5 Rated Current
Sunlord
d.
Specifications for Multi-layer Chip Ferrite Inductor
Definition of Rated Current (Ir): Ir is direct electric current as inductance L (μH ) decreased just 5%
against initial value (see
Fig. 5.3.5-2).
Electronic Power
Electronic
Current
R
L
Fig. 5.3.5-1
Meter
Chip
C
0
Rated current
HP4291B
+L
0
95% L
0
Page 5 of 14
Ir (mA)
Fig. 5.3.5-2
5.4 Reliability Test
Items
5.4.1
Terminal
Strength
Requirements
No removal or split of the termination or other
defects shall occur.
Chip
F
③
Mounting Pad
5.4.2
Resistance to
Flexure
Type
1005[0402]
1608[0603]
2012[0805]
3216[1206]
a
0.42
1.0
1.2
2.2
b
b
1.5
3.0
4.0
5.0
c
0.5
1.2
1.65
2.0
Φ4.5
R230
Flexure
45[1.772]
45[1.772]
Fig.5.4.2-2
①
②
Solder the inductor to the testing jig (glass epoxy board
shown in
Fig.5.4.3-1)
using leadfree solder.
The inductor shall be subjected to a simple harmonic motion
having total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55 Hz.
③
The frequency range from 10 to 55 Hz and return to 10 Hz shall
be traversed in approximately 1 minute. This motion shall be
applied for a period of 2 hours in each 3mutually perpendicular
directions (total of 6 hours).
Glass Epoxy Board
Fig. 5.4.3-1
5.4.4 Dropping
①
②
③
5.4.5
Temperature
5.4.6
Solderability
No visible mechanical damage.
Inductance change: Within ±10%.
Q factor change: Within ±30%.
Temperature range: -40℃~ +85℃
Reference temperature: +20℃
①
②
③
④
Solder temperature: 240±2℃
Duration: 3sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
Drop chip inductor 10 times on a concrete floor from a height of 100
cm.
②
③
④
Glass Epoxy Board
Fig.5.4.1-1
No visible mechanical damage.
①
Solder the inductor to the test jig (glass epoxy board shown in
Fig.5.4.2-1)
Using a leadfree solder. Then apply a force in the
direction shown
Fig. 5.4.2-2.
Flexure: 2mm.
Pressurizing Speed: 0.5mm/sec.
Keep time: 30 sec.
20
10
④
②
①
Test Methods and Remarks
Solder the inductor to the testing jig (glass epoxy board shown in
Fig.5.4.1-1)
using leadfree solder. Then apply a force in the
direction of the arrow.
5N force for SDFL1005 and 1608 series.
10N force for SDFL2012 and 3216 series.
Keep time: 10±1s.
Speed: 1.0mm/s.
Unit: mm [inch]
c
a
100
Fig.5.4.2-1
5.4.3
Vibration
①
②
③
No visible mechanical damage.
Inductance change: Within ±10%
Q factor change: Within ±30%
Cu pad
Solder mask
Inductance change should be within ±10% of
initial value measuring at 20
℃
.
①
②
No visible mechanical damage.
Wetting shall exceed 95% coverage.
40
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