Gas Discharge Tubes(GDT)
Description
GDT is placed in front of, and in parallel with, sensitive telecom
equipment such as power lines, communication lines, signal
lines and data transmission lines to help protect them from
damage caused by transient surge voltages that may result from
lightning strikes and equipment switching operations. These
devices do not influence the signal in normal operation.
However, in the event of an overvoltage surge, such as a
lightning strike, the GDT switches to a low impedance state and
diverts the energy away from the sensitive equipment.
Our GDT offer a high level of surge protection, a broad voltage
range, low capacitance, and many form factors including new
surface mount devices, which makes them suitable for
applications such as Main Distribution Frame (MDF) modules,
high data-rate telecom applications (e.g. ADSL, VDSL), and
surge protection on power lines. Their low capacitance also
results in less signal distortion. When used in a coordinated
circuit protection solution with PolySwitch devices, they can help
equipment manufacturers meet stringent safety regulatory
standards.
2RD-8 Series
Electrical symbol
Features
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Excellent response to fast rising transients
Stable breakdown voltage
GHz working frequency
8/20μs Impulse current capability: 20KA
Non-Radioactive
Ultra Low capacitance (<1.5pF)
Lead-free and RoHS compliant
UL 497B Recognized: E465335
Size:
Ф8mm*6mm
Storage and operational temperature: -40~+90°C
Applications
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MDF modules
xDSL equipment
RF systems
Antenna
Base stations
Repeaters, Modems
Telephone Interface, Line
cards
l
Data communication
equipment
l
Line test equipment
l
Power supplies
l
Surge protectors, Alarm
systems
Part Number Code
2
R
x
x
x
x
D
-
8
Electrode Numbers
2R: 2 Electrodes
DC Spark-over Voltage
8/20μs Impulse
Current D: 20KA
Lead Type
T: Lead
S: SMD
Product Series
Size:
Ф8mm*6mm
Specifications are subject to change without notice.
Please refer to http://
www.ruilon.com.cn
for current information.
Revised: 2017-04-25
Page:1
Gas Discharge Tubes(GDT)
Electrical Characteristics
2RD-8 Series
Part Number
Life Ratings
Insulation
Capacitance Impulse Discharge AC Discharge
DC
Resistance
@1MHz
Spark-over
3)
Current
Current
1) 2)
Voltage
100V/μS 1KV/μS
@8/20μS
@50Hz 1S
@100V/S
Nominal
Max
Nominal
Max
Max
Min
Max
±5
times 1 time
5 times
V
75±20%
90±20%
150±20%
230±20%
250±20%
300±20%
350±20%
420±20%
470±20%
600±20%
800±20%
V
500
500
500
600
600
750
800
850
900
1000
1300
V
600
600
600
700
700
850
900
950
1000
1200
1400
GΩ
1
1
1
1
1
1
1
1
1
1
1
~60V
~10V
~1.0A
~1.48g
-40~90°C
40/090/21
RUILON
xxx D X
xxx -Nominal voltage
D
-Nominal Impulse Discharge Current
X
-Year of production
DIP
SMD
-Nickel Plated
-Matte-tin plated
pF
1
1
1
1
1
1
1
1
1
1
1
KA
20
20
20
20
20
20
20
20
20
20
20
KA
25
25
25
25
25
25
25
25
25
25
25
A
20
20
20
20
20
20
20
20
20
20
20
Impulse
Spark-over
Voltage
Impulse Life
@10/1000μS
100A
Min
Times
300
300
300
300
300
300
300
300
300
300
300
DIP
2R075TD-8
2R090TD-8
2R150TD-8
2R230TD-8
2R250TD-8
2R300TD-8
2R350TD-8
2R420TD-8
2R470TD-8
2R600TD-8
2R800TD-8
SMD
2R075SD-8
2R090SD-8
2R150SD-8
2R230SD-8
2R250SD-8
2R300SD-8
2R350SD-8
2R420SD-8
2R470SD-8
2R600SD-8
2R800SD-8
Glow Voltage at 10mA........................................................................
Arc Voltage at 1A...............................................................................
Glow to Arc transition Current………………………………………......
Weight…………………………………………………………………......
Operation and storage temperature…………………………………….
Climatic category (IEC 60068-1)………………………………………..
Marking, black………………………………………………………….....
Surface treatment……………………………………………………......
1)
2)
3)
At delivery AQL 0.65 level II, DIN ISO 2859
In ionized mode
Insulation Resistance Measuring Voltage:
75V at DC 25V
90V~150V at DC 50V
Other at DC 100V
Terms in accordance with ITU-T Rec. K.12, IEC 61643-311, GB/T 9043.
Specifications are subject to change without notice.
Please refer to http://
www.ruilon.com.cn
for current information.
Revised: 2017-04-25
Page:2
Gas Discharge Tubes(GDT)
Soldering Parameters - Wave soldering (Thru-Hole Devices)
2RD-8 Series
300
Temperature(
℃
)-Measured bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
10
20
30
40
50
60
70
80
90
0
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Wave Soldering Condition
Temperature Min
Preheat
Temperature Max
Time (Min to Max)
Solder Pot Temperature
Solder Dwell Time
Pb-Free assembly
100°C
150°C
60-180 Seconds
280°C Max
2-5 Seconds
Time(Seconds)
Preheat Time
Dwell Time
Cooling Time
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
T
P
Ramp-up
Critical Zone
T
L
to T
P
Pb - Free assembly
150°C
200°C
60 -180 Seconds
3°C/second max
5°C/second max
217°C
60 -150 Seconds
260 +0/-5°C
10 - 30 Seconds
6°C/second max
8 minutes Max
260°C
-Temperature Min (T
s(min)
)
Preheat
-Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Ramp-down
T
L
T
S(max)
Temperature
Average ramp up rate ( Liquids Temp
T
L
) to peak
T
S(max)
to TL - Ramp-up Rate
T
S(min)
Preheat
Reflow
25
Time to peak temperature
(t 25℃ to peak)
- Temperature (T
L
)
(Liquids)
- Time (min to max) (t
s
)
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Specifications are subject to change without notice.
Please refer to http://
www.ruilon.com.cn
for current information.
Revised: 2017-04-25
Page:5
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