ELECTRONICS
Positive
Thermal
Coefficent
SMD1206 Series
Circuit Protection
System
Specifications are subject to change without notice.
Positive Thermal Coefficent -
SMD1206 Series
Features
1. I(hold): 0.05~2A
2. RoHS compliant, lead-free and halogen-free
3. Fast response to fault currents
4. Low resistance
5. Low-profile
6. Compact design saves board space
7. Compatible with high temperature solders
Applications
1. USB peripherals
2. Disk drives
3. CD-ROMs
4. General electronics
5. Disk drives
6. Set-top-box and HDMI
7. Mobile Internet Device (MID)
8. PDAs / digital cameras
9. Game console port protection
10. Plug and play protection for motherboards and peripherals
11. Mobile phones - battery and port protection
Product Name
S
M
D
1
2
0
6
P
0
0
5
T
F
/
-
-
Surface Mount
Device
Device
Dimensions:
Length/Width
(Unit: 1/100
inch)
Polytronics
Symbol
Current
Rating:0.5A
T: Thin
Version
(Optional)
F: Lead-free
Special
Voltage
Rating
(Optional)
Circuit Protection
System
Specifications are subject to change without notice.
Page:1
Positive Thermal Coefficent -
SMD1206 Series
Dimension
A
B
D
C
Ihold Itrip
Type Number
A
SMD1206P005TF
SMD1206P010TF
SMD1206P020TF
SMD1206P025TF
SMD1206P035TF
SMD1206P050TF
SMD1206P050TF/13.2
SMD1206P075TF
SMD1206P075TF/13.2
SMD1206P100TF
SMD1206P110TF
SMD1206P150TF
SMD1206P200TF
A
Maximum
Time To Trip
Vmax Imax
P
Rmin R1max
dmax
Package Dimensions
(mm)
Package
A
B
C
D
Current A Time s
0.25
0.5
8
8
8
8
8
8
8
8
8
8
8
1.5
1
0.08
0.08
0.1
0.1
0.1
0.2
0.2
0.3
0.3
1
1.5
Vdc
60
60
30
16
6
6
13.2
6
13.2
6
6
6
6
A
100
100
100
100
100
100
100
100
100
100
100
100
100
W
0.4
0.4
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
0.8
0.8
Ω
3.6
1.6
0.35
0.35
0.25
0.15
0.15
0.09
0.09
0.055
0.04
0.04
0.018
Ω
50
15
2.5
2.5
1.3
0.7
0.7
0.5
0.5
0.27
0.18
0.13
0.08
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
min max min max min max min
3
3
3
3
3
3
3
3
3
3
3
3
3
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.8
1.8
1.8
1.8
1.8
0.6
0.6
0.4
0.4
0.4
1.1 0.15
1.1 0.15
0.9 0.15
0.9 0.15
0.9 0.15
0.05 0.15
0.1
0.2
0.25
0.25
0.46
0.5
0.35 0.75
0.5
0.5
0.75
0.75
1
1.1
1.5
2
1
1
1.5
1.5
1.8
2.2
3
3.5
1.8 0.35 0.85 0.15
1.8 0.35 0.85 0.15
1.8
0.3
0.8 0.15
1.8 0.45 1.25 0.15
1.8
1.8
1.8
1.8
0.4
0.4
0.5
0.5
0.8 0.15
0.8 0.15
1.2 0.15
1.2 0.15
Vocabulary
Ihold = Hold current: maximum current device will pass without tripping in 23ºC still air.
Itrip = Trip current: minimum current at which the device will trip in 23 ºC still air.
Vmax = Maximum voltage device can withstand without damage at rated current (I max)
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
Pd typ = Typical power dissipated from device when in the tripped state at 23 ºC still air.
Rmin = Minimum resistance of device in initial (un-soldered) state.
R1max = Maximum resistance of device at 23 ºC measured one hour after tripping or reflow soldering of 260 ºC for 20 sec.
Circuit Protection
System
Specifications are subject to change without notice.
Page:2
Positive Thermal Coefficent -
SMD1206 Series
Thermal Derating Curve
200.00
Percentage of Rated Current
150.00
100.00
50.00
0.00
-40.00
0.00
40.00
80.00
120.00
Device Ambient Temperature (
)
Thermal Derating Chart
Profile Feature
Average Ramp-Up Rate(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
·Recommended reflow methods: IR, vapor phase oven, hot air oven,
N2 environment for lead-free
·Recommended maximum paste thickness is 0.25mm (0.010 inch)
·Devices can be cleaned using standard industry methods and
solvents.
Note 1: All temperature refer to topside of the package, measured on
the package body surface.
Note 2: If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Time 25°C to Peak Temperature
Storage Condition
Pb-Free Assembly
3°C/second
mac.
150°C
200°C
60~180 seconds
+217°C
60~150 seconds
260°C
6°C/second
max.
8 minutes max
0°C~35°C,70%RH
Circuit Protection
System
Specifications are subject to change without notice.
Page:3
Positive Thermal Coefficent -
SMD1206 Series
Tape And Reel Specifications (mm) EIA Tape Component Dimention
Governing Specifications
W
P
0
P
1
P
2
A
0
B
0
B1max
D
0
F
E
1
E
2
min
Tmax
T
1
max
K
0
Leader min.
Trailer min.
Reel Dimensions
A max
N min.
W
1
W
2
max.
178
60
12.4+20,-0.0
18.4
EIA 481-1
12 ± 0.3
4.0 ± 0.10
8.0 ± 0.10
2.0± 0.05
3.5 ± 0.23
5.1 ± 0.15
5.9
1.5+0.1,-0
5.5 ± 0.05
1.75 ± 0.10
10.25
0.6
0.1
0.9 ± 0.15
390
160
P
0
T
Cover tape
A
0
Embossment
E
1
F
W
E
2
D
0
P
2
B
1
K
0
B
0
T
1
P
1
EIA Reel Dimentions
W2(measured at hub)
A
Cover tape
0
N(hub dia.)
W1(measured at hub)
.
Carrier tape
Embossed cavity
Storage And Handling
• Storage conditions : 40°C max, 70% R.H.
• Devices may not meet specified performance
if storage conditions are exceeded.
Circuit Protection
System
Specifications are subject to change without notice.
Page:4
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