Positive Thermal Coefficent
Description
SMD1206-005~200 Series
•
The SMD1206 Series PTC provides surface mount overcurrent protection for applications where space is at
a premium and resettable protection is desired.
Features
• RoHS compliant, lead-free and halogen-free1
• Fast response to fault currents
• Compact design saves board space
• Low resistance
• Low-profile
• Compatible with high emperature solders
Applications
• USB peripherals
• Disk drives
• CD-ROMs
• Plug and play protection for motherboards and peripherals
• Mobile phones - battery and port protection
• Disk drives
• PDAs / digital cameras
• Game console port protection
P
d
max.
(W)
0.4
0.4
0.4
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
0.8
0.8
Electrical Characteristics
Type Number
I
hold
(A)
SMD1206P005TF
SMD1206P010TF
SMD1206P012TF
SMD1206P016TF
SMD1206P020TF
SMD1206P025TF
SMD1206P035TF
SMD1206P050TF
SMD1206P050TF/13.2
SMD1206P075TF
SMD1206P075TF/13.2
SMD1206P100TF
SMD1206P150TF
SMD1206P175TF
SMD1206P200TF
0.05
0.10
0.12
0.16
0.20
0.25
0.35
0.50
0.50
0.75
0.75
1.00
1.50
1.75
2.00
I
trip
(A)
0.15
0.25
0.29
0.37
0.46
0.50
0.75
1.00
1.00
1.50
1.50
1.80
3.00
3.50
3.50
V
max
V
(dc)
60
60
60
30
24
16
6
6
13.2
6
13.2
6
6
6
6
I
max
(A)
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
Maximum Time
To Trip
Current
(A)
0.30
0.5
0.5
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
Resistance
R
min
(Ω)
3.600
1.600
1.600
0.350
0.350
0.250
0.150
0.150
0.150
0.090
0.090
0.055
0.040
0.020
0.018
Time
(Sec.)
1.50
1.00
1.00
0.08
0.08
0.10
0.10
0.10
0.10
0.20
0.20
0.30
0.30
0.50
1.50
R
1max
(Ω)
50.000
15.000
15.000
2.500
2.500
1.300
0.700
0.700
0.700
0.500
0.500
0.270
0.130
0.090
0.080
I
hold
= Hold current: maximum current device will pass without tripping in 23°C still air.
I
trip
= Trip current: minimum current at which the device will trip in 23°C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 23°C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
typ
= Typical resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 23°C measured one hour after tripping or reflow
soldering of 260°C for 20 sec.
1
Positive Thermal Coefficent
SMD1206-005~200 Series
A
1.0 ± 0.1
1.0 ± 0.1
1.9 ± 0.1
2.0 ± 0.1
D
E
C
B
Thermal Derating Curv e
Derating Curves for nSMD Series
Percentage of Derated
Current
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
Typical Time-To-Trip At 25° C
100
10
1
0.1
0.01
0.001
0.1
1
10
x
Average Time Current Curves
A
B
C
D
E
F
0.05A
X. 0.1A
A. 0.25A
B. 0.35A
C. 0.50A
D. 0.75A
E. 1.00A
F. 1.50A
100
Temperature (°C)
Time In Seconds
Current In Amperes
K. 2.00A
3
Positive Thermal Coefficent
SMD1206-005~200 Series
Recommended Solder Reflow Conditions
300
250
200
190
160
100
0
Preheating
Soldering
Cooling
Temperature(°C)
•Recommended
reflow methods：IR, vapor phase oven, hot air oven.
•Devices
are not designed to be wave soldered to the bottom side
of the board.
•Recommended
maximum paste thickness is 0.25 mm (0.010 inch).
•Devices
can be cleaned using standard method and solvents.
Note：If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
30-90
60-120
sec.
sec.
30-60
10-20
sec.
120
sec.
Tape And Reel Specifications (mm)
Governing Specifications
W
P
0
P
1
P
2
A
0
B
0
B
1
max.
D
0
F
E
1
E
2
min.
Tmax.
T
1
max.
K
0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W
1
W2
EIA 481-1
8.15 ± 0.3
4.0 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
1.95 ± 0.10
3.45 ± 0.10
4.35
1.5 + 0.1, -0
3.5 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
1.04 ± 0.1
390
160
178
60
9 ± 0.5
12.6 ± 0.5
EIA Tape Component Dimentions
P
0
T
Cover tape
A
0
Embossment
E
1
F
W
E
2
D
0
P
2
B
1
K
0
B
0
T
1
P
1
EIA Reel Dimentions
W2(measured at hub)
A
Cover tape
Carrier tape
Embossed cavity
0
N(hub dia.)
W1(measured at hub)
Storage And Handling
•
Storage conditions：40°C max, 70% R.H.
•
Devices may not meet specified performance
if storage conditions are exceeded.
Order Information
SMD1206½
Product name
Size 3216 mm / 1206 mils
SMD：surface mount device
Tape & reel packaging per EIA481-1
075
Hold
Current
0.75A
Packaging
Tape & Reel Quantity
005,010,012,150,200
020,025,035,050,075,100
3,500 pcs/reel
5,000 pcs/reel
4
电子竞赛
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
