No. 24-1 Industry E. Rd. IV,
Hsinchu Science Park, Hsinchu 300, Taiwan
TEL: +886-3-5643931 FAX: +886-3-5644624
Polymeric PTC Resistor
Product: SMD0805P002TF
Revision: Preliminary 0.4
Date: May 30, 2019
Page: 1 of 5
Device Specification (Preliminary)
ELECTRICAL CHARACTERISTICS
Part Number
SMD0805P002TF
I
trip
I
hold
(A)
0.02
I
trip
(A)
0.06
V
max
(Vdc)
60
I
max
(A)
40
P
d typ.
(W)
0.5
Maximum
Time To Trip
Current Time
(A)
(Sec.)
0.1
1.5
Resistance
R
min
(Ω)
12.00
R
1max
(Ω)
70.00
Note: I
hold
= Hold current: maximum current device will pass without tripping in 23°C still air.
= Trip current: minimum current at which the device will trip in 23°C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 23°C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 23°C measured one hour after tripping or reflow soldering of 260°C for 20 sec.
*Value specified were determined using the PWB with 0.020”*0.5oz copper traces.
*Customer should verify the device performance in their specified conditions.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
Recognitions: Pending
Marking
Polytronics / Polystar Logo
Figure
A
C
Recommended Pad Layout (mm)
P
▲
Part Identification
Marking
D
E
B
1.20
1.50
1.00
1.00
Note: Polystar is Polytronics’s manufacturing site in China. The Polystar ID marking shall appear on smallest package.
PHYSICAL DIMENSIONS (mm)
Part Number
SMD0805P002TF
A
Min.
2.00
Max.
2.20
Min.
1.20
B
Max.
1.50
Min.
0.75
C
Max.
1.25
Min.
0.20
D
Max.
0.55
Min.
0.05
E
Max.
0.45
◎Specifications
are subject to change without notice.
Thermal Derating Curve
200
150
Percentage of Rated Current
100
50
0
‐40
0
40
80
o
120
Device's Ambient Temperature ( C)
Thermal Derating Chart
Recommended Hold Current (A) at Ambient Temperature (ºC)
Part Number
SMD0805P002TF
Ambient Operation Temperature
-40 ºC
0.030
-20 ºC
0.027
0 ºC
0.024
23 ºC
0.020
40 ºC
0.017
50 ºC
0.016
60 ºC
0.014
70 ºC
0.012
85 ºC
0.010
Average Time-Current Curve
100.000
10.000
Time to Trip (Sec.)
1.000
0.100
0.010
0.001
0.01
0.1
1
10
Fault Current (Amp.)
新竹市科學工業園區工業東四路
24-1
號
No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan.
TEL: +886-3-5643931 FAX: +886-3-5644624
http://www.pttc.com.tw
Page: 2 of 5
2019/05/30 Revision: Pre 0.4
Soldering Parameters
Profile Feature
Average Ramp-Up Rate (Ts
max
to T
P
)
Preheat
-Temperature Min (Ts
min
)
-Temperature Max (Ts
max
)
-Time (Ts
min
to Ts
max
)
Time maintained above:
-Temperature (T
L
)
-Time (t
L
)
Peak Temperature (T
P
)
Time within 5ºC of actual Peak
Temperature (t
P
)
Ramp-Down Rate
Time 25ºC to Peak Temperature
Storage Condition
Pb-Free Assembly
3ºC/second max.
150ºC
200ºC
60-180 seconds
217ºC
60-150 seconds
260ºC
20-40 seconds
6 ºC /second max.
8 minutes max.
0ºC ~35ºC,
≦70%RH
Recommended reflow methods: IR, vapor phase oven, hot air oven, N
2
environment for lead-free
Recommended maximum paste thickness is 0.25mm (0.010 inch)
Devices can be cleaned using standard industry methods and solvents.
Note 1:
All temperature refer to topside of the package, measured on the package body surface.
Note 2:
If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Environmental Specifications
Operating Temperature
Maximum Device Surface
Temperature in Tripped State
Moisture Sensitivity Level
-40ºC to +85
ºC
125ºC
Level 1, J-STD-020C
新竹市科學工業園區工業東四路
24-1
號
No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan.
TEL: +886-3-5643931 FAX: +886-3-5644624
http://www.pttc.com.tw
Page: 3 of 5
2019/05/30 Revision: Pre 0.4
Packaging Quantity and Marking
Recommended Pad Layout (mm.)
1.20
1.50
1.00
1.00
Part Number
SMD0805P002TF
Marking
▲
Quantity
4000
◎
8 mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3)
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material: Matte Tin (Sn))
Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.
Part Number System
SMD 0805 P
□□□
TF
Lead- Free
Holding Current Rating
Polytronics Symbol
Device Dimensions: Length/Width (Unit: 1/100 inch)
Surface Mount Device
新竹市科學工業園區工業東四路
24-1
號
No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan.
TEL: +886-3-5643931 FAX: +886-3-5644624
http://www.pttc.com.tw
Page: 4 of 5
2019/05/30 Revision: Pre 0.4
Tape Specifications: EIA-481 (mm.)
W
F
E
1
D
0
D
1
P
0
P
1
P
2
A
0
B
0
T
K
0
Leader min
.
Trailer min.
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
1.55 ± 0.05
1.00 ± 0.10
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
1.65 ± 0.10
2.35 ± 0.10
0.20 ± 0.10
1.05 ± 0.10
390
160
Reel Dimensions: EIA-481 (mm.)
C
D
H
W
Ø178.0 ± 1.0
Ø60.2 ± 0.5
11.0 ± 0.5
9.0 ± 1.5
Mechanical Stress
PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the
space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and
the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of
mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied.
Chemical Pollutants
Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, and
shall not be used or applied.
Electronic and Thermal Effect
PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature error
condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others,
incorrect pin-connection of a connector) or over-extensive trip events may occur.
PTTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open circuit, in
which case the voltage at such PPTC devices may reach a hazardous level.
Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC
devices.
Conductive material contamination, such as metal particle, may induce shortage, flame or arcing.
Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall
not be used under such circumstances.
General
Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications
will be met.
The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical
procedures and/or conditions non-conformant to those recommended by manufacturer.
Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection to avoid or
minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices.
Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with.
新竹市科學工業園區工業東四路
24-1
號
No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan.
TEL: +886-3-5643931 FAX: +886-3-5644624
http://www.pttc.com.tw
Page: 5 of 5
2019/05/30 Revision: Pre 0.4
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