PRODUCT DATASHEET
A72 Series PTC Devices
A72 Series PTC Devices
Description
The JDTFUSE A72 Series is designed to provide
overcurrent protection to 72Vdc maximum voltage with
a maximum 40A short circuit rating.
Features
●
72Vdc max voltage w/max 40A short circuit rating
●
RoHS compliant, Lead-Free and HalogenFree*
●
Resettable feature
●
Ideal for a broad range of general electronics using a
low voltage power supply
Agency Approvals
Agency
File Number
E472196
pending
Applications
●
Load protection on wide range of low voltage power
supplies
●
Computers
●
Computers peripherals
●
General electronics
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
Page 1/6
www.jdtfuse.com
A72 Series PTC Devices
Performance Specification
Model
A72-020
A72-025
A72-030
A72-040
A72-050
A72-065
A72-075
A72-090
A72-110
A72-135
A72-160
A72-185
A72-250
A72-300
A72-375
A72-500
V
max
(V dc)
I
max
(A)
I
hold
@25°C
(A)
@25°C
(A)
I
trip
0.40
0.50
0.72
0.80
1.00
1.30
1.50
1.80
2.20
2.70
3.20
3.70
5.00
6.00
7.50
10.0
Typ.
(W)
P
d
Maximum
Time To Trip
Current
(A)
Time
(Sec)
( )
Resistance
R
i min
1.25
0.65
0.45
0.40
0.35
0.25
0.25
0.20
0.15
0.12
0.09
0.08
0.04
0.03
0.02
0.02
R
1max
( )
72
72
72
72
72
72
72
72
72
72
72
72
72
72
72
72
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
0.20
0.25
0.30
0.40
0.50
0.65
0.75
0.90
1.10
1.35
1.60
1.85
2.50
3.00
3.75
5.00
0.41
0.45
0.49
0.56
0.77
0.88
0.92
0.99
1.50
1.70
1.90
2.10
2.50
2.80
3.20
3.20
1.00
1.25
1.50
2.00
2.50
3.25
3.75
4.50
5.50
6.75
8.00
9.25
12.50
15.00
18.75
18.75
2.2
2.5
3.0
3.8
4.0
5.3
6.3
7.2
8.2
9.6
11.4
12.6
15.6
19.8
24.0
24.0
4.40
3.00
2.10
1.29
1.17
0.72
0.62
0.49
0.40
0.32
0.24
0.21
0.13
0.10
0.08
0.08
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Vibration
Conditions
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Resistance to solvent
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
JDT FUSE Industrial Corp.
Page 2/6
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A72 Series PTC Devices
Thermal Derating Curve
Derating Curves for A72 Series
180
160
Percentage of Rated Current
140
120
100
80
60
40
20
-40 -30 -20
-10
0
10
20
30
40
50
60
70
80
Temperature (°C )
Average Time-Current Curve
1000
0.200A
0.250A
0.300A
0.400A
0.500A
0.650A
0.750A
0.900A
1.10A
1.35A
1.60A
1.85A
2.50A
3.00A
3.75A
5.00A
100
TIME IN SECOND
10
1
0.1
0.01
0.1
1
10
100
CURRENT IN AMPERES
JDT FUSE Industrial Corp.
Page 3/6
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A72 Series PTC Devices
I
hold
Versus Temperature
Model
A72-020
A72-025
A72-030
A72-040
A72-050
A72-065
A72-075
A72-090
A72-110
A72-135
A72-160
A72-185
A72-250
A72-300
A72-375
A72-500
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.31
0.39
0.47
0.62
0.78
1.01
1.16
1.40
1.71
2.09
2.48
2.87
3.88
4.65
5.81
6.59
0.27
0.34
0.41
0.54
0.68
0.88
1.02
1.22
1.50
1.84
2.18
2.52
3.40
4.08
5.10
5.78
0.24
0.30
0.36
0.48
0.60
0.77
0.89
1.07
1.31
1.61
1.90
2.20
2.98
3.57
4.46
5.15
0.20
0.25
0.30
0.40
0.50
0.65
0.75
0.90
1.10
1.35
1.60
1.85
2.50
3.00
3.75
4.50
0.16
0.20
0.24
0.32
0.41
0.53
0.61
0.73
0.89
1.09
1.30
1.50
2.03
2.43
3.04
3.64
0.14
0.18
0.22
0.29
0.36
0.47
0.54
0.65
0.79
0.97
1.15
1.33
1.80
2.16
2.70
3.00
0.13
0.16
0.19
0.25
0.32
0.41
0.47
0.57
0.69
0.85
1.01
1.17
1.58
1.89
2.36
2.65
0.11
0.14
0.16
0.22
0.27
0.35
0.41
0.49
0.59
0.73
0.86
1.00
1.35
1.62
2.03
2.42
0.08
0.10
0.12
0.16
0.20
0.26
0.30
0.36
0.44
0.54
0.64
0.74
1.00
1.20
1.50
1.60
Soldering Parameters
TP 260
Pre-Heating
1 Minute Min.
Soldering
5Sea.MAX
Gradual
Cooling
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
Pb-Free Assembly
3℃/second mac.
Temperature (°C )
100
25
Time
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
Recommended reflow methods: IR, vapor phase oven, hot
air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods
and solvents.
Note 1:All temperature refer to topside of the package,
measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
JDT FUSE Industrial Corp.
Page 4/6
www.jdtfuse.com
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