PRODUCT DATASHEET
ASMD1812 Series Surface Mount PTC Devices
ASMD1812 Series Surface Mount PTC Devices
Description
The ASMD1812 series provides surface mount
resettable overcurrent protection with holding current
from 0.1A to 3.5A.
This series offers complete portfolio in terms of
holding current and working voltage, and is suitable for
wide range of applications.
Features
●
RoHS compliant and lead-free
●
Low profile
●
Halogen-free
●
Fast response to fault current
●
Compact design saves board space
●
Compatible with high temperature solders
Agency Approvals
Agency
File Number
pending
pending
Applications
●
USB hubs, ports and peripherals
●
Motherboard USB & IEEE 1394 protection
●
Set-top-box and HDMI
●
Optical disk drives
●
Game console port protection
General electronics
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
Page 1/7
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ASMD1812 Series Surface Mount PTC Devices
Performance Specification
Model
ASMD1812-010
ASMD1812-014
ASMD1812-020
ASMD1812-030
ASMD1812-050
ASMD1812-050-30
ASMD1812-050-60
ASMD1812-075
ASMD1812-110
ASMD1812-110-16
ASMD1812-125
ASMD1812-150
ASMD1812-150-16
ASMD1812-160
ASMD1812-200
ASMD1812-260
ASMD1812-300
ASMD1812-350
V
max
(V dc)
I
max
(A)
I
hold
@25°C
(A)
@25°C
(A)
I
trip
0.30
0.34
0.40
0.60
1.00
1.00
1.00
1.50
2.20
2.20
2.50
3.00
3.00
2.80
4.00
5.00
5.00
6.00
Typ.
(W)
P
d
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
2.0
Maximum
Time To Trip
Current
(A)
Time
(Sec)
Resistance
R
i min
(Ω)
R
1max
(Ω)
30.0
60.0
30.0
30.0
15.0
30.0
60.0
13.2
8.0
16.0
16.0
8.0
16.0
8.0
8.0
8.0
8.0
6.0
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.10
0.14
0.20
0.30
0.50
0.50
0.50
0.75
1.10
1.10
1.25
1.50
1.50
1.60
2.00
2.60
3.00
3.50
0.5
1.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
10.0
1.50
0.15
0.02
0.10
0.15
0.15
0.15
0.20
0.30
0.30
0.40
0.50
0.50
1.00
2.00
2.50
4.00
4.00
0.750
0.650
0.350
0.250
0.150
0.150
0.150
0.090
0.050
0.050
0.050
0.040
0.040
0.030
0.020
0.015
0.012
0.008
15.000
6.000
5.000
3.000
1.000
1.000
1.400
0.450
0.250
0.250
0.140
0.160
0.160
0.130
0.100
0.050
0.040
0.030
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
Test
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Conditions
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
JDT FUSE Industrial Corp.
Page 2/7
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
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ASMD1812 Series Surface Mount PTC Devices
Thermal Derating Curve
Derating Curves for ASMD1812 Series
Percentage of Derated Current
160
140
120
100
80
60
40
20
0
-40
-20
0
20
Temperature (°C )
40
60
80
Average Time-Current Curve
100
0.30A
0.50A
TIME IN SECOND
10
0.75A
1.00A
1.25A
1
1.50A
1.85A
2.0A
0.1
2.50A
2.60A
3.00A
0.01
0.1
1
CURRENT IN AMPERES
10
100
3.50A
JDT FUSE Industrial Corp.
Page 3/7
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ASMD1812 Series Surface Mount PTC Devices
Thermal Derading Chart
Model
ASMD1812-010
ASMD1812-014
ASMD1812-020
ASMD1812-030
ASMD1812-050
ASMD1812-075
ASMD1812-110
ASMD1812-110-16V
ASMD1812-125
ASMD1812-150
ASMD1812-150-16V
ASMD1812-160
ASMD1812-200
ASMD1812-260
ASMD1812-300
ASMD1812-350
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.16
0.23
0.29
0.44
0.59
1.10
1.60
1.59
2.00
2.30
2.28
2.10
2.88
3.90
4.15
4.84
0.14
0.19
0.26
0.39
0.57
0.99
1.45
1.44
1.75
2.05
2.03
1.96
2.61
3.42
3.76
4.39
0.12
0.17
0.23
0.35
0.55
0.87
1.28
1.27
1.52
1.77
1.75
1.88
2.25
2.96
3.46
4.04
0.10
0.14
0.20
0.30
0.50
0.75
1.10
1.10
1.25
1.50
1.50
1.60
2.00
2.60
3.00
3.50
0.08
0.12
0.17
0.26
0.45
0.63
0.92
0.92
1.00
1.23
1.21
1.26
1.80
2.33
2.55
2.98
0.07
0.10
0.15
0.23
0.43
0.57
0.83
0.82
0.95
1.09
1.07
1.12
1.66
2.07
2.28
2.66
0.06
0.09
0.14
0.21
0.35
0.49
0.71
0.70
0.90
0.95
0.93
0.98
1.45
1.94
2.01
2.35
0.05
0.08
0.12
0.18
0.30
0.45
0.66
0.64
0.75
0.82
0.79
0.84
1.09
1.35
1.61
1.88
0.03
0.06
0.10
0.15
0.23
0.35
0.52
0.50
0.53
0.61
0.58
0.63
0.80
1.00
1.33
1.55
Soldering Parameters
TP
260
Ramp-up
TP 20~40 S
Critical Zone
TL to TP
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Pb-Free Assembly
3℃/second mac.
TL
217
Tsmax
tL
60~150 s
200
Temperature (°C )
Tsmin
Ramp-down
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Recommended reflow methods: IR, vapor phase oven,
hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods
and solvents.
Note 1:All temperature refer to topside of the package,
measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
JDT FUSE Industrial Corp.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
Page 4/7
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MEMS传感器
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