PRODUCT DATASHEET
Surface Mount PTC Devices
ASMD0805 Series Surface Mount PTC Devices
ASMD0805 Series Surface Mount PTC Devices
Description
The ASMD0805 series provides miniature surface
mount resettable overcurrent protection with holding
current from 0.1A to 1.25A.
This series is suitable for ultra portable applications
where space is at a premium and the device current is
low..
Features
●
RoHS compliant and lead-free
●
Low profile
●
Halogen-free
●
Fast response to fault current
●
Compact design saves board space
●
Compatible with high temperature solders
Agency Approvals
Agency
File Number
pending
pending
Applications
●
Mobile phones and PDAs
●
IC VCC protection
●
Portable MP3 and media player
●
Set-top-box and HDMI
●
Mobile Internet Device (MID)
●
Game console port protection
●
USB peripherals
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
Page 1/7
www.jdtfuse.com
ASMD0805 Series Surface Mount PTC Devices
Performance Specification
Model
ASMD0805-010
ASMD0805-020
ASMD0805-035
ASMD0805-050
ASMD0805-075
ASMD0805-100
ASMD0805-110
ASMD0805-125
V
max
(V dc)
I
max
(A)
I
hold
@25°C
(A)
@25°C
(A)
I
trip
0.30
0.50
0.75
1.00
1.50
1.95
2.20
2.50
Typ.
(W)
P
d
0.5
0.5
0.5
0.5
0.6
0.6
0.6
1.5
Maximum
Time To Trip
Current
(A)
Time
(Sec)
Resistance
R
i min
(Ω)
R
1max
(Ω)
15.0
9.0
6.0
6.0
6.0
6.0
6.0
6.0
100
100
100
100
40
100
100
100
0.10
0.20
0.35
0.50
0.75
1.00
1.10
1.25
0.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
1.50
0.02
0.10
0.10
0.20
0.30
0.30
0.60
1.000
0.650
0.250
0.150
0.090
0.060
0.060
0.030
6.000
3.500
1.200
0.850
0.385
0.230
0.210
0.140
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
Conditions
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
JDT FUSE Industrial Corp.
Page 2/7
www.jdtfuse.com
ASMD0805 Series Surface Mount PTC Devices
Thermal Derating Curve
Percentage of Derated Current
200
150
100
50
0
-40
-20
0
20
40
Temperature (°C )
60
80
Derating Curves for ASMD0805 Series
Average Time-Current Curve
100
0.10A
0.20A
0.35A
1
0.50A
0.75A
0.1
1.00A
1.25A
0.01
0.1
1
CURRENT IN AMPERES
Thermal Derading Chart
Model
ASMD0805-010
ASMD0805-020
ASMD0805-035
ASMD0805-050
ASMD0805-075
ASMD0805-100
ASMD0805-110
ASMD0805-125
JDT FUSE Industrial Corp.
TIME IN SECOND
10
10
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.14
0.28
0.47
0.68
1.00
1.35
1.45
1.65
0.12
0.25
0.44
0.62
0.90
1.25
1.35
1.53
0.11
0.23
0.39
0.55
0.79
1.15
1.20
1.36
0.10
0.20
0.35
0.50
0.75
1.00
1.10
1.25
0.08
0.17
0.30
0.40
0.63
0.82
0.92
1.05
0.07
0.14
0.27
0.37
0.57
0.74
0.84
0.95
0.06
0.12
0.24
0.33
0.53
0.65
0.75
0.85
0.05
0.10
0.20
0.29
0.41
0.55
0.65
0.74
0.03
0.07
0.14
0.23
0.34
0.42
0.52
0.59
Page 3/7
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ASMD0805 Series Surface Mount PTC Devices
Soldering Parameters
TP
260
Ramp-up
TP 20~40 S
Critical Zone
TL to TP
TL
217
Tsmax
tL
60~150 s
200
Temperature (°C )
Tsmin
Ramp-down
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Pb-Free Assembly
3℃/second mac.
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods and solvents.
Note 1:All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
JDT FUSE Industrial Corp.
Page 4/7
www.jdtfuse.com
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