PRODUCT DATASHEET
Surface Mount PTC Devices
ASMD1206 Series Surface Mount PTC Devices
ASMD1206 Series Surface Mount PTC Devices
Description
The ASMD1206 series provides miniature surface
mount overcurrent protection with holding current from
0.05A to 2.0A.
This series is suitable for wide range of applications
in modern electronics where space is limited.
Features
●
RoHS compliant and lead-free
●
Low profile
●
Halogen-free
●
Fast response to fault current
●
Compact design saves board space
●
Compatible with high temperature solders
Agency Approvals
Agency
File Number
pending
pending
Applications
●
Battery PCM
●
Game console port protection
●
USB hubs, ports and peripherals
●
Optical disk drives
●
Set-top-box and HDMI
●
General electronics
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
Page 1/7
www.jdtfuse.com
ASMD1206 Series Surface Mount PTC Devices
Performance Specification
Model
ASMS1206-005
ASMD1206-010
ASMD1206-012
ASMD1206-020
ASMD1206-025
ASMD1206-035
ASMD1206-050
ASMD1206-050-13.2V
ASMD1206-075
ASMD1206-075-16V
ASMD1206-100
ASMD1206-110
ASMD1206-150
ASMD1206-200
V
max
(V dc)
I
max
(A)
I
hold
@25°C
(A)
@25°C
(A)
I
trip
0.15
0.25
0.29
0.46
0.50
0.75
1.00
1.00
1.50
1.50
1.80
2.20
3.00
3.50
Typ.
(W)
P
d
0.4
0.4
0.4
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.8
0.8
Maximum
Time To Trip
Current
(A)
Time
(Sec)
Resistance
R
i min
(Ω)
R
1max
(Ω)
60.0
60.0
60.0
24.0
16.0
16.0
6.0
13.2
6.0
16
6.0
6.0
6.0
6.0
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.05
0.10
0.12
0.20
0.25
0.35
0.50
0.50
0.75
0.75
1.00
1.10
1.50
2.00
0.25
0.50
0.50
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
8.00
1.50
1.00
1.00
0.08
0.08
0.10
0.10
0.10
0.20
0.20
0.30
0.30
0.30
1.50
3.600
1.600
1.600
0.350
0.350
0.250
0.150
0.150
0.090
0.090
0.055
0.050
0.040
0.018
50.000
15.000
15.000
2.700
2.500
1.300
0.700
0.700
0.500
0.500
0.270
0.250
0.130
0.080
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
Conditions
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
JDT FUSE Industrial Corp.
Page 2/7
www.jdtfuse.com
ASMD1206 Series Surface Mount PTC Devices
Thermal Derating Curve
Derating Curves for ASMD1206 Series
Percentage of Derated Current
160
140
120
100
80
60
40
20
0
-40
-20
0
20
Temperature (°C )
40
60
80
Average Time-Current Curve
100
0.05A
0.10A
0.12A
0.20A
0.25A
0.35A
0.50A
0.75A
1.00A
1.10A
1.50A
2.00A
1
CURRENT IN AMPERES
10
TIME IN SECOND
10
1
0.1
0.01
0.1
JDT FUSE Industrial Corp.
Page 3/7
www.jdtfuse.com
ASMD1206 Series Surface Mount PTC Devices
Thermal Derading Chart
Model
ASMD1206-005
ASMD1206-010
ASMD1206-012
ASMD1206-020
ASMD1206-025
ASMD1206-035
ASMD1206-050
ASMD1206-050-13.2V
ASMD1206-075
ASMD1206-075-16V
ASMD1206-100
ASMD1206-110
ASMD1206-150
ASMD1206-200
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.074
0.148
0.18
0.30
0.37
0.50
0.71
0.71
1.14
1.14
1.45
1.60
2.18
2.88
0.066
0.132
0.16
0.26
0.33
0.45
0.64
0.64
1.01
1.01
1.31
1.45
1.94
2.63
0.058
0.116
0.14
0.23
0.29
0.40
0.57
0.57
0.88
0.88
1.15
1.30
1.72
2.34
0.05
0.10
0.12
0.20
0.25
0.35
0.50
0.50
0.75
0.75
1.00
1.10
1.50
2.00
0.0425
0.085
0.10
0.17
0.22
0.30
0.42
0.42
0.65
0.65
0.84
0.95
1.28
1.74
0.0375
0.075
0.09
0.15
0.20
0.27
0.39
0.39
0.59
0.59
0.77
0.80
1.17
1.58
0.035
0.07
0.08
0.14
0.17
0.24
0.35
0.35
0.54
0.54
0.69
0.72
1.06
1.42
0.03
0.06
0.07
0.12
0.15
0.21
0.31
0.31
0.49
0.49
0.61
0.66
0.96
1.17
0.0275
0.055
0.07
0.11
0.12
0.15
0.25
0.25
0.41
0.41
0.48
0.55
0.77
0.93
Soldering Parameters
TP
260
Ramp-up
TP 20~40 S
Critical Zone
TL to TP
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Pb-Free Assembly
3℃/second mac.
TL
217
Tsmax
tL
60~150 s
200
Temperature (°C )
Tsmin
Ramp-down
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Recommended reflow methods: IR, vapor phase oven,
hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods
and solvents.
Note 1:All temperature refer to topside of the package,
measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
JDT FUSE Industrial Corp.
Page 4/7
www.jdtfuse.com
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