Chip Schottky Barrier Rectifier
FM120-L THRU FM1200-L
1.0A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
Features
•
Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Low power loss, high efficiency.
High current capability, l ow forward voltage drop.
High surge capability.
Guardring for overvoltage protection.
Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Compliant to Halogen-free.
Suffix "-AU" for Automotive.
Formosa MS
SMA-L
0.209(5.3)
0.185(4.7)
Package outline
0.012(0.3) Typ.
0.114(2.9)
0.091(2.3)
Mechanical data
•
Epoxy:UL94-V0 rated flame retardant
•
Case : Molded plastic, DO-214AC / SMA-L
•
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.032(0.8) Typ.
0.080(2.0)
0.063(1.6)
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
•
Polarity : Indicated by cathode band
•
Mounting Position : Any
•
Weight : Approximated 0.05 gram
Maximum ratings and Electrical Characteristics
(AT
PARAMETER
Forward rectified current
Forward surge current
See Fig.1
CONDITIONS
T
A
=25
o
C unless otherwise noted)
Symbol
I
O
I
FSM
I
R
R
θJA
R
θJC
C
J
T
STG
-65
68
34
120
+175
MIN.
TYP.
MAX.
1.0
30
0.5
10
O
O
UNIT
A
A
8.3ms single half sine-wave (JEDEC methode)
V
R
= V
RRM
T
J
= 25 C
V
R
= V
RRM
T
J
= 100 C
Junction to ambient
Junction to case
f=1MHz and applied 4V DC reverse voltage
O
O
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
*1
V
RRM
(V)
20
30
40
50
60
80
100
150
200
V
RMS
*2
(V)
14
21
28
35
42
56
70
105
140
mA
C/W
C/W
pF
O
C
SYMBOLS
FM120-L
FM130-L
FM140-L
FM150-L
FM160-L
FM180-L
FM1100-L
FM1150-L
FM1200-L
*3
V
R
(V)
20
30
40
50
60
80
100
150
200
*4
V
F
(V)
Operating
temperature
T
J
, (
O
C)
-55 to +125
*1 Repetitive peak reverse voltage
*2 RMS voltage
0.50
0.70
0.85
0.90
0.92
-55 to +150
*3 Continuous reverse voltage
*4 Maximum forward voltage@I
F
=1.0A
http://www.formosagr.com
TEL:886-755-27188611
FAX:886-755-27188568
Document ID
Issued Date
2008/02/10
Revised Date
2015/06/02
Revision
F
Page.
5
Page 1
DS-121618
Rating and characteristic curves (FM120-L THRU FM1200-L)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
FIG.2-TYPICAL FORWARD
CHARACTERISTICS
1.2
1.0
50
INSTANTANEOUS FORWARD CURRENT,(A)
0.8
FM
0.6
0.4
0.2
0
0
20
40
60
80
10
20
~4
~6
50
0V
~1
80
1
~
50
00
0V
20
1.0
100
120
140
160
180
200
LEAD TEMPERATURE,(°C)
V
3.0
0V
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT,(A)
T
J
=25 C
8.3ms Single Half
Sine Wave
JEDEC method
NUMBER OF CYCLES AT 60Hz
FIG.4-TYPICAL JUNCTION CAPACITANCE
350
300
250
200
150
100
50
0
REVERSE LEAKAGE CURRENT, (mA)
FM
12
0-
L~
FM
14
15
0-
L~
FM
12
00
0-
L
-L
T
J
=25 C
Pulse Width 300us
1% Duty Cycle
0.1
.01
.1
.3
.5
.7
.9
1.1
1.3
1.5
FORWARD VOLTAGE,(V)
FIG.5 - TYPICAL REVERSE
100
CHARACTERISTICS
20V~40V
50V~200V
10
JUNCTION CAPACITANCE,(pF)
1.0
T
J
=
100°C
0.1
T
J
=
25°C
0.01
.01
.05
.1
.5
1
5
10
50
100
0.001
0
20
40
60
80
100
REVERSE VOLTAGE,(V)
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
http://www.formosagr.com
TEL:886-755-27188611
FAX:886-755-27188568
Document ID
Issued Date
2008/02/10
Revised Date
2015/06/02
Revision
F
Page.
5
Page 2
DS-121618
Chip Schottky Barrier Rectifier
FM120-L THRU FM1200-L
Reel packing
PACKAGE
REEL SIZE
REEL
(pcs)
2,000
2,000
COMPONENT
SPACING
(m/m)
4.0
4.0
BOX
(pcs)
20,000
10,000
INNER
BOX
(m/m)
183*155*183
180*180*80
REEL
DIA,
(m/m)
178
178
CARTON
SIZE
(m/m)
382*356*392
440*410*220
Formosa MS
CARTON
(pcs)
160,000
100,000
APPROX.
GROSS WEIGHT
(kg)
15.5
13.0
7"
SMA-L
7"
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5
o
C ~40
o
C Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
Tsmax
TL
Tsmin
Temperature
tS
Preheat
Ramp-down
25
t25
o
C to Peak
Time
3.Reflow soldering
Profile Feature
Average ramp-up rate(T
L
to T
P
)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
s
)
Tsmax to T
L
-Ramp-upRate
Time maintained above:
-Temperature(T
L
)
-Time(t
L
)
Peak Temperature(T
P
)
Time within 5 C of actual Peak
Temperature(t
P
)
Ramp-down Rate
Time 25 C to Peak Temperature
o
o
Soldering Condition
<3 C /sec
150 C
o
200 C
60~120sec
<3 C /sec
217 C
60~260sec
255 C- 0/ + 5 C
10~30sec
<6 C /sec
<6minutes
o
o
o
o
o
o
o
http://www.formosagr.com
TEL:886-755-27188611
FAX:886-755-27188568
Document ID
Issued Date
2008/02/10
Revised Date
2015/06/02
Revision
F
Page.
5
Page 5
DS-121618
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