Dual-Port SRAM, 64KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, QFP100,.63SQ,20 |
| 针数 | 100 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.B |
| Is Samacsys | N |
| 最长访问时间 | 20 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 66 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-PQFP-G100 |
| JESD-609代码 | e3 |
| 长度 | 14 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 100 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装等效代码 | QFP100,.63SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大待机电流 | 0.003 A |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 0.4 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| IDT709289L9PFG | IDT709289L12PFG | IDT709289L7PFG | IDT709289L9PFGI | IDT709289L9PFG8 | |
|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 64KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 | Dual-Port SRAM, 64KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 | Dual-Port SRAM, 64KX16, 18ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 | Dual-Port SRAM, 64KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 | Dual-Port SRAM, 64KX16, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-100 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 | LFQFP, |
| 针数 | 100 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.B | EAR99 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Is Samacsys | N | - | - | N | N |
| 最长访问时间 | 20 ns | - | 18 ns | 20 ns | 20 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 66 MHz | - | 83 MHz | 66 MHz | - |
| I/O 类型 | COMMON | - | COMMON | COMMON | - |
| JESD-30 代码 | S-PQFP-G100 | - | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 |
| JESD-609代码 | e3 | - | e3 | e3 | e3 |
| 长度 | 14 mm | - | 14 mm | 14 mm | 14 mm |
| 内存密度 | 1048576 bit | - | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | - | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 16 | - | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | - | 3 | 3 | 3 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端口数量 | 2 | - | 2 | 2 | - |
| 端子数量 | 100 | - | 100 | 100 | 100 |
| 字数 | 65536 words | - | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | - | 64000 | 64000 | 64000 |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | - | 70 °C | 85 °C | 70 °C |
| 组织 | 64KX16 | - | 64KX16 | 64KX16 | 64KX16 |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | - | LFQFP | LFQFP | LFQFP |
| 封装等效代码 | QFP100,.63SQ,20 | - | QFP100,.63SQ,20 | QFP100,.63SQ,20 | - |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 |
| 电源 | 5 V | - | 5 V | 5 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | - | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大待机电流 | 0.003 A | - | 0.003 A | 0.006 A | - |
| 最小待机电流 | 4.5 V | - | 4.5 V | 4.5 V | - |
| 最大压摆率 | 0.4 mA | - | 0.465 mA | 0.43 mA | - |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 |
| 宽度 | 14 mm | - | 14 mm | 14 mm | 14 mm |
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