* Low power consumption.
* High efficiency.
* Versatile mounting on p.c. board or panel.
* I.C. compatible/low current requirement.
* Popular T-1
diameter.
Part No.
LTL2R3CGK7-132A
Lens
Water Clear
Source Color
GaN Green
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
Part No. : LTL2R3CGK7-132A (FOR MATSUSHITA)
BNS-OD-C131/A4
Page :
1
of
9
Parameter
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
Reverse Voltage
Electrostatic Discharge Threshold(HBM)
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
[1.6mm(.063") From Body]
Seller gives no other assurances regarding the ability of Products to withstand ESD.
Maximum Rating
135
100
30
5
1000
-20
to + 80
-30
to + 100
260 for 5 Seconds
Unit
mW
mA
mA
V
V
Part No. : LTL2R3CGK7-132A (FOR MATSUSHITA)
BNS-OD-C131/A4
Page :
2
of
9
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
I
= 20mA
Note 1,5
Note 2 (Fig.6)
Measurement
@Peak (Fig.1)
Note 3
Luminous Intensity
I
2
V
I
1900
9300
mcd
Viewing Angle
30
deg
Peak Emission Wavelength
510
526
nm
Dominant Wavelength
520
538
nm
Spectral Line Half-Width
35
nm
Forward Voltage
3.8
4.5
V
A
I
= 20mA
V
= 5V
Reverse Current
20
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2.
is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength,
is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. Iv classification code is marked on each packing bag.
5. The Iv guarantee should be added
15% tolerance.
6. Precautions in handling:
When soldering, leave 2mm of minimum clearance from the resin to the soldering point.
Dipping the resin to solder must be avoided.
Correcting the soldered position after soldering must be avoided.
In soldering, do not apply any stress to the lead frame particularly when heated.
When forming a lead, make sure not to apply any stress inside the resin.
Lead forming must be done before soldering.
It is necessary to cut the lead frame at normal temperature.
7. Caution in ESD:
Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic
glove when handling the LED. All devices, equipment and machinery must be properly grounded.
Part No. : LTL2R3CGK7-132A (FOR MATSUSHITA)
BNS-OD-C131/A4
Page : 3
of
9
(25 Ambient Temperature Unless Otherwise Noted)
Part No. : LTL2R3CGK7-132A (FOR MATSUSHITA)
BNS-OD-C131/A4
Page :
4
of
9
* Compatible with radial lead automatic insertion equipment.
* Most radial lead plastic lead lamps available packaged in tape and folding.
* 2.54mm (0.1") straight lead spacing available.
* Folding packaging simplifies handling and testing.
Reel packaging is available by removing suffix “A” on
option.
$
Tape Feed Hole Diameter
Component Lead Pitch
Front to Rear Deflection
Feed Hole to Bottom of Component
Feed Hole to Overall Component Height
Lead Length After Component Height
Feed Hole Pitch
Lead Location
Center of Component Location
Total Tape Thickness
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
Part No. : LTL2R3CGK7-132A (FOR MATSUSHITA)
BNS-OD-C131/A4
D
F
H
H1
H2
L
P
P1
P2
T
W0
W1
W2
W3
3.8
0.149
4.2
0.165
2.3
0.091
3.0
0.118
--
--
2.0
0.078
20.0
0.787
21.0
0.827
28.4
1.118
30.0
1.181
W0
11.0
0.433
12.4
0.488
13.0
0.511
4.4
0.173
5.8
0.228
5.05
0.198
7.65
0.301
--
--
0.90
0.035
8.5
0.334
9.75
0.384
14.5
0.571
15.5
0.610
0
0
3.0
0.118
17.5
0.689
19.0
0.748
Page : 5
of
9
综合技术交流
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
