Microprocessor Circuit, ROHS COMPLIANT, QFN-48
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFN |
| 包装说明 | ROHS COMPLIANT, QFN-48 |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| JESD-30 代码 | S-XQCC-N48 |
| JESD-609代码 | e3 |
| 长度 | 7 mm |
| 湿度敏感等级 | 3 |
| 端子数量 | 48 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 | 3.465 V |
| 最小供电电压 | 3.135 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| 92HD83C1C5NLGXYYX8 | 92HD83C1C5NLGXYYX | 92HD83C1C5NLGXUAX8 | 92HD83C1X5NLGXUAX8 | 92HD83C1X5NLGXYYX8 | 92HD83C1X5NLGXYYX | |
|---|---|---|---|---|---|---|
| 描述 | Microprocessor Circuit, ROHS COMPLIANT, QFN-48 | Microprocessor Circuit, ROHS COMPLIANT, QFN-48 | Microprocessor Circuit | Microprocessor Circuit | Microprocessor Circuit, ROHS COMPLIANT, QFN-48 | Microprocessor Circuit, ROHS COMPLIANT, QFN-48 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 包装说明 | ROHS COMPLIANT, QFN-48 | ROHS COMPLIANT, QFN-48 | QFN-48 | QFN-48 | HVQCCN, | HVQCCN, |
| Reach Compliance Code | compliant | compliant | unknown | unknown | compliant | compliant |
| JESD-30 代码 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | MATTE TIN | MATTE TIN | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| 是否无铅 | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 |
| 零件包装代码 | QFN | QFN | - | - | QFN | QFN |
| 针数 | 48 | 48 | - | - | 48 | 48 |
| 峰值回流温度（摄氏度） | 260 | 260 | - | - | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | - | 30 | 30 |
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