LOW-POWER HEX ECL-to-TTL TRANSLATOR
| SY100S325 | SY100S325JC | SY100S325JCTR | SY100S325FC | |
|---|---|---|---|---|
| 描述 | LOW-POWER HEX ECL-to-TTL TRANSLATOR | LOW-POWER HEX ECL-to-TTL TRANSLATOR | LOW-POWER HEX ECL-to-TTL TRANSLATOR | LOW-POWER HEX ECL-to-TTL TRANSLATOR |
| 厂商名称 | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | - | QCCJ, | QCCJ, | QFF, QFL24,.4SQ |
| Reach Compliance Code | - | compli | compli | compli |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 |
| 最大延迟 | - | 3.7 ns | 3.7 ns | 3.7 ns |
| 接口集成电路类型 | - | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR |
| JESD-30 代码 | - | S-PQCC-J28 | S-PQCC-J28 | S-GQFP-F24 |
| 长度 | - | 11.48 mm | 11.48 mm | 9.78 mm |
| 位数 | - | 1 | 1 | 1 |
| 功能数量 | - | 6 | 6 | 6 |
| 端子数量 | - | 28 | 28 | 24 |
| 输出锁存器或寄存器 | - | NONE | NONE | NONE |
| 输出极性 | - | TRUE | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | - | QCCJ | QCCJ | QFF |
| 封装形状 | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER | CHIP CARRIER | FLATPACK |
| 座面最大高度 | - | 4.57 mm | 4.57 mm | 2.29 mm |
| 最大供电电压 | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | YES | YES |
| 端子形式 | - | J BEND | J BEND | FLAT |
| 端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | QUAD | QUAD | QUAD |
| 宽度 | - | 11.48 mm | 11.48 mm | 9.78 mm |
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