IC GATE NAND 4CH 2-INP 14DIP
参数名称 | 属性值 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | DIP |
包装说明 | DIP, DIP14,.3 |
针数 | 14 |
制造商包装代码 | SOT27-1 |
Reach Compliance Code | compliant |
系列 | 4000/14000/40000 |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e4 |
长度 | 19.025 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | NAND GATE |
最大I(ol) | 0.00036 A |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 260 |
电源 | 5/15 V |
Prop。Delay @ Nom-Sup | 120 ns |
传播延迟(tpd) | 120 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
座面最大高度 | 4.2 mm |
最大供电电压 (Vsup) | 15 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7.62 mm |
HEF4011UBP,652 | 933507920653 | 933507900652 | 933507920652 | HEF4011UBT,653 | HEF4011UBDF | HEF4011UBT | HEF4011UBT-T | HEF4011UBD | |
---|---|---|---|---|---|---|---|---|---|
描述 | IC GATE NAND 4CH 2-INP 14DIP | IC 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, SOT-108-1, SO-14, Gate | 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, PDIP14, PLASTIC, SOT-27-1, DIP-14 | IC 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, SOT-108-1, SO-14, Gate | IC GATE NAND 4CH 2-INP 14SO | IC 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERDIP-14, Gate | IC 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, SO-14, Gate | IC 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, SO-14, Gate | IC 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERDIP-14, Gate |
零件包装代码 | DIP | SOIC | DIP | SOIC | SOIC | DIP | SOIC | SOIC | DIP |
包装说明 | DIP, DIP14,.3 | PLASTIC, SOT-108-1, SO-14 | PLASTIC, SOT-27-1, DIP-14 | PLASTIC, SOT-108-1, SO-14 | SOP, SOP14,.25 | DIP, | SOP, SOP14,.25 | SOP, | DIP, DIP14,.3 |
针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | compliant | unknown | unknown | unknown | compliant | unknown | compliant | unknown | unknow |
系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-GDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-GDIP-T14 |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DIP | SOP | DIP | SOP | SOP | DIP | SOP | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
传播延迟(tpd) | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.2 mm | 1.75 mm | 4.2 mm | 1.75 mm | 1.75 mm | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | YES | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 | - |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - | e4 | e4 | - |
长度 | 19.025 mm | 8.65 mm | 19.025 mm | 8.65 mm | 8.65 mm | - | 8.65 mm | 8.65 mm | - |
负载电容(CL) | 50 pF | - | - | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
最高工作温度 | 85 °C | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
峰值回流温度(摄氏度) | 260 | 260 | NOT APPLICABLE | 260 | 260 | - | 260 | 260 | - |
最大供电电压 (Vsup) | 15 V | - | - | - | 15 V | 15 V | 15 V | 15 V | 15 V |
最小供电电压 (Vsup) | 3 V | - | - | - | 3 V | 3 V | 3 V | 3 V | 3 V |
温度等级 | INDUSTRIAL | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - |
处于峰值回流温度下的最长时间 | 30 | 30 | NOT APPLICABLE | 30 | 30 | - | 30 | 30 | - |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 | - |
湿度敏感等级 | - | 1 | - | 1 | 1 | - | 1 | 1 | - |
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