IC GATE UNIVERSAL 2INP 6-MICRPAK
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) |
| 包装说明 | VSON, SOLCC6,.04,14 |
| 制造商包装代码 | 517DP |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 系列 | AUP/ULP/V |
| JESD-30 代码 | S-PDSO-N6 |
| JESD-609代码 | e4 |
| 长度 | 1 mm |
| 负载电容（CL） | 15 pF |
| 逻辑集成电路类型 | LOGIC CIRCUIT |
| 最大I（ol） | 0.002 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装等效代码 | SOLCC6,.04,14 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.2/3.3 V |
| Prop。Delay @ Nom-Sup | 31 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | YES |
| 座面最大高度 | 0.55 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.9 V |
| 标称供电电压 (Vsup) | 1.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium (Ni/Pd) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.35 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1 mm |
| NC7SV57FHX | NC7SV58P6X | NC7SV58L6X | NC7SV58FHX | NC7SV57P6X | NC7SV57L6X | |
|---|---|---|---|---|---|---|
| 描述 | IC GATE UNIVERSAL 2INP 6-MICRPAK | Logic Gates 2-Input Logic Gate | Logic Gates 2-Input Logic Gate | IC GATE UNIVERSAL 2INP 6-MICRPAK | IC GATE ULP-A UNIV 2INP SC70-6 | IC GATE ULP-A UNIV 2INP 6-MCRPAK |
| Brand Name | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 包装说明 | VSON, SOLCC6,.04,14 | TSSOP, TSSOP6,.08 | VQCCN, SOLCC6,.04,20 | VSON, SOLCC6,.04,14 | TSSOP, TSSOP6,.08 | VQCCN, SOLCC6,.04,20 |
| 制造商包装代码 | 517DP | 419AD | 127EB | 517DP | 419AD | 127EB |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week |
| 系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | S-PDSO-N6 | R-PDSO-G6 | R-XBCC-N6 | S-PDSO-N6 | R-PDSO-G6 | R-XBCC-N6 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 1 mm | 2 mm | 1.45 mm | 1 mm | 2 mm | 1.45 mm |
| 负载电容（CL） | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| 逻辑集成电路类型 | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| 最大I（ol） | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | VSON | TSSOP | VQCCN | VSON | TSSOP | VQCCN |
| 封装等效代码 | SOLCC6,.04,14 | TSSOP6,.08 | SOLCC6,.04,20 | SOLCC6,.04,14 | TSSOP6,.08 | SOLCC6,.04,20 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V |
| Prop。Delay @ Nom-Sup | 31 ns | 31 ns | 31 ns | 31 ns | 31 ns | 31 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | YES | YES | YES | YES | YES | YES |
| 座面最大高度 | 0.55 mm | 1.1 mm | 0.55 mm | 0.55 mm | 1.1 mm | 0.55 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| 标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium (Ni/Pd) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium (Ni/Pd) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 0.35 mm | 0.65 mm | 0.5 mm | 0.35 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | BOTTOM | DUAL | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 1 mm | 1.25 mm | 1 mm | 1 mm | 1.25 mm | 1 mm |
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