EEPROM 8K 1K X 8 16B PAGE 1.8V SER EE IND
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DFN |
| 包装说明 | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 9 weeks |
| 最大时钟频率 (fCLK) | 5 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
| 25AA080DT-I/MNY | 25AA080C-I-SN | 25AA080D-I-MS | 25AA080CT-I-SN | 25AA080C-I-MS | 25AA080D-I/P | 25AA080DT-I/MS | 25AA080D-I/SN | 25LC080C-E/SN | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM 8K 1K X 8 16B PAGE 1.8V SER EE IND | EEPROM 8K 1K X 8 16B PAGE 1.8V SER EE IND | EEPROM 8K 1K X 8 16B PAGE 1.8V SER EE IND | EEPROM 8K 1K X 8 16B PAGE 1.8V SER EE IND | EEPROM 8K 1K X 8 16B PAGE 1.8V SER EE IND | EEPROM 8K 1K X 8 16B PAGE 1.8V SER EE IND | EEPROM 8K 1K X 8 16B PAGE 1.8V SER EE IND | 电可擦除可编程只读存储器 8K 1K X 8 16B PAGE 1.8V SER EE IND | 电可擦除可编程只读存储器 8K 1K X 8 16B PAGE 2.5V SER EE EXT |
| 是否无铅 | 不含铅 | - | - | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | - | - | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DFN | - | - | - | - | DIP | MSOP | SOIC | SOIC |
| 包装说明 | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | - | - | - | - | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | PLASTIC, MSOP-8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
| 针数 | 8 | - | - | - | - | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | - | - | - | - | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 9 weeks | - | - | - | - | 15 weeks | 16 weeks | 15 weeks | 17 weeks |
| 最大时钟频率 (fCLK) | 5 MHz | - | - | - | - | 5 MHz | 5 MHz | 5 MHz | 10 MHz |
| 数据保留时间-最小值 | 200 | - | - | - | - | 200 | 200 | 200 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles | - | - | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-N8 | - | - | - | - | R-PDIP-T8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e4 | - | - | - | - | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | - | - | - | - | 9.271 mm | 3 mm | 4.9 mm | 4.9 mm |
| 内存密度 | 8192 bit | - | - | - | - | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| 内存集成电路类型 | EEPROM | - | - | - | - | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | - | - | - | - | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | - | - | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | - | - | - | - | 8 | 8 | 8 | 8 |
| 字数 | 1024 words | - | - | - | - | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | - | - | - | - | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | SYNCHRONOUS | - | - | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | - | - | - | - | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | - | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 1KX8 | - | - | - | - | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | - | - | - | - | DIP | TSSOP | SOP | SOP |
| 封装等效代码 | SOLCC8,.11,20 | - | - | - | - | DIP8,.3 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | - | - | - | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | - | - | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | - | - | - | - | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | - | - | - | - | NOT APPLICABLE | 260 | 260 | 260 |
| 电源 | 2/5 V | - | - | - | - | 2/5 V | 2/5 V | 2/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | - | - | - | 5.334 mm | 1.1 mm | 1.75 mm | 1.75 mm |
| 串行总线类型 | SPI | - | - | - | - | SPI | SPI | SPI | SPI |
| 最大待机电流 | 0.000001 A | - | - | - | - | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
| 最大压摆率 | 0.005 mA | - | - | - | - | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | - | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | - | - | - | - | 1.8 V | 1.8 V | 1.8 V | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | - | - | - | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | - | - | - | NO | YES | YES | YES |
| 技术 | CMOS | - | - | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | NO LEAD | - | - | - | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | - | - | - | 2.54 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | - | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | - | - | - | NOT APPLICABLE | 40 | 40 | 40 |
| 宽度 | 2 mm | - | - | - | - | 7.62 mm | 3 mm | 3.9 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | - | - | - | - | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE/SOFTWARE | - | - | - | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Base Number Matches | 1 | - | - | - | - | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
