Gate Drivers 3.3-5V 8Ch Cascade Relay Driver
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC20,.16SQ,20 |
针数 | 20 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
内置保护 | TRANSIENT |
驱动器位数 | 8 |
接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码 | S-XQCC-N20 |
JESD-609代码 | e3 |
长度 | 4 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出电流流向 | SINK |
最大输出电流 | 0.15 A |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装等效代码 | LCC20,.16SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3/5 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 2.3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
断开时间 | 1 µs |
接通时间 | 1 µs |
宽度 | 4 mm |
Base Number Matches | 1 |
MAX4821ETP+ | MAX4821EUP- | MAX4821EUP+T | MAX4821EUP-T | MAX4821ETP+T | |
---|---|---|---|---|---|
描述 | Gate Drivers 3.3-5V 8Ch Cascade Relay Driver | Gate Drivers 3.3-5V 8Ch Cascade Relay Driver | Gate Drivers 3.3-5V 8Ch Cascade Relay Driver | Gate Drivers +3.3V/+5V, 8-Channel, Cascadable Relay Drivers with Serial/Parallel Interface | Gate Drivers 3.3-5V 8Ch Cascade Relay Driver |
是否无铅 | 不含铅 | - | 不含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 符合 | - | 符合 | 不符合 | 符合 |
零件包装代码 | QFN | - | TSSOP | TSSOP | QFN |
包装说明 | HVQCCN, LCC20,.16SQ,20 | - | HTSSOP, LCC20,.16SQ,20 | 4.40 MM, MO-153ACT, TSSOP-20 | HVQCCN, LCC20,.16SQ,20 |
针数 | 20 | - | 20 | 20 | 20 |
Reach Compliance Code | compliant | - | compliant | not_compliant | compliant |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 6 weeks | - | 6 weeks | 1 week | 12 weeks |
内置保护 | TRANSIENT | - | TRANSIENT | TRANSIENT | TRANSIENT |
驱动器位数 | 8 | - | 8 | 8 | 8 |
接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码 | S-XQCC-N20 | - | R-PDSO-G20 | R-PDSO-G20 | S-XQCC-N20 |
JESD-609代码 | e3 | - | e3 | e0 | e3 |
长度 | 4 mm | - | 6.5 mm | 6.5 mm | 4 mm |
湿度敏感等级 | 1 | - | 1 | 1 | 1 |
功能数量 | 1 | - | 1 | 1 | 1 |
端子数量 | 20 | - | 20 | 20 | 20 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
输出电流流向 | SINK | - | SINK | SINK | SINK |
最大输出电流 | 0.15 A | - | 0.15 A | 0.15 A | 0.15 A |
封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | HVQCCN | - | HTSSOP | TSSOP | HVQCCN |
封装等效代码 | LCC20,.16SQ,20 | - | LCC20,.16SQ,20 | TSSOP20,.25 | LCC20,.16SQ,20 |
封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | - | 260 | 245 | 260 |
电源 | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | 3.3/5 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | - | 1.1 mm | 1.1 mm | 0.8 mm |
最大供电电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | YES | YES |
技术 | BICMOS | - | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN | - | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | TIN |
端子形式 | NO LEAD | - | GULL WING | GULL WING | NO LEAD |
端子节距 | 0.5 mm | - | 0.65 mm | 0.65 mm | 0.5 mm |
端子位置 | QUAD | - | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
断开时间 | 1 µs | - | 1 µs | 1 µs | 1 µs |
接通时间 | 1 µs | - | 1 µs | 1 µs | 1 µs |
宽度 | 4 mm | - | 4.4 mm | 4.4 mm | 4 mm |
厂商名称 | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
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