A/D Converter (With 4-channel Input at 12-bit Resolution)
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | FUJITSU(富士通) |
零件包装代码 | SOIC |
包装说明 | LSSOP, TSSOP16,.25 |
针数 | 16 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
最大模拟输入电压 | 5.5 V |
最小模拟输入电压 | |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G16 |
长度 | 5 mm |
最大线性误差 (EL) | 0.0488% |
模拟输入通道数量 | 4 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LSSOP |
封装等效代码 | TSSOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3/5.5 V |
认证状态 | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 1.45 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4.4 mm |
MB88101APFV | MB88101A | MB88101AP | MB88101A_03 | MB88101APF | |
---|---|---|---|---|---|
描述 | A/D Converter (With 4-channel Input at 12-bit Resolution) | A/D Converter (With 4-channel Input at 12-bit Resolution) | A/D Converter (With 4-channel Input at 12-bit Resolution) | A/D Converter (With 4-channel Input at 12-bit Resolution) | A/D Converter (With 4-channel Input at 12-bit Resolution) |
是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 |
厂商名称 | FUJITSU(富士通) | - | FUJITSU(富士通) | - | FUJITSU(富士通) |
零件包装代码 | SOIC | - | DIP | - | SOIC |
包装说明 | LSSOP, TSSOP16,.25 | - | DIP, DIP16,.3 | - | SOP, SOP16,.3 |
针数 | 16 | - | 16 | - | 16 |
Reach Compliance Code | compli | - | compli | - | compli |
ECCN代码 | EAR99 | - | EAR99 | - | EAR99 |
最大模拟输入电压 | 5.5 V | - | 5.5 V | - | 5.5 V |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G16 | - | R-PDIP-T16 | - | R-PDSO-G16 |
长度 | 5 mm | - | 19.55 mm | - | 10.15 mm |
最大线性误差 (EL) | 0.0488% | - | 0.0488% | - | 0.0488% |
模拟输入通道数量 | 4 | - | 4 | - | 4 |
位数 | 12 | - | 12 | - | 12 |
功能数量 | 1 | - | 1 | - | 1 |
端子数量 | 16 | - | 16 | - | 16 |
最高工作温度 | 85 °C | - | 85 °C | - | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | - | -40 °C |
输出位码 | BINARY | - | BINARY | - | BINARY |
输出格式 | SERIAL | - | SERIAL | - | SERIAL |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | LSSOP | - | DIP | - | SOP |
封装等效代码 | TSSOP16,.25 | - | DIP16,.3 | - | SOP16,.3 |
封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | IN-LINE | - | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
电源 | 3.3/5.5 V | - | 3.3/5.5 V | - | 3.3/5.5 V |
认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | - | SAMPLE |
座面最大高度 | 1.45 mm | - | 4.36 mm | - | 2.25 mm |
标称供电电压 | 5 V | - | 5 V | - | 5 V |
表面贴装 | YES | - | NO | - | YES |
技术 | CMOS | - | CMOS | - | CMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL |
端子形式 | GULL WING | - | THROUGH-HOLE | - | GULL WING |
端子节距 | 0.65 mm | - | 2.54 mm | - | 1.27 mm |
端子位置 | DUAL | - | DUAL | - | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
宽度 | 4.4 mm | - | 7.62 mm | - | 5.3 mm |
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