Fail-safe IC with High-side and Relay Driver
| U6813B_05 | U6813B | U6813B-MFPG3Y | |
|---|---|---|---|
| 描述 | Fail-safe IC with High-side and Relay Driver | Fail-safe IC with High-side and Relay Driver | Fail-safe IC with High-side and Relay Driver |
| 是否Rohs认证 | - | 不符合 | 符合 |
| 零件包装代码 | - | SOIC | SOIC |
| 包装说明 | - | SOP, SOP16,.25 | LSOP, SOP16,.25 |
| 针数 | - | 16 | 16 |
| Reach Compliance Code | - | compli | compli |
| ECCN代码 | - | EAR99 | EAR99 |
| 可调阈值 | - | NO | NO |
| 模拟集成电路 - 其他类型 | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | e0 | e3 |
| 长度 | - | 9.9 mm | 9.925 mm |
| 信道数量 | - | 2 | 2 |
| 功能数量 | - | 1 | 1 |
| 端子数量 | - | 16 | 16 |
| 最高工作温度 | - | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | LSOP |
| 封装等效代码 | - | SOP16,.25 | SOP16,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | 260 |
| 电源 | - | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified |
| 最大供电电流 (Isup) | - | 15 mA | 15 mA |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V |
| 表面贴装 | - | YES | YES |
| 技术 | - | BIPOLAR | BIPOLAR |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - annealed |
| 端子形式 | - | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | 40 |
| 宽度 | - | 3.8 mm | 3.8 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
