Analog to Digital Converters - ADC Dual 80Msps 14-Bit IF/Baseband ADC
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 68 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.C.3 |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-XQCC-N68 |
| 长度 | 10 mm |
| 模拟输入通道数量 | 1 |
| 位数 | 14 |
| 功能数量 | 2 |
| 端子数量 | 68 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 采样速率 | 80 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10 mm |
| MAX12558ETK-TD | MAX12558ETK-D | MAX12558ETK+ | MAX12558ETK+T | MAX12558ETK+D | |
|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC Dual 80Msps 14-Bit IF/Baseband ADC | Analog to Digital Converters - ADC Dual 80Msps 14-Bit IF/Baseband ADC | IC ADC 14BIT 80MSPS DL 68-TQFN | IC ADC 14BIT 80MSPS DL 68-TQFN | IC ADC 14BIT |
| 是否无铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | QFN | QFN | QFN | QFN |
| 包装说明 | HVQCCN, | HVQCCN, | 10 X 10 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WNND-2, TQFN-68 | QCCN, LCC68,.4SQ,20 | HVQCCN, |
| 针数 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | not_compliant | compliant | compliant | compliant |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | A/D CONVERTER | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-XQCC-N68 | S-XQCC-N68 | S-XQCC-N68 | S-PQCC-N68 | S-XQCC-N68 |
| 位数 | 14 | 14 | 14 | 14 | 14 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | OFFSET BINARY | 2\'S COMPLEMENT BINARY |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | QCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 245 | 260 | NOT SPECIFIED | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
| ECCN代码 | 3A991.C.3 | 3A991.C.3 | EAR99 | - | EAR99 |
| 长度 | 10 mm | 10 mm | 10 mm | - | 10 mm |
| 模拟输入通道数量 | 1 | 1 | 1 | - | 1 |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD |
| 采样速率 | 80 MHz | 80 MHz | 80 MHz | - | 80 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | - | TRACK |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm |
| 宽度 | 10 mm | 10 mm | 10 mm | - | 10 mm |
| JESD-609代码 | - | e0 | e3 | e3 | e3 |
| 湿度敏感等级 | - | 3 | 3 | 3 | 3 |
| 端子面层 | - | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
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