Memory Circuit, 512KX16, CMOS, CQFP68,
参数名称 | 属性值 |
Reach Compliance Code | unknown |
其他特性 | 512K X 16 FLASH IS ALSO AVAILABLE |
JESD-30 代码 | S-CQFP-G68 |
JESD-609代码 | e0 |
内存密度 | 8388608 bit |
内存集成电路类型 | MEMORY CIRCUIT |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 68 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 512KX16 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | SQUARE |
封装形式 | FLATPACK |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子位置 | QUAD |
Base Number Matches | 1 |
5962-9690102HMA | 5962-9690101HMA | 5962-9690101HMC | 5962-9690101HXA | 5962-9690101HXC | 5962-9690102HMC | 5962-9690102HXA | 5962-9690102HXC | |
---|---|---|---|---|---|---|---|---|
描述 | Memory Circuit, 512KX16, CMOS, CQFP68, | Memory Circuit, 512KX16, CMOS, CQFP68, | Memory Circuit, 512KX16, CMOS, CQFP68, | Memory Circuit, 512KX16, CMOS, CHIP66, | Memory Circuit, 512KX16, CMOS, CHIP66, | Memory Circuit, 512KX16, CMOS, CQFP68, | Memory Circuit, 512KX16, CMOS, CHIP66, | Memory Circuit, 512KX16, CMOS, CHIP66, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | 512K X 16 FLASH IS ALSO AVAILABLE | 512K X 16 FLASH IS ALSO AVAILABLE | 512K X 16 FLASH IS ALSO AVAILABLE | 512K X 16 FLASH IS ALSO AVAILABLE | 512K X 16 FLASH IS ALSO AVAILABLE | 512K X 16 FLASH IS ALSO AVAILABLE | 512K X 16 FLASH IS ALSO AVAILABLE | 512K X 16 FLASH IS ALSO AVAILABLE |
JESD-30 代码 | S-CQFP-G68 | S-CQFP-G68 | S-CQFP-G68 | S-CHIP-P66 | S-CHIP-P66 | S-CQFP-G68 | S-CHIP-P66 | S-CHIP-P66 |
JESD-609代码 | e0 | e0 | e4 | e0 | e4 | e4 | e0 | e4 |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 66 | 66 | 68 | 66 | 66 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | NO | NO | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | TIN LEAD | TIN LEAD | GOLD | TIN LEAD | GOLD | GOLD | TIN LEAD | GOLD |
端子形式 | GULL WING | GULL WING | GULL WING | PIN/PEG | PIN/PEG | GULL WING | PIN/PEG | PIN/PEG |
端子位置 | QUAD | QUAD | QUAD | HEX | HEX | QUAD | HEX | HEX |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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