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5962-9690102HMA

产品描述Memory Circuit, 512KX16, CMOS, CQFP68,
产品类别存储    存储   
文件大小171KB,共24页
制造商White Microelectronics
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5962-9690102HMA概述

Memory Circuit, 512KX16, CMOS, CQFP68,

5962-9690102HMA规格参数

参数名称属性值
Reach Compliance Codeunknown
其他特性512K X 16 FLASH IS ALSO AVAILABLE
JESD-30 代码S-CQFP-G68
JESD-609代码e0
内存密度8388608 bit
内存集成电路类型MEMORY CIRCUIT
内存宽度16
功能数量1
端子数量68
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织512KX16
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状SQUARE
封装形式FLATPACK
认证状态Not Qualified
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式GULL WING
端子位置QUAD
Base Number Matches1

5962-9690102HMA相似产品对比

5962-9690102HMA 5962-9690101HMA 5962-9690101HMC 5962-9690101HXA 5962-9690101HXC 5962-9690102HMC 5962-9690102HXA 5962-9690102HXC
描述 Memory Circuit, 512KX16, CMOS, CQFP68, Memory Circuit, 512KX16, CMOS, CQFP68, Memory Circuit, 512KX16, CMOS, CQFP68, Memory Circuit, 512KX16, CMOS, CHIP66, Memory Circuit, 512KX16, CMOS, CHIP66, Memory Circuit, 512KX16, CMOS, CQFP68, Memory Circuit, 512KX16, CMOS, CHIP66, Memory Circuit, 512KX16, CMOS, CHIP66,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
其他特性 512K X 16 FLASH IS ALSO AVAILABLE 512K X 16 FLASH IS ALSO AVAILABLE 512K X 16 FLASH IS ALSO AVAILABLE 512K X 16 FLASH IS ALSO AVAILABLE 512K X 16 FLASH IS ALSO AVAILABLE 512K X 16 FLASH IS ALSO AVAILABLE 512K X 16 FLASH IS ALSO AVAILABLE 512K X 16 FLASH IS ALSO AVAILABLE
JESD-30 代码 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CHIP-P66 S-CHIP-P66 S-CQFP-G68 S-CHIP-P66 S-CHIP-P66
JESD-609代码 e0 e0 e4 e0 e4 e4 e0 e4
内存密度 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
内存集成电路类型 MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
内存宽度 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1
端子数量 68 68 68 66 66 68 66 66
字数 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK FLATPACK FLATPACK IN-LINE IN-LINE FLATPACK IN-LINE IN-LINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES NO NO YES NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 TIN LEAD TIN LEAD GOLD TIN LEAD GOLD GOLD TIN LEAD GOLD
端子形式 GULL WING GULL WING GULL WING PIN/PEG PIN/PEG GULL WING PIN/PEG PIN/PEG
端子位置 QUAD QUAD QUAD HEX HEX QUAD HEX HEX
Base Number Matches 1 1 1 1 1 1 1 1

 
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