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Metal Film MELF Resistor
Specifications Per
•
IEC 115-1 115-2
•
CECC 40101
mm
•
DIN 44061
B
L
D
Features
•
SMD enabled structure
•
Conformal coating against humidity
•
Excellent solderability termination
•
Products meet RoHS requirements and do not contain
substances of very high concern identified by European
Chemicals Agency
Dimensions
Type
MM16
MM204
MM207
MM52
Body Length
(L, mm)
3.52 ± 0.08
3.52 ± 0.08
5.90 ± 0.20
5.90 ± 0.20
Body Diameter
(D, mm)
1.35 ± 0.1
1.35 ± 0.1
2.20 ± 0.1
2.20 ± 0.1
Soldering Spot
(B, mm)
0.6 Min.
0.6 Min.
1.0 Min.
1.0 Min.
Net Weight
Per 1000 pcs
17 grams
17 grams
66 grams
66 grams
General SPeciFicationS
Type
MM16
MM204
MM207
MM52
Power
Rating
At 70°C
1/6W
1/4W
1/3W
1/2W
Maximum
Working
Voltage
200V
200V
300V
300V
Maximum
Overload
Voltage
400V
400V
500V
500V
Minimum
Resistance
0.51Ω
0.51Ω
0.51Ω
0.51Ω
Maximum
Resistance
10MΩ
10MΩ
10MΩ
10MΩ
Resistance
Tolerance
±1%
±2%, ±5%
±1%
±2%, ±5%
±1%
±2%, ±5%
±1%
±2%, ±5%
Standard
Resistance
Values
E-24/E-96
E-24
E-24/E-96
E-24
E-24/E-96
E-24
E-24/E-96
E-24
For zero-ohm jumper, please see ZMM series. For 1m~510mΩ please see cSM series.
Special sizes and specifications available on request.
orDerinG inForMation
Type
MM16
MM204
MM207
MM52
Tolerance
Temperature
Coefficient
Resistance
Value
Packaging
TR3 (3K/reel)
TR6 (6K/reel)
TR10 (10K/reel)
TR2 (2K/reel)
TR6 (6K/reel)
TR10 (10K/reel)
Special Request
(Optional)
F (1%)
G (2%)
J (5%)
TK50
TK100
R875
84K5
1M69
HV (High value)
LV (Low value)
59
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Metal Film MELF Resistor
technical SuMMary
Characteristics
Operating Temperature Range, °C
Temperature Coefficient, PPM / °C
Dielectric Withstanding Voltage, VAC or DC
Insulation Resistance, MΩ
Film Temperature, °C
Voltage Coefficient, PPM / V
-55 ~ +125
±1%, ±2%
±5%
MM16, MM204
MM207, MM52
>10
4
1.2/50us PEAK
1.2/50us PEAK PULSE PULSE
MM16, MM204, MM207
50 pulses at 12-sec 0.5% perm anent change
50 pulses at 12-sec interval for interval for 0.5% perm anent change
Ranges & Limits
±25, ±50
±100
200
500
125
140
MM207, MM52
MM-16P, MM-204P MM-204P
<0.1
MM-16P,
MM52
<0.5
MM16, MM204
<15KΩ
15KΩ ~ 120KΩ
120KΩ ~ 1MΩ
1MΩ ~ 10MΩ
MM-207P, MM-52P
MM-207P, MM-52P
Current Noise, μV / V
PEAK
VOLTAGE (Volt)
PEAK
VOLTAGE (Volt)
<10KΩ
10KΩ ~ 100KΩ
100KΩ ~ 1MΩ
1MΩ ~ 10MΩ
<0.05
<0.2
<1
<3
<0.4
<1.5
<4
Power Derating, Linear
Tin Whisker (JESD201 Temperature Cycling &
High Temp. / Humidity Storage), μm
100% for temp. < 70 °C down to zero at 125°C
<5
RESISTANCE
RESISTANCE VALUE ( ) VALUE ( )
SinGle SurGe PerForMance
SIN GLE SURGE PERFORMANCE
SIN GLE SURGE PERFORMANCE
SurGe Power DeratinG curve
SURGE POWER DERATING
SURGE POWER DERATING CURVE CURVE
0.
0.
Papplicable-Prated
P
surge
Papplicable-Prated
P
surge
MM
M M -1 6 , M M -2 0 4 -1 6 , M M -2 0 4 M M -2 0 7 , M MM M -2 0 7 , M M -5 2
-5 2
Surge Duration
Surge Duration
Surge Duration
Surge Duration
Surge
Surge OFF time OFF time
notes:
•
SINGLE SURGE PERFORMANCE graph is good for NON REPETITIVE applications operating in an ambient temperature of 70°C or less.
For temperatures above 70°C, the graph power must be derated further linearly down to zero at 125°C.
•
To determine applicable surge power in continuous-surge applications:
1. Identify allowable duration and peak power P
surge
of single surge;
2. Determine ratio of surge duration/surge OFF time in application;
3. Calculate P
applicable
backwardly according to Y-axis of SURGE POWER DERATING CURVE.
September 30, 2012
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Metal Film MELF Resistor
PerForMance SPeciFicationS
Characteristics
Test Conditions
IEC 60115-1 4.13
5 seconds 2.5x rated voltage (not over max. overload voltage)
IEC 60115-1 4.25.1
Rated load 1,000 hours with 1.5 hours ON, 0.5 hours OFF, at 70°C
IEC 60115-1 4.24
56 days rated load at 40°C and 93% relative humidity
IEC 60115-1 4.39
1,000 hours at 85°C and 85% relative humidity with 0.1x rated voltage
(not over 100V)
IEC 60115-1 4.37
3.9x rated voltage (not over max. overload voltage) with 0.1s ON, 2.5s OFF for
1,000 cycles
IEC 60115-1 4.18
10 seconds at 260°C solder bath temperature
IEC 60115-1 4.25.3
1,000 hours without load
IEC 60115-1 4.19
-55°C 30minutes, +125°C 30minutes
IEC 60115-1 4.27
•
5 pulses of 1.2/50μs at 44.7x rated voltage (not over 2KV for MM16 & MM204;
not over 4KV for MM207 & MM52) with interval of 12 sec.
•
10 pulses of 10/700μs at 31.6x rated voltage (not over 2KV for MM16 &
MM204; not over 4KV for MM207 & MM52) with interval of 60 sec.
IEC 60115-1 4.40
3 positive & 3 negative discharges with 2KV for MM16 & MM204 or 4KV for
MM207 & MM52 (For continuous surge application please see Surge Performance
paragraph)
IEC 60115-1 4.23
4.23.2 - dry heat: 16 hours 125°C
4.23.3 - damp heat: 24 hours 55°C with 95% relative humidity
4.23.4 - cold: 2 hours -55°C
4.23.5 - negative air pressure: 2 hour 8.5KPa at 25°C
4.23.6 - damp heat cyclic: 5 days 55°C with 95% relative humidity
4.23.7 - DC load: rated voltage at -55°C and 125°C each 1 Min.
MIL-STD-202 Method 208
Solder area covered after 230±5°C/5±0.5 seconds with flux applied
MIL-STD-202 Method 204
Six hours in each parallel and axial direction with a simple harmonic motion
having an amplitude of 1.52mm and 10 to 20,000 Hz.
IEC 60115-1 4.33
Pressing depth 2mm, 3 times
IEC 60115-1 4.35
Needle flame test 10s
Limits
±0.5%
mm
Short Time Overload
Load Life
±1.5%
Load Life In Humidity
±1.5%
Load Life In Humidity
(accelerated mode)
±2%
Periodic Electric
Overload
Resistance To
Soldering Heat
Thermal Endurance
Thermal Shock
±2.5%
±(0.5%+0.05R)
85°C
125°C
5 cycles
1,000 cycles
±(0.25%+0.05R)
±(0.5%+0.05R)
±(0.5%+0.05R)
±(2.5%+0.05R)
Single pulse high
voltage overload
±(0.5%+0.05R)
±(1.5%+0.05R)
Electrostatic discharge
(Human body mode)
±(2.5%+0.05R)
Climatic test
±(1.0%+0.05R)
Solderability
> 95%
Vibration
±(1.0%+0.1R)
Bending test
±(0.5%+0.05R)
Flammability
No burning after 30s
61
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Metal Film MELF Resistor
SuGGeSteD PaD layout
Type
MM16
MM204
MM207
MM52
Soldering Mode
Reflow
Wave
Reflow
Wave
Pad Length
(L, mm, Min.)
1.0
1.2
2.0
2.5
Pad Spacing
(P, mm)
2.0 ± 0.2
2.0 ± 0.2
3.0 ± 0.3
3.0 ± 0.3
Pad Width
(W, mm, Min.)
1.6
1.6
3.0
3.0
For better heat dissipation / lower heat resistance, increase w & l.
cover taPe PeelinG SPeciFication
Recommended peeling force: 50±5gf
September 30, 2012
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62
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