Speech Synthesizer With RCDG, 64.8s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Winbond(华邦电子) |
| 零件包装代码 | DIP |
| 包装说明 | 0.600 INCH, PLASTIC, DIP-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| 商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 36.83 mm |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| 最长读取时间 | 64.8 s |
| 座面最大高度 | 4.83 mm |
| 最大压摆率 | 40 mA |
| 最大供电电压 (Vsup) | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| ISD33060PI | ISD33060E | ISD33120E | ISD33120PI | ISD33120PD | |
|---|---|---|---|---|---|
| 描述 | Speech Synthesizer With RCDG, 64.8s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Speech Synthesizer With RCDG, 62.3s, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28 | Speech Synthesizer With RCDG, 124.5s, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28 | Speech Synthesizer With RCDG, 129.6s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Speech Synthesizer With RCDG, 125.7s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | TSOP | TSOP | DIP | DIP |
| 包装说明 | 0.600 INCH, PLASTIC, DIP-28 | 8 X 13.40 MM, PLASTIC, TSOP1-28 | 8 X 13.40 MM, PLASTIC, TSOP1-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.600 INCH, PLASTIC, DIP-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 36.83 mm | 11.8 mm | 11.8 mm | 36.83 mm | 36.83 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TSOP1 | TSOP1 | DIP | DIP |
| 封装等效代码 | DIP28,.6 | TSSOP28,.53,22 | TSSOP28,.53,22 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最长读取时间 | 64.8 s | 62.3 s | 124.5 s | 129.6 s | 125.7 s |
| 座面最大高度 | 4.83 mm | 1.2 mm | 1.2 mm | 4.83 mm | 4.83 mm |
| 最大压摆率 | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA |
| 最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | NO | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 0.55 mm | 0.55 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 8 mm | 8 mm | 15.24 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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